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Employment (6)

Dalian University of Technology （大连理工大学）: Dalian, Liaoning, CN

2018-12-29 to present | Professor (School of Materials Science and Engineering)
Employment
Source: Self-asserted source
Ning Zhao

Dalian University of Technology （大连理工大学）: Dalian, Liaoning, CN

2012-01 to 2018-12-28 | Associate Professor (School of Materials Science and Engineering)
Employment
Source: Self-asserted source
Ning Zhao

Georgia Institute of Technology: Atlanta, GA, US

2016-09 to 2017-09 | Visiting Scholar (School of Materials Science and Engineering)
Employment
Source: Self-asserted source
Ning Zhao

Dalian University of Technology: Dalian, Liaoning, CN

2011-08 to 2011-12 | Lecturer (School of Materials Science and Engineering)
Employment
Source: Self-asserted source
Ning Zhao

中科院微电子研究所: 北京, CN

2009-04 to 2011-08 | 博士后/助理研究员 (系统封装技术研究室)
Employment
Source: Self-asserted source
Ning Zhao

香港城市大学: 香港, CN

2004-11-11 to 2005-10-11 | 研究助理 (物理与材料科学系)
Employment
Source: Self-asserted source
Ning Zhao

Education and qualifications (2)

大连理工大学: 大连, 辽宁省, CN

2003-08-01 to 2008-12-01 | 博士 (材料学专业)
Education
Source: Self-asserted source
Ning Zhao

东北大学: 沈阳, 辽宁省, CN

1999-09-01 to 2003-07-01 | 学士 (材料物理专业)
Education
Source: Self-asserted source
Ning Zhao

Works (25)

Anisotropy-induced reliability issues and grain orientation control in Sn-based micro solder joints for advanced packaging

Journal of Materials Science & Technology
2025-07 | Journal article
DOI: 10.1016/j.jmst.2024.10.044
Contributors: Yuanyuan Qiao; Ning Zhao
Source: check_circle
Crossref

Orientation optimization of interfacial IMC on (001)-oriented ultra-large-grain copper plating for advanced electronic packaging

Vacuum
2025-03 | Journal article
DOI: 10.1016/j.vacuum.2024.113988
Contributors: Shi Chen; Jiadong Luo; Yuanxin Mao; Jun Liu; Yuanyuan Qiao; Ning Zhao
Source: check_circle
Crossref

Long-Term Dynamic Stability of the Interfacial Cu6Sn5 Texture in SAC305/Cu Joints by Laser Jet Solder Ball Bonding for Advanced Packaging

ACS Applied Materials & Interfaces
2025-03-02 | Journal article
DOI: 10.1021/acsami.4c22954
Contributors: Di Liu; Tianyue Bai; Yuanyuan Qiao; Wei Dong; Ning Zhao
Source: check_circle
Crossref

Combined effect of Ag element and temperature gradient on the formation of highly orientated Sn grains in micro solder joints

Journal of Materials Research and Technology
2024-07 | Journal article
DOI: 10.1016/j.jmrt.2024.07.020
Contributors: Yuanyuan Qiao; Taikun Hao; Yanqing Lai; Hongwei Liang; Ning Zhao
Source: check_circle
Crossref

Effects of In addition on the properties of Sn–4Ag–0.5Cu–3Bi–0.05Ni solder

Journal of Materials Science: Materials in Electronics
2024-07 | Journal article
DOI: 10.1007/s10854-024-13088-0
Contributors: Caihong Gao; Yuanyuan Qiao; Ning Zhao
Source: check_circle
Crossref

Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient

Journal of Materials Science
2023-03 | Journal article
DOI: 10.1007/s10853-023-08310-z
Contributors: Yuanyuan Qiao; Hongwei Liang; Ning Zhao
Source: check_circle
Crossref

Formation and Growth Mechanism of Laminar Cu6Sn5 with Ultrafine Grains on Nanocrystalline Cu by Interfacial Reaction with Sn

Advanced Materials Interfaces
2022-09 | Journal article
DOI: 10.1002/admi.202200732
Contributors: Shi Chen; Xiaolei Ren; Yuanyuan Qiao; Yanfeng Du; Yanqing Lai; Ning Zhao
Source: check_circle
Crossref

Formation and evolution of irregularly arranged prism-type Cu6Sn5 grains on electroplated (111) textured Cu

Journal of Materials Science
2022-02 | Journal article
DOI: 10.1007/s10853-022-06918-1
Contributors: Yiling Li; Xiaolei Ren; Shi Chen; Yuanyuan Qiao; Ning Zhao
Source: check_circle
Crossref

Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient

Acta Materialia
2021-09 | Journal article
DOI: 10.1016/j.actamat.2021.117168
Contributors: Yuanyuan Qiao; Haitao Ma; Fengyun Yu; Ning Zhao
Source: check_circle
Crossref

Heredity of preferred orientation of β-Sn grains in Cu/SAC305/Cu micro solder joints

Journal of Alloys and Compounds
2021-07 | Journal article
DOI: 10.1016/j.jallcom.2021.159146
Contributors: Yuanyuan Qiao; Ning Zhao; Haitao Ma
Source: check_circle
Crossref

Strategies for inducing heredity of β-Sn texture in micro solder joints during multi-reflow process

