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Scopus Author ID: 57214593470
Scopus Author ID: 57215272178

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Works (8)

Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation

Micromachines
2023-04-19 | Journal article
DOI: 10.3390/mi14040876
Contributors: Martin Hubmann; Mona Bakr; Jonas Groten; Martin Pletz; Jan Vanfleteren; Frederick Bossuyt; Behnam Madadnia; Barbara Stadlober
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A Study on Over-Molded Copper-Based Flexible Electronic Circuits

Micromachines
2022-10-16 | Journal article
DOI: 10.3390/mi13101751
Contributors: Mona Bakr; Martin Hubmann; Frederick Bossuyt; Jan Vanfleteren
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The integration of electronic circuits in plastics using injection technologies: a literature review

Flexible and Printed Electronics
2022-06-01 | Journal article
DOI: 10.1088/2058-8585/ac6719
Contributors: Mona Bakr; Frederick Bossuyt; Jan Vanfleteren
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Over-molding of two-dimensional curved shape using polyimide copper cladding foil

2021 | Conference paper | Author
DOI: 10.23919/empc53418.2021.9584946
HANDLE: 1854/LU-8726727
Contributors: Mona Bakr; Su, Yibo; Rezaei, Ali; Frederick Bossuyt; Jan Vanfleteren
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Ghent University Academic Bibliography

Over-molding of flexible polyimide-based electronic circuits

Flexible and Printed Electronics
2021-06-01 | Journal article
DOI: 10.1088/2058-8585/ac03bf
Contributors: Mona Bakr; Yibo Su; Ali Rezaei; Frederick Bossuyt; Jan Vanfleteren
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Flexible microsystems using over-molding technology

2020 | Conference paper | Author
DOI: 10.1016/j.promfg.2020.11.006
HANDLE: 1854/LU-8685479
Contributors: Mona Bakr; Frederick Bossuyt; Jan Vanfleteren; Su, Yibo
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Ghent University Academic Bibliography

Solar cells integration in over-molded printed electronics

Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020
2020 | Conference paper
DOI: 10.1109/ESTC48849.2020.9229822
EID:

2-s2.0-85096549234
Contributors: Bakr, M.; Bauwens, P.; Bossuyt, F.; Vanfleteren, J.; Chtioui, I.; Christiaens, W.
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Mona Bakr via Scopus - Elsevier
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Effect of overmolding process on the integrity of electronic circuits

2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
2019 | Conference paper
DOI: 10.23919/EMPC44848.2019.8951797
EID:

2-s2.0-85078834034
Contributors: Bakr, M.; Su, Y.; Bossuyt, F.; Vanfleteren, J.
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Mona Bakr via Scopus - Elsevier
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Peer review (1 review for 1 publication/grant)

Review activity for ACS applied electronic materials. (1)
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