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Works (7)

Boron carbide films with reduced nodular defect density deposited by full-face erosion radio-frequency magnetron sputtering

Journal of Vacuum Science & Technology A
2024-07-01 | Journal article
DOI: 10.1116/6.0003571
Contributors: G. V. Taylor; L. B. Bayu Aji; S. J. Shin; J. H. Bae; A. M. Engwall; S. O. Kucheyev
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Magnetron sputter deposition of boron carbide in Ne and Ar plasmas

Journal of Applied Physics
2024-02-28 | Journal article
DOI: 10.1063/5.0193653
Contributors: S. J. Shin; L. B. Bayu Aji; J. H. Bae; A. M. Engwall; J. A. Hammons; G. V. Taylor; L. R. Sohngen; P. B. Mirkarimi; S. O. Kucheyev
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Deposition of ultrathick heavy-metal alloys on rotating substrates by high-power impulse magnetron sputtering: Target erosion effects

Journal of Applied Physics
2024-01-21 | Journal article
DOI: 10.1063/5.0186803
Contributors: S. J. Shin; J. H. Bae; A. M. Engwall; L. B. Bayu Aji; A. A. Baker; G. V. Taylor; J. B. Merlo; L. R. Sohngen; J. D. Moody; S. O. Kucheyev
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Radio-frequency magnetron sputter deposition of ultrathick boron carbide films

Journal of Vacuum Science & Technology A
2023-03 | Journal article
DOI: 10.1116/6.0002211
Contributors: L. B. Bayu Aji; S. J. Shin; J. H. Bae; A. M. Engwall; J. A. Hammons; S. T. Sen-Britain; P. B. Mirkarimi; S. O. Kucheyev
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Reactive co-sputtering of ternary Au–Ta–O films with tunable electrical resistivity

Applied Physics Letters
2022-10-03 | Journal article
DOI: 10.1063/5.0106774
Contributors: S. J. Shin; L. B. Bayu Aji; A. M. Engwall; J. H. Bae; A. A. Baker; J. D. Moody; S. O. Kucheyev
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Effect of substrate temperature on sputter-deposited boron carbide films

Journal of Applied Physics
2022-02-21 | Journal article
DOI: 10.1063/5.0074470
Contributors: L. B. Bayu Aji; S. J. Shin; J. H. Bae; A. M. Engwall; J. A. Hammons; X. Lepró; N. Catarineu; P. B. Mirkarimi; S. O. Kucheyev
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Gold-tantalum alloy films deposited by high-density-plasma magnetron sputtering

Journal of Applied Physics
2021-10-28 | Journal article
DOI: 10.1063/5.0050901
Contributors: J. H. Bae; L. B. Bayu Aji; S. J. Shin; A. M. Engwall; M. H. Nielsen; A. A. Baker; S. K. McCall; J. D. Moody; S. O. Kucheyev
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