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Employment (1)

Tianjin University of Technology: Tianjin, CN

2013-10-01 to present | Associate Professor (School of Electrical and Electronic Engineering)
Employment
Source: Self-asserted source
Mingxing Du

Education and qualifications (1)

Tianjin University: Tianjin, Tianjin, CN

2008-09-01 to 2012-06-01 | PhD. (school of electrical and information engineering)
Education
Source: Self-asserted source
Mingxing Du

Works (30)

An Aging Monitoring Method of Bond Wires Based on Voltage Ringing Frequency Characteristics in IGBT Modules

IEEE Transactions on Device and Materials Reliability
2024 | Journal article
Contributors: Xiyuan Huang; Mingxing Du; Hongze Fu; Sai Gao
Source: check_circle
Crossref

Two-Branch Coupling Cauer Model in IGBT Module Considering FWD Thermal Coupling Effect

IEEE Transactions on Components, Packaging and Manufacturing Technology
2024 | Journal article
Contributors: Qing Yan; Aoyang Li; Gengji Wang; Jinliang Yin; Chao Dong; Mingxing Du
Source: check_circle
Crossref

Study on the influence mechanism of gate oxide degradation on DM EMI signals in SiC MOSFET

Microelectronics Journal
2024-12 | Journal article
Contributors: Chao Dong; Sai Gao; Yulin Liu; Gengji Wang; Jinliang Yin; Mingxing Du
Source: check_circle
Crossref

In-Situ Monitoring Solder Layer Degradation in Multichip IGBT Power Modules Using Auxiliary Emitter Voltage

IEEE Transactions on Power Electronics
2024-10 | Journal article
Contributors: Jianxiong Yang; Yanbo Che; Li Ran; Borong Hu; Mingxing Du
Source: check_circle
Crossref

Junction Temperature Correction Method for SiC MOSFET Based on Turn-Off Oscillation Frequency of Drain-Source Voltage

IEEE Transactions on Electron Devices
2024-10 | Journal article
Contributors: Mingxing Du; Fan Liu; Jinliang Yin; Chao Dong; Ziwei Ouyang
Source: check_circle
Crossref

Monitoring Void Fatigue in Solder Layer of IGBT Module Based on Common Mode Interference Spectrum

IEEE Transactions on Components, Packaging and Manufacturing Technology
2024-01 | Journal article
Contributors: Sai Gao; Zhihui Ren; Mingxing Du; Chengpeng Chu; Jinliang Yin; Chao Dong
Source: check_circle
Crossref

"Project Driven Practical Teaching Reform Based on U+ EEC - Taking the Course \"Engineering Training II\" as an Example"

2023-09-26 | Conference paper
Contributors: Xin Wang; Mingxing Du; Jinglei Zhang; Xiaoping He
Source: check_circle
Crossref

A parameter self-correcting thermal network model considering IGBT module solder layer aging

Microelectronics Journal
2023-04 | Journal article
Contributors: Yulin Liu; Mingxing Du; Jinliang Yin; Chao Dong
Source: check_circle
Crossref

Correction method for calculating junction temperature considering parasitic effects in SiC MOSFETs

Journal of Power Electronics
2023-04 | Journal article
Contributors: Fan Liu; Mingxing Du; Jinliang Yin; Chao Dong; Ziwei Ouyang
Source: check_circle
Crossref

Parameter extraction method for Cauer model considering dynamic thermal diffusion boundaries in IGBT module

Microelectronics Journal
2023-01 | Journal article
Contributors: Chao Dong; Jingwei Hu; Mingxing Du
Source: check_circle
Crossref

Monitoring Initial Solder Layer Degradation in a Multichip IGBT Module via Combined TSEPs

IEEE Transactions on Device and Materials Reliability
2022-03 | Journal article
Contributors: Jianxiong Yang; Yanbo Che; Li Ran; Mingxing Du; Huaping Jiang; Muzixiang Xiao
Source: check_circle
Crossref

Aging Monitoring Method of Bond Wires-Based on Phase-Frequency Characteristics of Differential Mode Conducted Interference Signal for IGBT Module

IEEE Transactions on Device and Materials Reliability
2021-12 | Journal article
Contributors: Chengpeng Chu; Chao Dong; Jing Hu; Mingxing Du; Ziwei Ouyang
Source: check_circle
Crossref

Bond wire lift-off monitoring based on intersection point movement characteristic in IGBT module

Microelectronics Journal
2021-10 | Journal article
Contributors: Mingxing Du; Jinlei Xin; Hongbin Wang; Ziwei Ouyang; Kexin Wei
Source: check_circle
Crossref

Aging Monitoring of Bond Wires Based on Differential Mode Conducted Interference Spectrum for IGBT Module

IEEE Transactions on Electromagnetic Compatibility
2021-08 | Journal article
Contributors: Chengpeng Chu; Chao Dong; Mingxing Du; Xuesong Zhou; Ziwei Ouyang
Source: check_circle
Crossref

