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Scopus Author ID: 56797156000

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Employment (1)

Guilin University of Electronic Technology: Guilin, CN

Employment
Source: Self-asserted source
Siliang He

Education and qualifications (1)

Osaka University: Osaka, JP

Doctor
Education
Source: Self-asserted source
Siliang He

Works (37)

Improved Thermal Conductivity and Reliability Through Graphene Reinforced Nanopaste for Power Devices in New Energy Vehicles

IEEE Transactions on Components, Packaging and Manufacturing Technology
2024 | Journal article
DOI: 10.1109/TCPMT.2023.3339686
WOSUID: WOS:001178135100005
Contributors: Zhang, Hongqiang; He, Siliang; Qu, Guanda; Deng, Zhongyang; Zou, Guisheng; Jia, Qiang; Deng, Erping; Guo, Wei
Source: check_circle
Web of Science Researcher Profile Sync

Study on the effect of atmosphere sintering on the performance of multilayer chip power inductor

Journal of Magnetism and Magnetic Materials
2024 | Journal article
DOI: 10.1016/J.JMMM.2024.171815
WOSUID: WOS:001176907600001
Contributors: Wu, Junke; Wei, Xiangnan; Li, Wangchang; Xiang, Wenbo; He, Siliang; Fan, Xingming
Source: check_circle
Web of Science Researcher Profile Sync

Anisotropy in Microstructures and Mechanical Properties of 2Cr13 Alloy Produced by Wire Arc Additive Manufacturing,电弧熔丝增材制造 2Cr13 合金组织与性能各向异性行为

Jinshu Xuebao/Acta Metallurgica Sinica
2023 | Journal article
DOI: 10.11900/0412.1961.2022.00414
EID:

2-s2.0-85147196081

Part of ISSN: 04121961
Contributors: Ge, J.; Lu, Z.; He, S.; Sun, Y.; Yin, S.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Characterization of the Anisotropy in the Microstructure and Mechanical Properties of Laser Powder Bed Fusion Ti<sub>6</sub>Al<sub>4</sub>V Alloys

Advanced Engineering Materials
2023 | Journal article
DOI: 10.1002/adem.202201156
EID:

2-s2.0-85142933341

Part of ISSN: 15272648 14381656
Contributors: Huang, Q.; Ge, J.; Wang, Y.; Bao, J.; He, S.; Zhang, Z.; Zhang, L.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Effect of Substrate Type on Morphology of Silica Aerogel Film Prepared by Ambient Pressure Dry Method

Rare Metal Materials and Engineering
2023 | Journal article
WOSUID: WOS:000950266900012
Contributors: Wei, Zheng; Yao, Wang; He Siliang; Xun, Xiang; Cui Yinhua; Hu Chuan
Source: check_circle
Web of Science Researcher Profile Sync

Flexible strain sensors based on gold nanowire dominoes for human motion detection

Materials Today Communications
2023 | Journal article
DOI: 10.1016/J.MTCOMM.2023.105703
WOSUID: WOS:001042993900001
Contributors: Liu, Xin; Wei, Lansheng; Wang, Xiaoying; He, Siliang; Yan, Yingqiang; Li, Quantong; Yang, Hui; Hu, Chuan; Ling, Yunzhi
Source: check_circle
Web of Science Researcher Profile Sync

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Journal of Materials Research and Technology
2022 | Journal article
DOI: 10.1016/j.jmrt.2022.10.056
EID:

2-s2.0-85144820204

Part of ISSN: 22387854
Contributors: He, S.; Shen, Y.-A.; Xiong, B.; Huo, F.; Li, J.; Ge, J.; Pan, Z.; Li, W.; Hu, C.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint

2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022
2022 | Conference paper
DOI: 10.1109/ICEPT56209.2022.9873375
EID:

2-s2.0-85139142684
Contributors: Lv, G.; Yan, H.; He, S.; Yang, D.; Wu, X.; Sheng, K.; Liu, C.; Zhang, Y.; Zhang, G.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere

Journal of Advanced Joining Processes
2022 | Journal article
DOI: 10.1016/j.jajp.2022.100118
EID:

2-s2.0-85132223661

Part of ISSN: 26663309
Contributors: He, S.; Bi, Y.; Shen, Y.-A.; Chen, Z.; Yue, G.; Hu, C.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier
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Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density

Journal of Materials Science: Materials in Electronics
2022 | Journal article
DOI: 10.1007/s10854-022-08507-z
EID:

2-s2.0-85131672358

Part of ISSN: 1573482X 09574522
Contributors: Li, X.; Wang, J.; Qin, H.; He, S.; Li, W.; Wei, S.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Failure quantitative assessment approach to MOSFET power device by detecting parasitic parameters

