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Works (4)

Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish

Materials
2023-02 | Journal article | Author
Contributors: So-Yeon Jun; Jung-Hwan Bang; Min-Su Kim; Deok-Gon Han; Tae-Young Lee; Sehoon Yoo
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Multidisciplinary Digital Publishing Institute

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

Materials
2021-05 | Journal article | Author
Contributors: Junhyuk Son; Dong-Yurl Yu; Yun-Chan Kim; Shin-Il Kim; Min-Su Kim; Dongjin Byun; Jung-Hwan Bang
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Multidisciplinary Digital Publishing Institute

Enhanced Thermo–Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores

Materials
2021-04 | Journal article | Author
Contributors: Y. K. Sa; Jung-Hwan Bang; Junhyuk Son; Dong-Yurl Yu; Yun-Chan Kim
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Multidisciplinary Digital Publishing Institute

Nucleation and Morphology of Cu<sub>6</sub>Sn<sub>5</sub> Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

Metals
2021-01 | Journal article | Author
Contributors: Junhyuk Son; Dong-Yurl Yu; Min-Su Kim; Yong-Ho Ko; Dong-Jin Byun; Jung-Hwan Bang
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Multidisciplinary Digital Publishing Institute