Personal Information

Biography

Publications

• Public

  Feb-2012

  DOI: 10.1117/12.909689
  Lin, Y, Bachmann, F, Jiang, G, Pfleging, W, Washio, K, Amako, J, Hoving, W & Lu, Y, 2012, '<title>Transient thermal analysis and mechanical strength testing of pulsed laser welded ribbons to feedthru joints</title>', Laser-based Micro- and Nanopackaging and Assembly VI, vol. 8244, pp. 82440U-82440U-11.
• Public

  Feb-2011

  DOI: 10.1117/12.873101
  Lin, Y, Pfleging, W, Jiang, G, Calderon, J, Lu, Y & Washio, K, 2011, '<title>Laser welding assembling of an implantable bio-medical device: investigation of temperature field</title>', Laser-based Micro- and Nanopackaging and Assembly V, vol. 7921, pp. 79210A-79210A-11.
• Public

  Jun-2003

  DOI: 10.1117/12.475471
  Lin, Y, Heyler, R, Shi, F, Robbins, D & Jabbour, G, 2003, '<title>Effect of welding sequence on laser-welding-induced alignment distortion in butterfly laser diode module packages</title>', Photonics Packaging and Integration III, vol. 4997, pp. 30-39.
• Public

  Jun-2002

  DOI: 10.1117/12.469560
  Liu, W, Eldada, L, Lin, Y, Shi, F, Heyler, R & Rowlette, Sr., J, 2002, '<title>Welding-induced alignment distortion in DIP LD packages: effect of laser welding sequence</title>', Optoelectronic Interconnects, Integrated Circuits, and Packaging, vol. 4652, pp. 128-135.
• Public

  A novel assembling technique for fiber collimator arrays using UV-curable adhesives

  DOI: 10.1109/TADVP.2002.807602
  Hong Zhou, Wenning Liu, Yaomin Lin, Mondal, S & Shi, F, 2002, 'A novel assembling technique for fiber collimator arrays using UV-curable adhesives', vol. 25, no. 4, pp. 481-487.
• Public

  Adhesive joint design for high yield and low cost assembly of fiberoptic devices

  DOI: 10.1109/ECTC.2002.1008167
  Yaomin Lin, Wenning Liu & Shi, F, 2002, 'Adhesive joint design for high yield and low cost assembly of fiberoptic devices', 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), IEEE, pp. 662-666.
• Public

  Effect of Welding Sequence on Welding-Induced-Alignment-Distortion in Fiber-Optic Device Packaging: Packaging of Butterfly Laser Diode Module

  DOI: 10.1115/IMECE2004-59484
  Lin, Y, Eichele, C & Shi, F, 2004, 'Effect of Welding Sequence on Welding-Induced-Alignment-Distortion in Fiber-Optic Device Packaging: Packaging of Butterfly Laser Diode Module', Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, vol. 2004, ASME, pp. 147-152.
• Public

  Effect of laser welding sequence on WIAD in packaging of dual-in-line laser modules

  DOI: 10.1109/ISAPM.2005.1432071
  Yaomin Lin & Shi, F, 2005, 'Effect of laser welding sequence on WIAD in packaging of dual-in-line laser modules', Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005., IEEE, pp. 169-172.
• Public

  Effect of welding sequence on welding-induced-alignment-distortion in packaging of butterfly laser diode modules: Simulation and experiment

  DOI: 10.1109/JLT.2004.841780
  Yaomin Lin, Eichele, C & Shi, F, 2005, 'Effect of welding sequence on welding-induced-alignment-distortion in packaging of butterfly laser diode modules: Simulation and experiment', vol. 23, no. 2, pp. 615-623.
• Public

  Nanosecond pulsed laser micromachining for experimental fatigue life study of Ti–3Al–2.5V tubes

  DOI: 10.1016/j.optlaseng.2008.07.008
  Lin, Y, Gupta, M, Taylor, R, Lei, C, Stone, W, Spidel, T, Yu, M & Williams, R, 2009, 'Nanosecond pulsed laser micromachining for experimental fatigue life study of Ti–3Al–2.5V tubes', vol. 47, no. 1, pp. 118-122.
• Public

  Reliability issues of low-cost overmolded flip-chip packages

  DOI: 10.1109/TADVP.2004.841670
  Yaomin Lin, Wenning Liu, Yifan Guo & Shi, F, 2005, 'Reliability issues of low-cost overmolded flip-chip packages', vol. 28, no. 1, pp. 79-88.
• Public

  WIAD Minimization in Butterfly Laser Module Packages: Clip Design

  DOI: 10.1109/TADVP.2007.901528
  Lin, Y, Guo, J, Shapiro, A & Shi, F, 2007, 'WIAD Minimization in Butterfly Laser Module Packages: Clip Design', vol. 30, no. 3, pp. 499-505.
• Public

  Weld clip design for minimization of weldinginduced-alignment-distortion in butterfly laser module packages

  DOI: 10.1109/ISAPM.2005.1432036
  Yaomin Lin & Shi, F, 2005, 'Weld clip design for minimization of weldinginduced-alignment-distortion in butterfly laser module packages', Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005., IEEE, pp. 9-12.

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