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Employment (1)

Samsung Electronics: Hwasung-Si, Gyeonggi-do, KR

2020-09-01 to present | Engineer (Quality Assurance Department)
Employment
Source: Self-asserted source
Youngbong Han

Education and qualifications (1)

Sungkyunkwan University - Natural Sciences Campus: Suwon, Gyeonggi-do, KR

2015-03-02 to 2020-08-31 | Ph.D (Department of Electrical and Computer Engineering)
Education
Source: Self-asserted source
Youngbong Han

Works (6)

Investigation on Board-Level CDM in SSD Products and Replication of Line ESD Phenomena

2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
2022-07-18 | Conference paper
Contributors: Jungho Jin; Youngbong Han; Byungjin Kown; Iloh Jang; Namhyun Lee; Seungbae Lee; Yuchul Hwang; Hoosung Kim; Sangwoo Pae
Source: Self-asserted source
Youngbong Han

Built-in Ring Transmission Line Structure for Signal Integrity Optimization of PAM4 Signaling in PCBs

IEEE Transactions on Electromagnetic Compatibility
2021-12 | Journal article
Contributors: Hung Khac Le; Hoang Van Nguyen; Youngbong Han; SoYoung Kim
Source: check_circle
Crossref

Periodic Ground Structure for C-PHY Signaling in Mobile Applications

JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE
2021-10-31 | Journal article
Part of ISSN: 1598-1657
Part of ISSN: 2233-4866
Source: Self-asserted source
Youngbong Han

Radio Frequency Interference Analysis of Camera Modules and Antennas in Smartphones

IEIE Transactions on Smart Processing & Computing
2019-08-31 | Journal article
Part of ISSN: 2287-5255
Source: Self-asserted source
Youngbong Han

Design and Analysis of the DC–DC Converter With a Frequency Hopping Technique for EMI Reduction

IEEE Transactions on Components, Packaging and Manufacturing Technology
2018-04 | Journal article
Contributors: Hai Au Huynh; Youngbong Han; Sanghyeok Park; Jisoo Hwang; Eunseok Song; SoYoung Kim
Source: check_circle
Crossref

Pinwheel Meander-Perforated Plane Structure for Mitigating Power/Ground Noise in System-in-Package

IEEE Transactions on Components, Packaging and Manufacturing Technology
2018-04 | Journal article
Contributors: Youngbong Han; Hai Au Huynh; SoYoung Kim
Source: check_circle
Crossref