Personal information

Activities

Employment (3)

Intel Corporation: Chandler, AZ, US

2020-01-06 to present | Packaging R&D Engineer
Employment
Source: Self-asserted source
Yi Shi

Northwestern University: Evanston, IL, US

2015-09 to 2019-12 | Research Assistant (Mechanical Engineering)
Employment
Source: Self-asserted source
Yi Shi

University of Electronic Science and Technology of China: Chengdu, Sichuan Province, CN

2013-09-01 to 2014-06-28 | Research Assistant (Mechatronics Engineering)
Employment
Source: Self-asserted source
Yi Shi

Education and qualifications (2)

Northwestern University: Evanston, IL, US

2014-09-10 to 2019-12-14 | Graduate Student (Mechanical Engineering)
Education
Source: Self-asserted source
Yi Shi

University of Electronic Science and Technology of China: Chengdu, Sichuan Province, CN

2010-09-01 to 2014-06-28 | Undergraduate Student (Mechatronics Engineering)
Education
Source: Self-asserted source
Yi Shi

Works (7)

High-throughput, in situ imaging of multi-layer powder-blown directed energy deposition with angled nozzle

Review of Scientific Instruments
2022-02-01 | Journal article
Contributors: Samantha Webster; Marco Giovannini; Yi Shi; Nicolas Martinez-Prieto; Kamel Fezzaa; Tao Sun; Kornel Ehmann; Jian Cao
Source: check_circle
Crossref

Surface hardening of metals at room temperature by nanoparticle-laden cavitating waterjets

Journal of Materials Processing Technology
2020-01 | Journal article
Contributors: Xingliang He; Miao Song; Yao Du; Yi Shi; Blake A. Johnson; Kornel F. Ehmann; Yip-Wah Chung; Q. Jane Wang
Source: check_circle
Crossref

Texturing of metallic surfaces for superhydrophobicity by water jet guided laser micro-machining

Applied Surface Science
2020-01 | Journal article
Contributors: Yi Shi; Zilin Jiang; Jian Cao; Kornel F. Ehmann
Source: check_circle
Crossref

Multi-scale modeling of mechanical behavior of cured woven textile composites accounting for the influence of yarn angle variation

Composites Part A: Applied Science and Manufacturing
2019-09 | Journal article
Contributors: Biao Liang; Weizhao Zhang; Joel S. Fenner; Jiaying Gao; Yi Shi; Danielle Zeng; Xuming Su; Wing K. Liu; Jian Cao
Source: check_circle
Crossref

Experimental study of water jet incremental micro-forming with supporting dies

Journal of Materials Processing Technology
2019-06 | Journal article
Contributors: Yi Shi; Weizhao Zhang; Jian Cao; Kornel F. Ehmann
Source: check_circle
Crossref

A novel piezoelectrically actuated 2-DoF compliant micro/nano-positioning stage with multi-level amplification

Review of Scientific Instruments
2016-10 | Journal article
Contributors: Wu-Le Zhu; Zhiwei Zhu; Yi Shi; Xiangfan Chen; Yu He; Kornel F. Ehmann; Bing-Feng Ju
Source: check_circle
Crossref

Metamodel-based direction guidance system optimization for improving efficiency of aircraft emergency evacuation

Computers & Industrial Engineering
2016-01 | Journal article
Contributors: Yu Liu; Yi Shi; Tao Jiang; Jian-Zhou Liu; Wei-Jie Wang
Source: check_circle
Crossref

Peer review (22 reviews for 5 publications/grants)

Review activity for Journal of manufacturing processes. (12)
Review activity for Journal of materials processing technology. (4)
Review activity for Materials science in semiconductor processing. (2)
Review activity for Measurement. (2)
Review activity for Optics and Laser Technology. (2)