Personal information

Websites & social links

UCAS
Researchgate

Other IDs

ResearcherID: G-4635-2017

Keywords

Electronic Packaging, Interconnection Materials, Microstructure and Property, Failure Analysis and Service Reliability

Countries

China, Japan, United Kingdom, United States

Activities

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Employment (1)

中国科学院金属研究所: 沈阳, 辽宁, CN

2006-12-25 to present | 研究员，课题组长 (沈阳材料科学国家实验室)
Employment
Source: Self-asserted source
Zhi-Quan Liu

Education and qualifications (3)

大连海事大学: 大连, 辽宁, CN

1996-09-01 to 2000-04-30 | 博士 (材料工艺研究所)
Education
Source: Self-asserted source
Zhi-Quan Liu

大连铁道学院: 大连, 辽宁, CN

1993-09-01 to 1996-07-30 | 硕士 (材料科学与工程系)
Education
Source: Self-asserted source
Zhi-Quan Liu

吉林工业大学: 长春, 辽宁, CN

1989-09-01 to 1993-07-30 | 本科 (金属材料科学与工程系)
Education
Source: Self-asserted source
Zhi-Quan Liu

Peer review (7 reviews for 5 publications/grants)

Review activity for Crystal growth & design. (2)
Review activity for Journal of materials science. Materials in electronics (2)
Review activity for Journal of the Taiwan Institute of Chemical Engineers. (1)
Review activity for Materials characterization. (1)
Review activity for The journal of physical chemistry letters. (1)
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