Lee, Ricky S W

ORCID iD
orcid.org/0000-0002-7706-522X
  • Also known as
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李世瑋

Sources:
Hong Kong University of Science and Technology (2016-04-28)

  • Country
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Hong Kong SAR China

Sources:
Lee, Ricky S W (2016-04-28)

  • Keywords
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Computational modeling and stress analysis,

Sources:
Hong Kong University of Science and Technology (2016-04-28)

Flip chip technologies and wafer level packaging,

Sources:
Hong Kong University of Science and Technology (2016-04-28)

Lead-free soldering and solder joint reliability,

Sources:
Hong Kong University of Science and Technology (2016-04-28)

Passive alignment of optical fibers and LED packaging,

Sources:
Hong Kong University of Science and Technology (2016-04-28)

Through silicon vias and 3D packaging

Sources:
Hong Kong University of Science and Technology (2016-04-28)

  • Websites
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Homepage

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Hong Kong University of Science and Technology (2016-04-28)

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HKUST Profile: lee-ricky-s-w

Sources:
Hong Kong University of Science and Technology (2016-04-28)

Scopus Author ID: 8425908400

Sources:
Hong Kong University of Science and Technology (2016-04-28)

Scopus Author ID: 7408203713

Sources:
Hong Kong University of Science and Technology (2016-04-28)

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