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Works (18)

Study on the Influence of Au Content and Bonding Parameters on the Free Air Ball Morphology and Bonding Reliability of Ag-Au-Pd Alloy Wire

Micromachines
2024-12 | Journal article | Author
Contributors: Junling Fan; Fang He; Bing Chen; Junchao Zhang; Fan Yang; Jun Cao; Furong Wang
Source: check_circle
Multidisciplinary Digital Publishing Institute

A Study on the Effect of Pd Layer Thickness on the Properties of Cu-Ag Intermetallic Compounds at the Bonding Interface

Materials
2024-09 | Journal article | Author
Contributors: Junling Fan; Donglin Yuan; Juan Du; Tao Hou; Furong Wang; Jun Cao; Xuemei Yang; Yuemin Zhang
Source: check_circle
Multidisciplinary Digital Publishing Institute

Research Progress on Rolling Forming of Tungsten Alloy

Materials
2024-09 | Journal article | Author
Contributors: Jun Cao; Jie Xia; Xiaoyu Shen; Kexing Song; Yanjun Zhou; Chengqiang Cui
Source: check_circle
Multidisciplinary Digital Publishing Institute

Influence of Pd-Layer Thickness on Bonding Reliability of Pd-Coated Cu Wire

Micromachines
2024-07 | Journal article | Author
Contributors: Junling Fan; Donglin Yuan; Juan Du; Tao Hou; Furong Wang; Jun Cao; Xuemei Yang; Yuemin Zhang
Source: check_circle
Multidisciplinary Digital Publishing Institute

A Review of Silver Wire Bonding Techniques

Micromachines
2023-11 | Journal article | Author
Contributors: Bin An; Hongliang Zhou; Jun Cao; Pingmei Ming; John Persic; Jingguang Yao; Andong Chang
Source: check_circle
Multidisciplinary Digital Publishing Institute

Processing and Properties of Single-Crystal Copper Wire

Micromachines
2023-11 | Journal article | Author
Contributors: Jun Cao; Xuefeng Wu; Chenghao Su; Hewei Jia; Yongzhen Sun
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Multidisciplinary Digital Publishing Institute

Copper Wire Bonding: A Review

Micromachines
2023-08 | Journal article | Author
Contributors: Hongliang Zhou; Andong Chang; Junling Fan; Jun Cao; Bin An; Jie Xia; Jingguang Yao; Xiaobin Cui; Yingchong Zhang
Source: check_circle
Multidisciplinary Digital Publishing Institute

Effects of Process Parameters on Bond Properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu Alloy Wire

Micromachines
2023-08 | Journal article | Author
Contributors: Hongliang Zhou; Andong Chang; Junling Fan; Jun Cao; Yingchong Zhang; Bin An; Jie Xia
Source: check_circle
Multidisciplinary Digital Publishing Institute

Study on the Effect of Cold Deformation and Heat Treatment on the Properties of Cu-Ag Alloy Wire

Micromachines
2023-08 | Journal article | Author
Contributors: Xuefeng Wu; Hewei Jia; Junling Fan; Jun Cao; Chenghao Su
Source: check_circle
Multidisciplinary Digital Publishing Institute

Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging

Micromachines
2023-07 | Journal article | Author
Contributors: Yuemin Zhang; Haiyun Guo; Jun Cao; Xuefeng Wu; Hewei Jia; Andong Chang
Source: check_circle
Multidisciplinary Digital Publishing Institute

Research Status of Manufacturing Technology of Tungsten Alloy Wire

Micromachines
2023-05 | Journal article | Author
Contributors: Jun Cao; Yongzhen Sun; Baoan Wu; Huiyi Tang; Yong Ding; Kexing Song; Chengqiang Cui
Source: check_circle
Multidisciplinary Digital Publishing Institute

Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging

Micromachines
2023-04 | Journal article | Author
Contributors: Jun Cao; Junchao Zhang; Baoan Wu; Huiyi Tang; Yong Ding; Kexing Song; Guannan Yang; Chengqiang Cui
Source: check_circle
Multidisciplinary Digital Publishing Institute

Research Progress on Bonding Wire for Microelectronic Packaging

Micromachines
2023-02 | Journal article | Author
Contributors: Hongliang Zhou; Yingchong Zhang; Jun Cao; Chenghao Su; Chong Li; Andong Chang; Bin An
Source: check_circle
Multidisciplinary Digital Publishing Institute

Study on Manufacturing Technology of Ag-8.5Au-3.5Pd Fine Alloy Wire

Micromachines
2021-08 | Journal article | Author
Contributors: Jun Cao; Junchao Zhang; Baoan Wu; Huiyi Tang; Changchun Lv; Kexing Song; Guannan Yang; Chengqiang Cui; Yangguang Gao
Source: check_circle
Multidisciplinary Digital Publishing Institute

Effect of Ceramic Capillary Parameters on Bonded Morphology and Strength

Micromachines
2020-12 | Journal article | Author
Contributors: Jun Cao; Junchao Zhang; Kexing Song; Baoan Wu; Yong Ding; Dingbiao Chen; Yutian Ding
Source: check_circle
Multidisciplinary Digital Publishing Institute

Effects of Bonding Parameters on Free Air Ball Properties and Bonded Strength of Ag-10Au-3.6Pd Alloy Bonding Wire

Micromachines
2020-08 | Journal article | Author
Contributors: Jun Cao; Junchao Zhang; John Persic; Kexing Song
Source: check_circle
Multidisciplinary Digital Publishing Institute

Effects of Process Parameters on Bond Properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu Alloy Wire

Source: check_circle
Multidisciplinary Digital Publishing Institute

Study on the Effect of Cold Deformation and Heat Treatment on the Properties of Cu-Ag Alloy Wire

Source: check_circle
Multidisciplinary Digital Publishing Institute