Personal information

Other IDs

Scopus Author ID: 57202939042

Keywords

Hybrid bonding, 2.5D/3D packaging, chip stacking, TSVs/TGVs

Countries

Singapore, India

Activities

Collapse all

Employment (2)

Institute of Microelectronics: Singapore, Singapore, SG

2022-04-25 to present | Scientist I
Employment
Source: Self-asserted source
Dileep Kumar Mishra

Indian Institute of Technology Bombay: Mumbai, Maharashtra, IN

2017-07-13 to 2022-04-11 | PhD Research Scholar (Mechanical engineering)
Employment
Source: Self-asserted source
Dileep Kumar Mishra

Education and qualifications (3)

Indian Institute of Technology Bombay: Mumbai, Maharashtra, IN

2017-07-13 to present | Ph.D. research scholar (Mechanical Engineering)
Qualification
Source: Self-asserted source
Dileep Kumar Mishra

National Institute of Technology Rourkela: Rourkela, Orissa, IN

2015-07-15 to 2017-06-30 | Student (Mechanical Engineering)
Qualification
Source: Self-asserted source
Dileep Kumar Mishra

Vellore Institute of Technology University: Vellore, Tamil Nadu, IN

2010-07-07 to 2014-05-30 | Student (Mechanical Engineering)
Qualification
Source: Self-asserted source
Dileep Kumar Mishra

Works (34)

Dielectric Stack Optimization for Die-level Warpage Reduction for Chip-to-Wafer Hybrid Bonding

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
2024-05-28 | Conference paper
DOI: 10.1109/ectc51529.2024.00019
Contributors: B.S.S. Chandra Rao; Mishra Dileep Kumar; Vasarla Nagendra Sekhar; Ismael Cereno Daniel; Sasi Kumar Tippabhotla; Ser Choong Chong; Hemanth Kumar C; Vempati Srinivasa Rao
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
2024-05-28 | Conference paper
DOI: 10.1109/ectc51529.2024.00345
Contributors: Vasarla Nagendra Sekhar; Mishra Dileep Kumar; Sasi Kumar Tippabhotla; B. S. S. Chandra Rao; Ismael Cereno Daniel; Ser Choong Chong; Vempati Srinivasa Rao
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
2024-05-28 | Conference paper
DOI: 10.1109/ectc51529.2024.00102
Contributors: Mishra Dileep Kumar; Vasarla Nagendra Sekhar; B.S.S. Chandra Rao; Ser Choong Chong; Vempati Srinivasa Rao
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Improved waveguide surface roughness by foundry-processing techniques for enhanced light delivery to integrated ion trap for quantum computing platforms

Optical Interconnects XXIV
2024-03-11 | Conference paper
DOI: 10.1117/12.3001329
Contributors: Simon Chun Kiat Goh; Adrian Utama; Haitao Yu; Yan Yan Zhou; Mishra Dileep; Clarence Liu; Morteza Ahmadi; Victor Leong; Manas Mukherjee; Chui King-Jien et al.
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Evaluation of Low Temperature Inorganic Dielectric Materials for Hybrid Bonding Applications

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
2023-12-05 | Conference paper
DOI: 10.1109/eptc59621.2023.10457606
Contributors: Mishra Dileep Kumar; Vasarla Nagendra Sekhar; Chong Ser Choong; B.S.S. Chandra Rao; King-Jien Chui; Vempati Srinivasa Rao
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Polymer Dielectric Materials Evaluation for Hybrid Bonding Applications

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
2023-12-05 | Conference paper
DOI: 10.1109/eptc59621.2023.10457892
Contributors: Vasarla Nagendra Sekhar; Takenori Fujiwara; Hitoshi Araki; Yu Shoji; Masaya Jukei; Kota Nomura; Mishra Dileep Kumar; Chong Ser Choong; Vempati Srinivasa Rao
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Process Development and Integration on Si Substrate for Ion trap-based Quantum Processors

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
2023-12-05 | Conference paper
DOI: 10.1109/eptc59621.2023.10457687
Contributors: H. Y. Li; Clarence Liu Huihong; Norhanani Jaafar; Morteza Ahmadi; Mishra Dileep Kumar; Goh Chun Kiat Simonl; Zhou YanYan; Manas Mukherjee; Chui King Jien
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
2023-12-05 | Conference paper
DOI: 10.1109/eptc59621.2023.10457883
Contributors: Ser Choong Chong; Jason Au Keng Yuen; Vasarla Nagendra Sekhar; Ismael Cereno Daniel; Mishra Dileep Kumar; Vempati Srinivasa Rao
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Etching of micro-channels in fused quartz for novel device applications

