Personal information
Verified email addresses
Moein.tamizi93@sharif.edu
• Reliability of Packaging Microelectronic Materials, • Micro joining and Soldering, • Additive Manufacturing, • Welding Metallurgy, • Scanning and Transmission Electron Microscopy (particularly EBSD and TEM)
Activities
Education and qualifications (3)
2016-09-20
to
present
|
PhD
(Material Science and Engineering)
Education
Source:
M. Tamizi
2014-09-23
to
2016-09-21
|
M.S.
(Material Science and Engineering)
Education
Source:
M. Tamizi
2010-07-23
to
2014-09-22
|
B.S.
(Material Science and Engineering)
Education
Source:
M. Tamizi
Works (7)
Materials Science and Engineering: A
2024
|
Journal article
EID:
2-s2.0-85184147622
Contributors:
Tamizi, M.;
Movahedi, M.;
Kokabi, A.H.;
Miyashita, Y.
Source:
M. Tamizi
via
Scopus - Elsevier
Journal of Materials Science: Materials in Electronics
2024
|
Journal article
EID:
2-s2.0-85198743708
Contributors:
Azghandi Rad, S.;
Movahedi, M.;
Kokabi, A.H.;
Tamizi, M.
Source:
M. Tamizi
via
Scopus - Elsevier
Journal of Materials Science: Materials in Electronics
2023
|
Journal article
EID:
2-s2.0-85148203865
Contributors:
Tamizi, M.;
Movahedi, M.;
Kokabi, A.H.
Source:
M. Tamizi
via
Scopus - Elsevier
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
2022
|
Journal article
EID:
2-s2.0-85129795380
Contributors:
Tamizi, M.;
Movahedi, M.;
Kokabi, A.H.;
Miyashita, Y.;
Azghandi Rad, S.
Source:
M. Tamizi
via
Scopus - Elsevier
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
2021
|
Journal article
EID:
2-s2.0-85098729662
Contributors:
Tamizi, M.;
Pouranvari, M.;
Movahedi, M.
Source:
M. Tamizi
via
Scopus - Elsevier
Journal of Manufacturing Processes
2019
|
Journal article
EID:
2-s2.0-85068539861
Contributors:
Ozlati, A.;
Movahedi, M.;
Tamizi, M.;
Tartifzadeh, Z.;
Alipour, S.
Source:
M. Tamizi
via
Scopus - Elsevier
Science and Technology of Welding and Joining
2017
|
Journal article
EID:
2-s2.0-84995460889
Contributors:
Tamizi, M.;
Pouranvari, M.;
Movahedi, M.
Source:
M. Tamizi
via
Scopus - Elsevier