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Works (3)

Process and characterization of photo-definable organic–inorganic dielectric for wafer level packaging

Microsystem Technologies
2019-12-30 | Journal article
DOI: 10.1007/s00542-019-04418-y
Contributors: Changmin Song; Sarah Eunkyung Kim
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Nitrogen passivation formation on Cu surface by Ar–N2 plasma for Cu-to-Cu wafer stacking application

Microsystem Technologies
2019-10-06 | Journal article
DOI: 10.1007/s00542-018-4254-y
Contributors: Haesung Park; Sarah Eunkyung Kim
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Transparent SnOx thin films fabricated by radio frequency reactive sputtering with a SnO/Sn composite target

Thin Solid Films
2017-07 | Journal article
DOI: 10.1016/j.tsf.2017.02.045
Contributors: Cheol Kim; Sungdong Kim; Sarah Eunkyung Kim
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