Rapid Torque Rising of PMSM by Directly Chasing Rotating Flux Linkage Vector

IEEE Journal of Emerging and Selected Topics in Power Electronics
2021-08 | Journal article
Contributors: Wenbai Wang; Mingxing Du; Kexin Wei
Source: check_circle
Crossref

Online Monitoring for Threshold Voltage of SiC MOSFET Considering the Coupling Impact on BTI and Junction Temperature

IEEE Transactions on Electron Devices
2021-04 | Journal article
Contributors: Jinlei Xin; Mingxing Du; Ziwei Ouyang; Kexin Wei
Source: check_circle
Crossref

Aging Diagnosis of Bond Wire Using On-State Drain-Source Voltage Separation for SiC MOSFET

IEEE Transactions on Device and Materials Reliability
2021-03 | Journal article
Contributors: Mingxing Du; Jinlei Xin; Hongbin Wang; Ziwei Ouyang
Source: check_circle
Crossref

Non-Intrusive Load Identification Method Based on Improved Long Short Term Memory Network

Energies
2021-01-29 | Journal article
Contributors: Jiateng Song; Hongbin Wang; Mingxing Du; Lei Peng; Shuai Zhang; Guizhi Xu
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

An Improved Cauer Model of IGBT Module: Inclusive Void Fraction in Solder Layer

IEEE Transactions on Components, Packaging and Manufacturing Technology
2020-08 | Journal article
Contributors: Mingxing Du; Qiuya Guo; Hongbin Wang; Ziwei Ouyang; Kexin Wei
Source: check_circle
Crossref

Estimating Junction Temperature of SiC MOSFET Using Its Drain Current During Turn-On Transient

IEEE Transactions on Electron Devices
2020-05 | Journal article
Contributors: Mingxing Du; Jinlei Xin; Hongbin Wang; Ziwei Ouyang; Kexin Wei
Source: check_circle
Crossref

An Improved Behavior Model for IGBT Modules Driven by Datasheet and Measurement

IEEE Transactions on Electron Devices
2020-01 | Journal article
Contributors: Lei Jing; Mingxing Du; Kexin Wei; William Gerard Hurley
Source: check_circle
Crossref

Strategy for Diagnosing the Aging of an IGBT Module by ON-State Voltage Separation

IEEE Transactions on Electron Devices
2019-11 | Journal article
Contributors: Mingxing Du; Qingyi Kong; Ziwei Ouyang; Kexin Wei; William G. Hurley
Source: check_circle
Crossref

Thermal Characteristics of Positive Leaders under Different Electrode Terminals in a Long Air Gap

Energies
2019-10-23 | Journal article
Contributors: Mingxing Du; Yu Tang; Min Li; Jiayong Zou; Yigang Ma; Jinyu Sun; Lei Liu; Qingguo Zeng
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

A Health Monitoring Method for Bond Wires in IGBT Modules Based on Voltage Ringing Characteristics

IEEE Transactions on Electron Devices
2019-09 | Journal article
Contributors: Lei Jing; Mingxing Du; Kexin Wei; William Gerard Hurley
Source: check_circle
Crossref

Online Estimation of the Junction Temperature Based on the Gate Pre-Threshold Voltage in High-Power IGBT Modules

IEEE Transactions on Device and Materials Reliability
2019-09 | Journal article
Contributors: Mingxing Du; Yu Tang; Mengchao Gao; Ziwei Ouyang; Kexin Wei; William Gerard Hurley
Source: check_circle
Crossref

IGBT Junction Temperature Measurements: Inclusive of Dynamic Thermal Parameters

IEEE Transactions on Device and Materials Reliability
2019-06 | Journal article
Contributors: Jiangyong Zhang; Mingxing Du; Lei Jing; Kexin Wei; William Gerard Hurley
Source: check_circle
Crossref

A Method to Monitor IGBT Module Bond Wire Failure Using On-State Voltage Separation Strategy

Energies
2019-05 | Journal article | Author
Contributors: Qingyi Kong; Mingxing Du; Ziwei Ouyang; Kexin Wei; William Gerard Hurley
Source: check_circle
Multidisciplinary Digital Publishing Institute
grade
Preferred source (of 2)‎

A Model of the On-State Voltage across IGBT Modules Based on Physical Structure and Conduction Mechanisms

Energies
2019-03 | Journal article | Author
Contributors: Qingyi Kong; Mingxing Du; Ziwei Ouyang; Kexin Wei; William Gerard Hurley
Source: check_circle
Multidisciplinary Digital Publishing Institute
grade
Preferred source (of 2)‎

A Novel Finite-Control-Set Model Predictive Directive Torque Control Strategy of Permanent Magnet Synchronous Motor with Extended Output

Electronics
2019-03 | Journal article | Author
Contributors: Mingxing Du; Ye Tian; Wenbai Wang; Ziwei Ouyang; Kexin Wei
Source: check_circle
Multidisciplinary Digital Publishing Institute
grade
Preferred source (of 2)‎

A High-Precision Adaptive Thermal Network Model for Monitoring the Junction Temperature of IGBTs

2018-01-23 | Other
Contributors: Ning An; Mingxing Du; Zhen Hu; Kexin Wei
Source: check_circle
Crossref