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Dr. Richard Xian-Ke GAO is a senior principal scientist with the Institute of High Performance Computing (IHPC), A*STAR, Singapore. He is the manager of electromagnetic engineering research group in IHPC. He received his PhD degree from National University of Singapore, MEng and BEng degrees from Huazhong University of Science and technology of China, respectively. Prior to IHPC, he was a staff engineer in Seagate Technology Ltd and an assistant professor in Huazhong University of Science and Technology. He has worked in different universities, research institutes, and industrial companies over 30 years. He also holds visiting professor appointments with several universities.
Dr. Gao is fellow of IET, senior member of IEEE (including AP, MTT, RFID) and member of URSI. He served as associate editors (guest editors) of IEEE Transactions on Electromagnetic Compatibility and Transactions on Microwave Theory and Techniques, and currently serves as Associate Editor of IEEE Antennas and Wireless Propagation Letters. He is general co-chair of 2026 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC). He served as TPC chair of 2023 IEEE Singapore Workshop on Antennas (SWA), TPC chair of 2020 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, TPC chair of 2019 IEEE Asia-Pacific Microwave Conference (APMC), TPC chair and special sessions committee chair of 2018 joint IEEE EMC and APEMC Symposium. He was the general chair of 2011 IEEE Singapore EMC Workshop. He served as TC chairs of APEMC 2021 and APEMC 2022, OC/TPC member and exhibition chair of IEEE APS/URSI 2021 and IEEE SWA 2022. He has served as TPC member and session chair of APEMC since 2008. He was the TPC member of 2021 joint IEEE EMC SI/PI and EMC Europe, GSMM 2012, and IEEE GEMCCon 2023. Dr. Gao serves on the TPC board (standing member) of EMC COMPO, and the international editorial board of EMC Europe since 2018. He was the technical subcom chair of PIERS 2017, and publication chairs of EDAPS 2010 and APEMC 2008/2012. He was session/track chairs EMC Europe 2017-2020. He served as the chairman of IEEE Singapore EMC Chapter (2010–2011 & 2016-2017), vice-chair (2014–2015 & 2020-2021), and other executive positions in chapters of EMC, RFID, and other societies. He also serves on many review boards of prestigious international journals and conferences. Dr. Gao authored and co-authored 150+ peer reviewed papers/articles/books on prestigious journals and conferences. He led a lot of industrial/research projects and products development. He is an invited speaker for technical talks in various international conferences, workshops, universities and industrial companies.
Dr. Gao received numerous awards for excellent contributions and achievements. He was bestowed the “Technical Achievement Award” from IEEE EMC Society in 2019. He was elected as IEEE EMC Society Distinguished Lecturer for the term of 2018-2019. He received the “Achievement Award” from Aerospace Programme of Singapore in 2018. He was the recipient of the “Best Symposium Paper” Award at APEMC in 2016 and “Distinguished Reviewer Award” from IEEE Transactions on Electromagnetic Compatibility in 2023. He has been granted the IHPC Best Industry Project awards and Best Teamwork Project award in consecutive years. He was nominated for the “President’s Science & Technology Award” of Singapore in 2012. Dr. Gao received the Notable Service Award from IEEE, Outstanding Service Award from IEEE EMC Society, and Excellent Service Award from IEEE Singapore Section. He was also bestowed the Outstanding Contribution Award in APEMC 2012. He has been included in the Who’s Who in Science and Engineering and Who’s Who in the World from 2011. Serving as the chairperson, the EMC Singapore chapter was bestowed the 2010 Best Chapter-of-the-Year and 2011 Best Chapter-of-the-Year awards from IEEE EMC Society and 2011 Best Chapter in Singapore from IEEE Singapore Section.
His main research interests include computational and applied electromagnetics, electromagnetic compatibility, electrostatic discharge, lightning, metamaterial/metasurface, AI/deep learning, microwave, antenna and RFID, wireless energy transfer and harvesting, bio-electromagnetics, THz, quantum electromagnetics, robust design and optimization, and CAD/CAE/CAM.