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Works (29)

A real-time monitoring and measurement method for microbubble morphology based on image processing technology

Microchemical Journal
2024 | Journal article
EID:

2-s2.0-85194969319

Part of ISSN: 0026265X
Contributors: Jin, S.; Ye, G.; Guo, Y.; Zhao, Z.; Lu, L.; Liu, Z.; Ding, Z.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

A zinc oxide resonant nano-accelerometer with ultra-high sensitivity

Nature Communications
2024 | Journal article
EID:

2-s2.0-85194996445

Part of ISSN: 20411723
Contributors: Xu, P.; Wang, D.; He, J.; Cui, Y.; Lu, L.; Li, Y.; Chen, X.; Liu, C.; Suo, L.; Ren, T. et al.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

A high frequency SiC nanobeam resonator with ultra-sensitivity

Materials and Design
2023 | Journal article
EID:

2-s2.0-85168557236

Part of ISSN: 18734197 02641275
Contributors: Xu, P.; Wang, D.; Cui, Y.; Zhang, Y.; He, J.; Lu, L.; Li, Y.; Chen, X.; Liu, C.; Li, P. et al.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

A Zinc Oxide Nanobeam Resonator for Ultrasensitivity Mass Detection

Advanced Electronic Materials
2023 | Journal article
EID:

2-s2.0-85156101117

Part of ISSN: 2199160X
Contributors: Wang, D.; Xu, P.; Cui, Y.; Zhang, Y.; He, J.; Lu, L.; Li, Y.; Chen, X.; Liu, C.; Li, P. et al.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Computational Study of Drop-on-Demand Coaxial Electrohydrodynamic Jet and Printing Microdroplets

Micromachines
2023 | Journal article
EID:

2-s2.0-85156102973

Part of ISSN: 2072666X
Contributors: Abbas, Z.; Wang, D.; Lu, L.; Li, Y.; Pu, C.; Chen, X.; Xu, P.; Liang, S.; Kong, L.; Tang, B.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Electrohydrodynamic jet printed bioinspired piezoelectric hair-like sensor for high-sensitivity air-flow detection

Smart Materials and Structures
2023 | Journal article
EID:

2-s2.0-85167873464

Part of ISSN: 1361665X 09641726
Contributors: Wang, D.; Li, Y.; Hu, X.; Lu, L.; Xu, P.; Chen, X.; Liu, C.; Wang, L.; Liu, B.; Suo, L. et al.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

High-performance flexible organic field effect transistors with print-based nanowires

Microsystems and Nanoengineering
2023 | Journal article
EID:

2-s2.0-85161867266

Part of ISSN: 20557434
Contributors: Lu, L.; Wang, D.; Pu, C.; Cao, Y.; Li, Y.; Xu, P.; Chen, X.; Liu, C.; Liang, S.; Suo, L. et al.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Large area polymer semiconductor sub-microwire arrays by coaxial focused electrohydrodynamic jet printing for high-performance OFETs

Nature Communications
2022 | Journal article
EID:

2-s2.0-85140265252

Part of ISSN: 20411723
Contributors: Wang, D.; Lu, L.; Zhao, Z.; Zhao, K.; Zhao, X.; Pu, C.; Li, Y.; Xu, P.; Chen, X.; Guo, Y. et al.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Numerical modeling and analysis of coaxial electrohydrodynamic jet printing

Scientific Reports
2022 | Journal article
EID:

2-s2.0-85124175052

Part of ISSN: 20452322
Contributors: Wang, D.; Abbas, Z.; Lu, L.; Zhao, X.; Xu, P.; Zhao, K.; Yin, P.; Liang, J.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Optimisation design of microstrip-line structure based on the response surface method and genetic algorithm

International Journal of Materials and Structural Integrity
2022 | Journal article
EID:

2-s2.0-85140643358

Part of ISSN: 17450063 17450055
Contributors: Huang, C.; Gao, C.; Huang, G.; Lu, L.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Optimized coaxial focused electrohydrodynamic jet printing of highly ordered semiconductor sub-microwire arrays for high-performance organic field-effect transistors

Nanoscale
2022 | Journal article
EID:

2-s2.0-85146170766

Part of ISSN: 20403372 20403364
Contributors: Lu, L.; Wang, D.; Zhao, Z.; Li, Y.; Pu, C.; Xu, P.; Chen, X.; Liu, C.; Liang, S.; Suo, L. et al.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Phase field simulation of electrohydrodynamic jet droplets and printing microstructures on insulating substrates

Microelectronic Engineering
2022 | Journal article
EID:

2-s2.0-85130577671

Part of ISSN: 01679317
Contributors: Wang, D.; Abbas, Z.; Du, Z.; Du, Z.; Lu, L.; Zhao, K.; Zhao, X.; Yuan, Y.; Zong, H.; Cui, Y. et al.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Simulation and Printing of Microdroplets Using Straight Electrode-Based Electrohydrodynamic Jet for Flexible Substrate

Micromachines
2022 | Journal article
EID:

2-s2.0-85140974608

Part of ISSN: 2072666X
Contributors: Wang, D.; Abbas, Z.; Lu, L.; Liu, C.; Zhang, J.; Pu, C.; Li, Y.; Yin, P.; Zhang, X.; Liang, J.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Simulation of Cone-Jet and Micro-Drip Regimes and Printing of Micro-Scale Patterns on PET Substrate

Polymers
2022 | Journal article
EID:

2-s2.0-85133503816

Part of ISSN: 20734360
Contributors: Wang, D.; Abbas, Z.; Lu, L.; Liang, S.; Zhao, X.; Xu, P.; Zhao, K.; Suo, L.; Cui, Y.; Yin, P. et al.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Simulation of Controlled Electrohydrodynamic Droplets Generation and Printing on Insulating Substrates