Frontiers in Physics
2022 | Journal article
DOI: 10.3389/fphy.2022.1050678
EID:

2-s2.0-85140995347

Part of ISSN: 2296424X
Contributors: Yun, M.; Yang, D.; He, S.; Cai, M.; Xiao, J.; Zhang, K.; Zhang, G.-Q.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer

Materials
2022 | Journal article
DOI: 10.3390/ma15062232
EID:

2-s2.0-85127061896

Part of ISSN: 19961944
Contributors: Liang, P.; Pan, Z.; Tang, L.; Zhang, G.; Yang, D.; He, S.; Yan, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Preparation and performance evaluation of Sn-Bi solder paste

2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022
2022 | Conference paper
DOI: 10.1109/ICEPT56209.2022.9873299
EID:

2-s2.0-85139155181
Contributors: Zhu, Y.; Wang, L.; Wang, X.; He, S.; Huang, J.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density

Journal of Materials Science: Materials in Electronics
2022 | Journal article
DOI: 10.1007/s10854-022-09200-x
EID:

2-s2.0-85139528343

Part of ISSN: 1573482X 09574522
Contributors: Gong, Y.; Liu, L.; He, S.; Yan, H.; Li, W.; Qin, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Shear strength of joint formed using Sn-58Bi/Cu porous structure via TLP bonding

MEMAT 2022 - 2nd International Conference on Mechanical Engineering, Intelligent Manufacturing and Automation Technology
2022 | Conference paper
EID:

2-s2.0-85137062903
Contributors: Xiong, B.; Lu, H.; Bi, Y.; Huang, J.; He, S.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Adsorption behavior of HCOOH on the crystal surfaces of Cu(111) and (100)

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
2021 | Conference paper
DOI: 10.1109/ICEPT52650.2021.9567947
EID:

2-s2.0-85118451702
Contributors: Jiang, L.; Liu, T.; He, S.; Qin, H.; Li, W.; Yang, D.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Corrigendum to ‘Fabrication of NiO/ZrO2 nanocomposites using ball milling-pyrolysis method’ [Vacuum 191 (2021)110370] (Vacuum (2021) 191, (S0042207X21003249), (10.1016/j.vacuum.2021.110370))

Vacuum
2021 | Journal article
DOI: 10.1016/j.vacuum.2021.110492
EID:

2-s2.0-85111290157

Part of ISSN: 0042207X
Contributors: Huo, F.; Shen, Y.-A.; He, S.; Zhang, K.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy

Materials Science and Engineering A
2021 | Journal article
DOI: 10.1016/j.msea.2021.140785
EID:

2-s2.0-85099511817

Part of ISSN: 09215093
Contributors: Han, D.L.; Shen, Y.-A.; He, S.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Fabrication of NiO/ZrO<sub>2</sub> nanocomposites using ball milling-pyrolysis method

Vacuum
2021 | Journal article
DOI: 10.1016/j.vacuum.2021.110370
EID:

2-s2.0-85107679195
Contributors: Huo, F.; Shen, Y.-A.; He, S.; Zhang, K.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Large-area and low-cost Cu–Cu bonding with cold spray deposition, oxidation, and reduction processes under low-temperature conditions

Journal of Materials Science: Materials in Electronics
2021 | Journal article
DOI: 10.1007/s10854-021-06556-4
EID:

2-s2.0-85110842102

Part of ISSN: 1573482X 09574522
Contributors: Hou, J.; Zhang, Q.; He, S.; Bian, J.; Jiu, J.; Li, C.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Wettability Improvement of Solder in Fluxless Soldering under Formic Acid Atmosphere

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
2021 | Conference paper
DOI: 10.1109/ICEPT52650.2021.9568105
EID:

2-s2.0-85118452884
Contributors: Bi, Y.; He, S.; Li, W.; Yang, D.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Author Correction: Effect of FeCoNiCrCu<sub>0.5</sub> High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder (Scientific Reports, (2019), 9, 1, (3658), 10.1038/s41598-019-40268-4)

Scientific Reports
2020 | Journal article
DOI: 10.1038/s41598-020-67126-y
EID:

2-s2.0-85088386542
Contributors: Shen, Y.-A.; Lin, C.-M.; Li, J.; He, S.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere

Materials Chemistry and Physics
2020 | Journal article
DOI: 10.1016/j.matchemphys.2019.122309
EID:

2-s2.0-85073532561

Part of ISSN: 02540584
Contributors: He, S.; Gao, R.; Li, J.; Shen, Y.-A.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding

Journal of Materials Science: Materials in Electronics
2020 | Journal article
DOI: 10.1007/s10854-020-04026-x
EID:

