Personal information

South Korea

Activities

Works (1)

Growth of tantalum nitride film as a Cu diffusion barrier by plasma-enhanced atomic layer deposition from bis((2-(dimethylamino)ethyl)(methyl)amido)methyl(tert-butylimido)tantalum complex

Applied Surface Science
2016-01 | Journal article
Contributors: Jeong Hwan Han; Hyo Yeon Kim; Sang Chan Lee; Da Hye Kim; Bo Keun Park; Jin-Seong Park; Dong Ju Jeon; Taek-Mo Chung; Chang Gyoun Kim
Source: check_circle
Crossref