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Works (29)
Microchemical Journal
2024
|
Journal article
EID:
2-s2.0-85194969319
Contributors:
Jin, S.;
Ye, G.;
Guo, Y.;
Zhao, Z.;
Lu, L.;
Liu, Z.;
Ding, Z.
Source:
lu liangkun
via
Scopus - Elsevier
Nature Communications
2024
|
Journal article
EID:
2-s2.0-85194996445
Contributors:
Xu, P.;
Wang, D.;
He, J.;
Cui, Y.;
Lu, L.;
Li, Y.;
Chen, X.;
Liu, C.;
Suo, L.;
Ren, T.
et al.
Source:
lu liangkun
via
Scopus - Elsevier
Materials and Design
2023
|
Journal article
EID:
2-s2.0-85168557236
Contributors:
Xu, P.;
Wang, D.;
Cui, Y.;
Zhang, Y.;
He, J.;
Lu, L.;
Li, Y.;
Chen, X.;
Liu, C.;
Li, P.
et al.
Source:
lu liangkun
via
Scopus - Elsevier
Advanced Electronic Materials
2023
|
Journal article
EID:
2-s2.0-85156101117
Contributors:
Wang, D.;
Xu, P.;
Cui, Y.;
Zhang, Y.;
He, J.;
Lu, L.;
Li, Y.;
Chen, X.;
Liu, C.;
Li, P.
et al.
Source:
lu liangkun
via
Scopus - Elsevier
Micromachines
2023
|
Journal article
EID:
2-s2.0-85156102973
Contributors:
Abbas, Z.;
Wang, D.;
Lu, L.;
Li, Y.;
Pu, C.;
Chen, X.;
Xu, P.;
Liang, S.;
Kong, L.;
Tang, B.
Source:
lu liangkun
via
Scopus - Elsevier
Smart Materials and Structures
2023
|
Journal article
EID:
2-s2.0-85167873464
Contributors:
Wang, D.;
Li, Y.;
Hu, X.;
Lu, L.;
Xu, P.;
Chen, X.;
Liu, C.;
Wang, L.;
Liu, B.;
Suo, L.
et al.
Source:
lu liangkun
via
Scopus - Elsevier
Microsystems and Nanoengineering
2023
|
Journal article
EID:
2-s2.0-85161867266
Contributors:
Lu, L.;
Wang, D.;
Pu, C.;
Cao, Y.;
Li, Y.;
Xu, P.;
Chen, X.;
Liu, C.;
Liang, S.;
Suo, L.
et al.
Source:
lu liangkun
via
Scopus - Elsevier
Nature Communications
2022
|
Journal article
EID:
2-s2.0-85140265252
Contributors:
Wang, D.;
Lu, L.;
Zhao, Z.;
Zhao, K.;
Zhao, X.;
Pu, C.;
Li, Y.;
Xu, P.;
Chen, X.;
Guo, Y.
et al.
Source:
lu liangkun
via
Scopus - Elsevier
Scientific Reports
2022
|
Journal article
EID:
2-s2.0-85124175052
Contributors:
Wang, D.;
Abbas, Z.;
Lu, L.;
Zhao, X.;
Xu, P.;
Zhao, K.;
Yin, P.;
Liang, J.
Source:
lu liangkun
via
Scopus - Elsevier
International Journal of Materials and Structural Integrity
2022
|
Journal article
EID:
2-s2.0-85140643358
Contributors:
Huang, C.;
Gao, C.;
Huang, G.;
Lu, L.
Source:
lu liangkun
via
Scopus - Elsevier
Nanoscale
2022
|
Journal article
EID:
2-s2.0-85146170766
Contributors:
Lu, L.;
Wang, D.;
Zhao, Z.;
Li, Y.;
Pu, C.;
Xu, P.;
Chen, X.;
Liu, C.;
Liang, S.;
Suo, L.
et al.
Source:
lu liangkun
via
Scopus - Elsevier
Microelectronic Engineering
2022
|
Journal article
EID:
2-s2.0-85130577671
Contributors:
Wang, D.;
Abbas, Z.;
Du, Z.;
Du, Z.;
Lu, L.;
Zhao, K.;
Zhao, X.;
Yuan, Y.;
Zong, H.;
Cui, Y.
et al.
Source:
lu liangkun
via
Scopus - Elsevier
Micromachines
2022
|
Journal article
EID:
2-s2.0-85140974608
Contributors:
Wang, D.;
Abbas, Z.;
Lu, L.;
Liu, C.;
Zhang, J.;
Pu, C.;
Li, Y.;
Yin, P.;
Zhang, X.;
Liang, J.
Source:
lu liangkun
via
Scopus - Elsevier
Polymers
2022
|
Journal article
EID:
2-s2.0-85133503816
Contributors:
Wang, D.;
Abbas, Z.;
Lu, L.;
Liang, S.;
Zhao, X.;
Xu, P.;
Zhao, K.;
Suo, L.;
Cui, Y.;
Yin, P.
et al.