Materials & Design
2021-06 | Journal article
DOI: 10.1016/j.matdes.2021.109671
Contributors: Yuanyuan Qiao; Xiaoying Liu; Haitao Ma; Ning Zhao
Source: check_circle
Crossref

Effects of cooling rate and joint size on Sn grain features in Cu/Sn–3.5Ag/Cu solder joints

Materialia
2020-12 | Journal article
DOI: 10.1016/j.mtla.2020.100929
Contributors: Z.Y. Chang; N. Zhao; C.M.L. Wu
Source: check_circle
Crossref

Liquid structure of Sn-Ag-xCu solders and its effect on the formation and growth of interfacial Cu6Sn5

Journal of Materials Science
2020-09-12 | Journal article
DOI: 10.1007/s10853-020-04894-y
Contributors: Ning Zhao; Xuemin Pan
Source: check_circle
Crossref

Analysis and control of Cu6Sn5 preferred nucleation on single crystal (0 0 1)Cu

Materials Letters
2020-04 | Journal article
DOI: 10.1016/j.matlet.2020.127327
Contributors: H.R. Ma; C. Dong; N. Zhao; Y.P. Wang; X.G. Li; H.T. Ma; J. Chen
Source: check_circle
Crossref

Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs

Journal of Electronic Materials
2018-12-24 | Journal article
DOI: 10.1007/s11664-018-6701-z
Contributors: Mingjun Yao; Ning Zhao; Teng Wang; Daquan Yu; Zhiyi Xiao; Haitao Ma
Source: check_circle
Crossref

Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps

IEEE Transactions on Components, Packaging and Manufacturing Technology
2018-10 | Journal article
DOI: 10.1109/TCPMT.2018.2837118
Contributors: Mingjun Yao; Ning Zhao; Teng Wang; Daquan Yu; Zhiyi Xiao; Haitao Ma
Source: check_circle
Crossref

In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross-interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient

Materials Chemistry and Physics
2018-09 | Journal article
DOI: 10.1016/j.matchemphys.2018.06.009
Contributors: Y. Zhong; N. Zhao; W. Dong; Y.P. Wang; H.T. Ma
Source: check_circle
Crossref

Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy

Microelectronics Reliability
2018-04 | Journal article
DOI: 10.1016/j.microrel.2018.02.013
Contributors: Haoran Ma; Anil Kunwar; Jun Chen; Lin Qu; Yunpeng Wang; Xueguan Song; Peter Råback; Haitao Ma; Ning Zhao
Source: check_circle
Crossref

Effect of Zn content on Cu–Ni cross-interaction in Cu/Sn–xZn/Ni micro solder joints

Journal of Materials Science: Materials in Electronics
2018-03-08 | Journal article
DOI: 10.1007/s10854-017-8469-y
Contributors: N. Zhao; M. Y. Wang; Y. Zhong; H. T. Ma; Y. P. Wang; C. P. Wong
Source: check_circle
Crossref

Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient

Applied Physics Letters
2017-11-27 | Journal article
DOI: 10.1063/1.5010266
Contributors: Y. Zhong; N. Zhao; C. Y. Liu; W. Dong; Y. Y. Qiao; Y. P. Wang; H. T. Ma
Source: check_circle
Crossref

In situ study on liquid structure of Sn during Sn/Cu liquid–solid interfacial reaction by fluorescence XAFS

Journal of Materials Science: Materials in Electronics
2017-06-28 | Journal article
DOI: 10.1007/s10854-017-6610-6
Contributors: N. Zhao; M. J. Yao; H. T. Ma; C. P. Wong
Source: check_circle
Crossref

Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration

Journal of Materials Science: Materials in Electronics
2017-06-13 | Journal article
DOI: 10.1007/s10854-017-6642-y
Contributors: Mingjun Yao; Jun Fan; Ning Zhao; Zhiyi Xiao; Daquan Yu; Haitao Ma
Source: check_circle
Crossref

Comment on “Electric current induced flow of liquid metals: Mechanism and substrate-surface effects” [J. Appl. Phys. 115, 044915 (2014)]

Journal of Applied Physics
2017-04-07 | Journal article
DOI: 10.1063/1.4979876
Contributors: Z. J. Zhang; M. L. Huang; N. Zhao
Source: check_circle
Crossref

Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition

Journal of Alloys and Compounds
2017-02 | Journal article
DOI: 10.1016/j.jallcom.2016.10.280
Contributors: Y. Zhong; N. Zhao; H.T. Ma; W. Dong; M.L. Huang
Source: check_circle
Crossref

Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect

Applied Physics Letters
2017-02-27 | Journal article
DOI: 10.1063/1.4977858
Contributors: N. Zhao; Y. Zhong; W. Dong; M. L. Huang; H. T. Ma; C. P. Wong
Source: check_circle
Crossref

Peer review (77 reviews for 12 publications/grants)

Review activity for Intermetallics. (3)
Review activity for Journal of materials processing technology. (2)
Review activity for Journal of Materials Research and Technology. (20)
Review activity for Journal of Materials Science and Technology. (6)
Review activity for Journal of materials science. (1)
Review activity for Journal of materials science. Materials in electronics (10)
Review activity for Materials characterization. (14)
Review activity for Materials science & engineering. (2)
Review activity for Materials science in semiconductor processing. (6)
Review activity for Materials today communications. (9)
Review activity for Scripta materialia. (1)
Review activity for Vacuum. (3)
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