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Terahertz Nondestructive Characterization of Conformal Coatings for Microelectronics Packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology
2024-01 | Journal article
DOI: 10.1109/TCPMT.2023.3347298
Contributors: Haolian Shi; Serena Calvelli; Min Zhai; Marco Ricci; Stefano Laureti; P. Singh; H. Fu; Alexandre Locquet; D. S. Citrin
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Peer review (2 reviews for 1 publication/grant)

Review activity for Mechanical systems and signal processing. (2)
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