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SciProfiles: 1539725
Scopus Author ID: 57860974900

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Works (10)

Modeling and Characterization of Multilayer Piezoelectric Stacks via Dynamic Stiffness Method

Micromachines
2024-12-26 | Journal article
DOI: 10.3390/mi16010020
Contributors: Wenxiang Ding; Zhaofeng Liang; Wei Zhao; Hongmei Zhong; Dan Chen; Maxime Bavencoffe; Marc Lethiecq
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Dynamic stiffness formulation for a piezoelectric array element

Journal of Sound and Vibration
2023-09 | Journal article
DOI: 10.1016/j.jsv.2023.117843
Contributors: Wenxiang Ding; Maxime Bavencoffe; Marc Lethiecq
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Defect Detection inside a Rail Head by Ultrasonic Guided Waves

Symmetry
2022-12-05 | Journal article
DOI: 10.3390/sym14122566
Contributors: Jingsong Xie; Wenxiang Ding; Wen Zou; Tiantian Wang; Jinsong Yang
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An Original 2-D Analytical Model for Investigating Coupled Vibrations of Finite Piezoelectric Resonators

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
2022-02 | Journal article
DOI: 10.1109/TUFFC.2021.3125271
Contributors: Wenxiang Ding; Maxime Bavencoffe; Marc Lethiecq
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Modeling and Experimental Characterization of Bonding Delamination in Linear Array Ultrasonic Transduer

IEEE International Ultrasonics Symposium
2021 | Conference paper
DOI: 10.1109/IUS52206.2021.9593364
WOSUID: WOS:000832095000059
Contributors: Ding, Wenxiang; Bavencoffe, Maxime; Lethiecq, Marc
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Accurate coupled vibration analysis of a piezoelectric array element by the superposition method

Journal of Sound and Vibration
2021-12 | Journal article
DOI: 10.1016/j.jsv.2021.116438
Part of ISSN: 0022-460X
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wenxiang ding
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Accurate coupled vibration analysis of a piezoelectric ceramic cylinder by the superposition method

Ultrasonics
2021-08 | Journal article
DOI: 10.1016/j.ultras.2021.106474
Part of ISSN: 0041-624X
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wenxiang ding
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Health Monitoring of Single-Element Piezoelectric Transducer Using Its Electromechanical Admittance

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
2021-05 | Journal article
DOI: 10.1109/TUFFC.2020.3047944
Contributors: Wenxiang Ding; Maxime Bavencoffe; Marc Lethiecq
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Modeling and Experimental Characterization of Bonding Delaminations in Single-Element Ultrasonic Transducer

Materials
2021-04-27 | Journal article
DOI: 10.3390/ma14092269
Contributors: Wenxiang Ding; Maxime Bavencoffe; Marc Lethiecq
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Influence of Bonding Delaminations on The Electromechanical Admittance (EMA) of a Single-element Piezoelectric Transducer

e-Forum Acusticum 2020
2020 | Journal article
DOI: 10.48465/FA.2020.0479
Source: Self-asserted source
wenxiang ding

Peer review (3 reviews for 2 publications/grants)

Review activity for Intelligent transportation systems, IEEE transactions on. (1)
Review activity for Ultrasonics. (2)
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