Materials Today: Proceedings
2023-08 | Journal article
DOI: 10.1016/j.matpr.2023.07.253
Part of ISSN: 2214-7853
Contributors: Shubhava Shetty; Dileep Kumar Mishra; Pradeep Dixit; Shrushti S Shetty; A. Jayarama; Amit P. shah; Mahesh R. gokhale; Shriganesh Prabhu; S.P Duttagupta; Richard Pinto
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
2023-05 | Conference paper
DOI: 10.1109/ectc51909.2023.00100
Contributors: Vasarla Nagendra Sekhar; Mishra Dileep Kumar; Prayudi Lianto; Ser Choong Chong; Vempati Srinivasa Rao
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Automated Analysis of AFM Data of High-Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) and Chip-to-Wafer (C2W) Hybrid Bonding

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
2022-12-07 | Conference paper
DOI: 10.1109/eptc56328.2022.10013174
Contributors: Jiakai Chen; Yong Chyn Ng; Dileep K. Mishra; K. J. Chui
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Evaluation of Polymer Materials for Hybrid Bonding Application

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
2022-12-07 | Conference paper
DOI: 10.1109/eptc56328.2022.10013162
Contributors: Dileep Kumar Mishra; V. N. Sekhar; Chong Ser Choong; Vempati Srinivasa Rao
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Thin Memory Chip Fabrication for Multi-stack Hybrid Bonding Applications

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
2022-12-07 | Conference paper
DOI: 10.1109/eptc56328.2022.10013147
Contributors: V. N. Sekhar; Dileep Kumar Mishra; Chong Ser Choong; Vempati Srinivasa Rao
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Fabrication of 3D microstructures in glass by direct writing electrochemical discharge machining

Materials and Manufacturing Processes
2022-11 | Journal article
DOI: 10.1080/10426914.2022.2146718
Part of ISSN: 1042-6914
Contributors: Dileep Kumar Mishra; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Electrochemical Discharge Machining

Advanced Machining Science
2022-07 | Other
DOI: 10.1201/9780429160011-13
Contributors: Dileep Kumar Mishra; Julfekar Arab; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications

Applied Surface Science
2022-05 | Journal article
DOI: 10.1016/j.apsusc.2022.152494
Part of ISSN: 0169-4332
Contributors: Vishnu Kant Bajpai; Dileep Kumar Mishra; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Effect of pulse frequency and duty cycle on electrochemical dissolution behavior of multi-tip array tool electrode for reusability in the ECDM process

Journal of Applied Electrochemistry
2022-01 | Journal article
DOI: 10.1007/s10800-021-01662-x
Part of ISSN: 0021-891X
Contributors: Tarlochan Singh; Dileep Kumar Mishra; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Experimental investigation into tool wear behaviour of line-array tool electrode during the electrochemical discharge micromilling process

Journal of Manufacturing Processes
2021 | Journal article
DOI: 10.1016/j.jmapro.2021.10.009
Part of ISSN: 1526-6125
Contributors: Dileep Kumar Mishra; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Cathode shape prediction for uniform electrochemical dissolution of array tools for ECDM applications

Materials and Manufacturing Processes
2021-11-10 | Journal article
DOI: 10.1080/10426914.2021.2001520
Part of ISSN: 1042-6914
Contributors: Dileep Kumar Mishra; Tarlochan Singh; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Measurement and analysis of the geometric characteristics of microholes and tool wear for varying tool-workpiece gaps in electrochemical discharge drilling

Measurement
2021-01 | Journal article
DOI: 10.1016/j.measurement.2020.108463
Part of ISSN: 0263-2241
Contributors: Julfekar Arab; Dileep Kumar Mishra; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Experimental investigations into alumina ceramic micromachining by electrochemical discharge machining process

Procedia Manufacturing
2020 | Journal article
DOI: 10.1016/j.promfg.2020.05.044
Part of ISSN: 2351-9789
Contributors: Priyaranjan Sharma; Dileep Kumar Mishra; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Role of tool-substrate gap in the micro-holes formation by electrochemical discharge machining