Source:
lu liangkun
via
Scopus - Elsevier
SSRN
2022
|
Other
EID:
2-s2.0-85179540508
Contributors:
Wang, D.;
Abbas, Z.;
Du, Z.;
Du, Z.;
Lu, L.;
Zhao, K.;
Zhao, X.;
Yuan, Y.;
Zong, H.;
Cuia, Y.
et al.
Source:
lu liangkun
via
Scopus - Elsevier
International Journal of Precision Engineering and Manufacturing
2022
|
Journal article
EID:
2-s2.0-85126829614
Contributors:
Abbas, Z.;
Wang, D.;
Lu, L.;
Du, Z.;
Zhao, X.;
Zhao, K.;
Si, M.;
Yin, P.;
Zhang, X.;
Cui, Y.
et al.
Source:
lu liangkun
via
Scopus - Elsevier
Ceramics International
2021
|
Journal article
EID:
2-s2.0-85109429303
Contributors:
Zhao, K.;
Yuan, Y.;
Wang, D.;
Zong, H.;
Lu, L.;
Xu, P.;
Wang, L.;
Jiang, C.;
Jiang, Z.;
Li, Y.
et al.
Source:
lu liangkun
via
Scopus - Elsevier
Microelectronic Engineering
2021
|
Journal article
EID:
2-s2.0-85097352471
Contributors:
Abbas, Z.;
Wang, D.;
Du, Z.;
Zhao, K.;
Du, Z.;
Lu, L.;
Cui, Y.;
Liang, J.
Source:
lu liangkun
via
Scopus - Elsevier
Hanjie Xuebao/Transactions of the China Welding Institution
2019
|
Journal article
EID:
2-s2.0-85064629634
Contributors:
Lu, L.;
Huang, C.;
Huang, G.;
Liang, Y.;
Li, T.
Source:
lu liangkun
via
Scopus - Elsevier
Zhendong yu Chongji/Journal of Vibration and Shock
2019
|
Journal article
EID:
2-s2.0-85076986495
Contributors:
Lu, L.;
Huang, C.;
Liang, Y.;
Li, T.
Source:
lu liangkun
via
Scopus - Elsevier
IEEE Transactions on Components, Packaging and Manufacturing Technology
2019
|
Journal article
EID:
2-s2.0-85055032936
Contributors:
Huang, C.;
Lu, L.;
Shao, L.;
Liang, Y.
Source:
lu liangkun
via
Scopus - Elsevier
Hanjie Xuebao/Transactions of the China Welding Institution
2018
|
Journal article
EID:
2-s2.0-85053108997
Contributors:
Huang, G.;
Huang, C.;
Lu, L.;
Liang, Y.;
Li, T.;
Huang, W.
Source:
lu liangkun
via
Scopus - Elsevier
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
2018
|
Conference paper
EID:
2-s2.0-85056374184
Contributors:
Lu, L.-K.;
Wang, J.-P.;
Huang, C.-Y.;
Wei, H.
Source:
lu liangkun
via
Scopus - Elsevier
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
2018
|
Conference paper
EID:
2-s2.0-85056419687
Contributors:
Zhao, S.-J.;
Huang, C.-Y.;
Tang, X.-Q.;
Lu, L.-K.
Source:
lu liangkun
via
Scopus - Elsevier
Hanjie Xuebao/Transactions of the China Welding Institution
2018
|
Journal article
EID:
2-s2.0-85057433021
Contributors:
Yin, R.;
Huang, C.;
Huang, G.;
Lu, L.;
Liang, Y.
Source:
lu liangkun
via
Scopus - Elsevier
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
2018
|
Conference paper
EID:
2-s2.0-85056416827
Contributors:
Wei, H.;
Huang, C.-Y.;
Lu, L.-K.;
Wang, J.-P.
Source:
lu liangkun
via
Scopus - Elsevier
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
2018
|
Conference paper
EID:
2-s2.0-85056387961
Contributors:
Wang, J.-P.;
Lu, L.-K.;
Huang, C.-Y.;
Wei, H.
Source:
lu liangkun
via
Scopus - Elsevier
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
2018
|
Conference paper
EID:
2-s2.0-85056420179
Contributors:
Tang, X.-Q.;
Zhao, S.-J.;
Huang, C.-Y.;
Lu, L.-K.
Source:
lu liangkun
via
Scopus - Elsevier
18th International Conference on Electronic Packaging Technology, ICEPT 2017
2017
|
Conference paper
EID:
2-s2.0-85032804447
Contributors:
Huang, G.-X.;
Huang, C.-Y.;
Han, L.-S.;
Yin, R.;
Lu, L.-K.;
Li, T.-M.;
Liang, Y.
Source:
lu liangkun
via
Scopus - Elsevier