SSRN
2022 | Other
EID:

2-s2.0-85179540508

Part of ISSN: 15565068
Contributors: Wang, D.; Abbas, Z.; Du, Z.; Du, Z.; Lu, L.; Zhao, K.; Zhao, X.; Yuan, Y.; Zong, H.; Cuia, Y. et al.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

The Focused Electrode Ring for Electrohydrodynamic Jet and Printing on Insulated Substrate

International Journal of Precision Engineering and Manufacturing
2022 | Journal article
EID:

2-s2.0-85126829614

Part of ISSN: 20054602 22347593
Contributors: Abbas, Z.; Wang, D.; Lu, L.; Du, Z.; Zhao, X.; Zhao, K.; Si, M.; Yin, P.; Zhang, X.; Cui, Y. et al.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Fabrication and characterisation of piezoelectric thick-film microcantilever deposited on stainless steel using electrohydrodynamic jet deposition

Ceramics International
2021 | Journal article
EID:

2-s2.0-85109429303

Part of ISSN: 02728842
Contributors: Zhao, K.; Yuan, Y.; Wang, D.; Zong, H.; Lu, L.; Xu, P.; Wang, L.; Jiang, C.; Jiang, Z.; Li, Y. et al.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Numerical simulation of stable electrohydrodynamic cone-jet formation and printing on flexible substrate

Microelectronic Engineering
2021 | Journal article
EID:

2-s2.0-85097352471

Part of ISSN: 01679317
Contributors: Abbas, Z.; Wang, D.; Du, Z.; Zhao, K.; Du, Z.; Lu, L.; Cui, Y.; Liang, J.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Optimal design of reliability and signal integrity for embedded micro-scale BGA solder joint,埋入式BGA焊点可靠性和信号完整性优化

Hanjie Xuebao/Transactions of the China Welding Institution
2019 | Journal article
EID:

2-s2.0-85064629634

Part of ISSN: 0253360X
Contributors: Lu, L.; Huang, C.; Huang, G.; Liang, Y.; Li, T.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Optimization design with objectives of random vibration stress and return loss for CSP solder joint using RS and GA,基于响应面-遗传算法的CSP焊点随机振动应力与回波损耗双目标优化设计

Zhendong yu Chongji/Journal of Vibration and Shock
2019 | Journal article
EID:

2-s2.0-85076986495

Part of ISSN: 10003835
Contributors: Lu, L.; Huang, C.; Liang, Y.; Li, T.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

The Measurement of Optical Interconnect Module Postsoldering Alignment Offsets and the Study of Its Influence on Optical Coupling Efficiency

IEEE Transactions on Components, Packaging and Manufacturing Technology
2019 | Journal article
EID:

2-s2.0-85055032936

Part of ISSN: 21563950
Contributors: Huang, C.; Lu, L.; Shao, L.; Liang, Y.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Analysis of crosstalk of the BGA Solder Joint on Memory chip based on HFSS,基于HFSS的内存芯片BGA焊点串扰仿真分析

Hanjie Xuebao/Transactions of the China Welding Institution
2018 | Journal article
EID:

2-s2.0-85053108997

Part of ISSN: 0253360X
Contributors: Huang, G.; Huang, C.; Lu, L.; Liang, Y.; Li, T.; Huang, W.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Optimal Design of Reliability and Signal Integrity for Embedded Micro-scale BGA Solder Joint

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
2018 | Conference paper
EID:

2-s2.0-85056374184

Part of ISBN: 9781538663868
Contributors: Lu, L.-K.; Wang, J.-P.; Huang, C.-Y.; Wei, H.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Simulation analysis of residual stress of BGA solder joints after reflow soldering based on element birth and death technology

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
2018 | Conference paper
EID:

2-s2.0-85056419687

Part of ISBN: 9781538663868
Contributors: Zhao, S.-J.; Huang, C.-Y.; Tang, X.-Q.; Lu, L.-K.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Stress and strain analysis of embedded substrate micro-scale ball grid array solder joint under three point bending,埋入式基板微尺度球栅阵列焊点三点弯曲应力应变分析

Hanjie Xuebao/Transactions of the China Welding Institution
2018 | Journal article
EID:

2-s2.0-85057433021

Part of ISSN: 0253360X
Contributors: Yin, R.; Huang, C.; Huang, G.; Lu, L.; Liang, Y.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Stress and strain Analysis of LTCC substrate Module based on Microchannel

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
2018 | Conference paper
EID:

2-s2.0-85056416827

Part of ISBN: 9781538663868
Contributors: Wei, H.; Huang, C.-Y.; Lu, L.-K.; Wang, J.-P.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Thermal Stress Analysis of BGA Solder Joint Power Load Based on COMSOL

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
2018 | Conference paper
EID:

2-s2.0-85056387961

Part of ISBN: 9781538663868
Contributors: Wang, J.-P.; Lu, L.-K.; Huang, C.-Y.; Wei, H.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Thermal stress-strain simulation analysis of BGA solder joint reflow soldering process

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
2018 | Conference paper
EID:

2-s2.0-85056420179

Part of ISBN: 9781538663868
Contributors: Tang, X.-Q.; Zhao, S.-J.; Huang, C.-Y.; Lu, L.-K.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier

Research of via about signal integrity facing complete transmission path

18th International Conference on Electronic Packaging Technology, ICEPT 2017
2017 | Conference paper
EID:

2-s2.0-85032804447

Part of ISBN: 9781538629727
Contributors: Huang, G.-X.; Huang, C.-Y.; Han, L.-S.; Yin, R.; Lu, L.-K.; Li, T.-M.; Liang, Y.
Source: Self-asserted source
lu liangkun via Scopus - Elsevier