2-s2.0-85088877009

Part of ISSN: 1573482X 09574522
Contributors: Gao, R.; He, S.; Li, J.; Shen, Y.-A.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Mechanical and microstructural enhancements of Ag microparticle-sintered joint by ultrasonic vibration

Journal of Materials Science: Materials in Electronics
2020 | Journal article
DOI: 10.1007/s10854-020-04684-x
EID:

2-s2.0-85093972870

Part of ISSN: 1573482X 09574522
Contributors: Gao, R.; Shen, Y.-A.; Li, J.; He, S.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere

Journal of Materials Science
2020 | Journal article
DOI: 10.1007/s10853-019-04153-9
EID:

2-s2.0-85074687036

Part of ISSN: 15734803 00222461
Contributors: He, S.; Gao, R.; Shen, Y.-A.; Li, J.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Effect of FeCoNiCrCu<sub>0.5</sub> High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Scientific Reports
2019 | Journal article
DOI: 10.1038/s41598-019-40268-4
EID:

2-s2.0-85062640406
Contributors: Shen, Y.-A.; Lin, C.-M.; Li, J.; He, S.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles

Journal of Electronic Materials
2019 | Journal article
DOI: 10.1007/s11664-019-07046-4
EID:

2-s2.0-85061632481

Part of ISSN: 03615235
Contributors: Gao, R.; He, S.; Shen, Y.-A.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

Journal of Applied Physics
2019 | Journal article
DOI: 10.1063/1.5124716
EID:

2-s2.0-85075296755

Part of ISSN: 10897550 00218979
Contributors: Jin, Z.; Shen, Y.-A.; He, S.; Zhou, S.; Chan, Y.C.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Effect of bonding conditions on shear strength of joints at 200 °c using Sn-coated Cu particle

EMPC 2017 - 21st European Microelectronics and Packaging Conference and Exhibition
2018 | Conference paper
DOI: 10.23919/EMPC.2017.8346890
EID:

2-s2.0-85049723901
Contributors: Nishikawa, H.; Liu, X.; He, S.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Effect of substrate metallization on the impact strength of Sn-Ag-Cu solder bumps fabricated in a formic acid atmosphere

2017 International Conference on Electronics Packaging, ICEP 2017
2017 | Conference paper
DOI: 10.23919/ICEP.2017.7939400
EID:

2-s2.0-85021452015
Contributors: He, S.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Effect of thermal aging on the impact strength of soldered bumps under formic acid atmosphere

Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
2017 | Journal article
DOI: 10.2207/QJJWS.35.127S
EID:

2-s2.0-85074122751

Part of ISSN: 02884771
Contributors: He, S.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Impact strength of Sn-Ag-Cu/Cu solder bumps formed by an induction heating method

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
2017 | Conference paper
DOI: 10.1109/IMPACT.2017.8255903
EID:

2-s2.0-85045155353

Part of ISSN: 21505942 21505934
Contributors: Zhang, Y.; He, S.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach

Journal of Alloys and Compounds
2017 | Journal article
DOI: 10.1016/j.jallcom.2016.11.064
EID:

2-s2.0-85006821333

Part of ISSN: 09258388
Contributors: Liu, X.; He, S.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Interfacial reaction between Sn-Ag-Cu-Mg solder and enig substrate

Key Engineering Materials
2016 | Book
DOI: 10.4028/www.scientific.net/KEM.701.216
EID:

2-s2.0-84979587273

Part of ISSN: 16629795 10139826
Contributors: Nishikawa, H.; Alhazaa, A.N.; He, S.; Almajid, A.A.; Soliman, M.S.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Thermally stable Cu<sub>3</sub>Sn/Cu composite joint for high-temperature power device

Scripta Materialia
2016 | Journal article
DOI: 10.1016/j.scriptamat.2015.08.011
EID:

2-s2.0-84943353132
Contributors: Liu, X.; He, S.; Nishikawa, H.
Source: Self-asserted source
Siliang He via Scopus - Elsevier

Low temperature bonding using microscale Cu particles coated with thin Sn layers at 200 °C

2016 International Conference on Electronics Packaging (ICEP)
2016-04 | Other
DOI: 10.1109/icep.2016.7486835
Contributors: Xiangdong Liu; Siliang He; Hiroshi Nishikawa
Source: Self-asserted source
Siliang He via Crossref Metadata Search
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Preferred source (of 2)‎

Peer review (4 reviews for 3 publications/grants)

Review activity for Electronic Materials Letters. (1)
Review activity for Electronic materials letters. (1)
Review activity for Science and technology of welding & joining. (2)
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