Personal information
Biography
Dr. Cheng received the B.Eng. degree from the Hefei University of Technology, Hefei, China, in 2008, the M.Sc. degree from Fudan University, Shanghai, China, in 2011, and the Ph.D. degree from The Hong Kong University of Science and Technology (HKUST), Hong Kong, in 2016.
In 2018, he joined the School of Microelectronics, University of Science and Technology of China, where he is currently a Professor. He was a PostDoctoral Research Associate with the Department of Electronic and Computer Engineering, HKUST, from 2016 to 2018, and was an Intern Analog Design Engineer with Broadcom Ltd., San Jose, USA, from 2015 to 2016. His current research interests include power management and mixed-signal integrated circuits and systems, wireless power transfer circuits and systems, switched-inductor power converters, and automotive ICs.
Dr. Cheng is currently serving as a TPC Member for the Asian Solid-State Circuits Conference (A-SSCC). He was a recipient of the IEEE Solid-State Circuits Society Pre-Doctoral Achievement Award from 2014 to 2015 and the Hong Kong Institution of Science 2018 Young Scientist Awards (Honorable Mention).
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Works (40)
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