Procedia Manufacturing
2020 | Journal article
DOI: 10.1016/j.promfg.2020.05.073
Part of ISSN: 2351-9789
Contributors: Julfekar Arab; Dileep Kumar Mishra; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Fabrication and Characterization of Through-glass vias (TGV) based 3D Spiral and Toroidal Inductors by Cost-effective ECDM Process

2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
2020-06 | Other
DOI: 10.1109/ectc32862.2020.00191
Contributors: Harindra K. Kannojia; Julfekar Arab; Aboobackkar Sidhique; Dileep K. Mishra; Ritesh Kumar; Jaisingh Pednekar; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Effect of Tool Electrode-Workpiece Gap in the Microchannel Formation by Electrochemical Discharge Machining

ECS Journal of Solid State Science and Technology
2020-03 | Journal article
DOI: 10.1149/2162-8777/ab80b1
Part of ISSN: 2162-8777
Contributors: Dileep Kumar Mishra; Karan Pawar; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Investigations into surface topography of glass microfeatures formed by pulsed electrochemical discharge milling for microsystem applications

Microsystem Technologies
2020-02-05 | Journal article
DOI: 10.1007/s00542-020-04770-4
Part of ISSN: 0946-7076
Part of ISSN: 1432-1858
Source: Self-asserted source
Dileep Kumar Mishra

Fabrication of Deep Microfeatures in Glass Substrate using Electrochemical Discharge Machining for Biomedical and Microfluidic Applications

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
2019 | Other
DOI: 10.1109/eptc47984.2019.9026714
Contributors: Dileep Kumar Mishra; Julfekar Arab; Karan Pawar; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Micro array hole formation in glass using electrochemical discharge machining

Procedia Manufacturing
2019 | Journal article
DOI: 10.1016/j.promfg.2019.06.174
Part of ISSN: 2351-9789
Source: Self-asserted source
Dileep Kumar Mishra

Numerical and experimental analysis of high-aspect-ratio micro-tool electrode fabrication using controlled electrochemical machining

Journal of Applied Electrochemistry
2019-12-18 | Journal article
DOI: 10.1007/s10800-019-01380-5
Part of ISSN: 0021-891X
Part of ISSN: 1572-8838
Source: Self-asserted source
Dileep Kumar Mishra

Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging

Journal of Materials Processing Technology
2019-09 | Journal article
DOI: 10.1016/j.jmatprotec.2019.04.032
Part of ISSN: 0924-0136
Contributors: Julfekar Arab; Dileep Kumar Mishra; Harindra Kumar Kannojia; Pratik Adhale; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

High Aspect Ratio Glass Micromachining by Multi-Pass Electrochemical Discharge Based Micromilling Technique

ECS Journal of Solid State Science and Technology
2019-06-10 | Journal article
DOI: 10.1149/2.0191906jss
Part of ISSN: 2162-8769
Contributors: Dileep Kumar Mishra; Julfekar Arab; Yashwant Magar; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining

Journal of Micromechanics and Microengineering
2019-04 | Journal article
DOI: 10.1088/1361-6439/ab1da7
Part of ISSN: 0960-1317
Contributors: Dileep Kumar Mishra; Aman Kumar Verma; Julfekar Arab; Deepak Marla; Pradeep Dixit
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Multi-Response Optimization during Electro-Discharge Machining of Super Alloy Inconel 718: Application of PCA-TOPSIS

Materials Today: Proceedings
2018 | Journal article
DOI: 10.1016/j.matpr.2017.11.691
Part of ISSN: 2214-7853
Source: Self-asserted source
Dileep Kumar Mishra

Through hole making by electro-discharge machining on Inconel 625 super alloy using hollow copper tool electrode

Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering
2018-06 | Journal article
DOI: 10.1177/0954408918784701
Part of ISSN: 0954-4089
Contributors: Dileep Kumar Mishra; ▪ Rahul; Saurav Datta; Manoj Masanta; Siba Sankar Mahapatra
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search

Effects of Tool Electrode on EDM Performance of Ti-6Al-4V

Silicon
2018-05-02 | Journal article
DOI: 10.1007/s12633-018-9760-0
Part of ISSN: 1876-990X
Contributors: Rahul; Dileep Kumar Mishra; Saurav Datta; Manoj Masanta
Source: Self-asserted source
Dileep Kumar Mishra via Crossref Metadata Search
How many people are using ORCID?