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Other IDs

Scopus Author ID: 56388877100

Keywords

Electronic packaging, Soldering, Solder joint, Solders, Reliability, Electro-thermo-mechanical coupled loads, Mechanical performance, Electromigration, Creep, Fracture, Shear, Tensile, Fatigue, Interfacial reaction, SnO2

Countries

China

Activities

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Education and qualifications (3)

South China University of Technology: Guangzhou, Guangdong, CN

2012-09 to 2017-12 | Ph. D Student (School of Materials Science and Engineering)
Education
Source: Self-asserted source
Wangyun Li

Loughborough University: Loughborough, England, GB

2017-06 to 2017-11 | Visiting Ph. D Student (The Wolfson School of Mechanical Electrical and Manufacturing Engineering)
Education
Source: Self-asserted source
Wangyun Li

Chongqing University of Science and Technology: Chongqing, CN

2008-09 to 2012-06 | Bachelor (Hons.) 1st Class (School of Metallurgy and Materials Engineering)
Education
Source: Self-asserted source
Wangyun Li

Professional activities (8)

The 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems: Orlando, FL, US

ITherm2023 review committee
Membership
Source: Self-asserted source
Wangyun Li

25th International Conference on Electronic Packaging Technology: Tianjin, CN

Member of Interconnection Technologies
Membership
Source: Self-asserted source
Wangyun Li

24th International Conference on Electronic Packaging Technology: Xinjiang, CN

Member of Interconnection Technologies
Membership
Source: Self-asserted source
Wangyun Li

23th International Conference on Electronic Packaging Technology: Dalian, CN

Member of Interconnection Technologies
Membership
Source: Self-asserted source
Wangyun Li

22th International Conference on Electronic Packaging Technology: Xiamen, CN

Best Student Paper Award
Distinction
Source: Self-asserted source
Wangyun Li

21th International Conference on Electronic Packaging Technology: Guangzhou, CN

ICEPT Best Student Paper Award (2nd place)
Distinction
Source: Self-asserted source
Wangyun Li

18th International Conference on Electronic Packaging Technology: Guilin, CN

2017 | ICEPT Outstanding Paper Award
Distinction
Source: Self-asserted source
Wangyun Li

16th International Conference on Electronic Packaging Technology: Guilin, CN

2015 | Cisco & ASE Best Student Paper Award
Distinction
Source: Self-asserted source
Wangyun Li

Funding (5)

Creep behavior and failure mechanism of Sn-based microscale lead-free solder joints in electronic packaging at low temperatures

2020-10 to 2022-09 | Grant
Engineering Research Center of Electronic Information Materials and Devices, Ministry of Education (Guilin, Guangxi, CN)
GRANT_NUMBER:

EIMD-AB202005
Source: Self-asserted source
Wangyun Li

Creep deformation and failure mechanism of Sn-based lead-free microsolder joints under extreme cold environment

2019-09 to 2021-08 | Grant
Guangxi Key Lab of Manufacturing System and Advanced Manufacturing Technology (Guilin, CN)
GRANT_NUMBER:

19-050-44-003Z
Source: Self-asserted source
Wangyun Li

Creep behavior of micro-bump solder joints with inhomogeneous configuration and microstructure under electro-thermo-mechanical coupled loads

2019-01 to 2021-12 | Grant
National Natural Science Foundation of China (Beijing, CN)
GRANT_NUMBER:

51805103
Source: Self-asserted source
Wangyun Li

Influence of the characteristics of electric current distribution on creep behavior of micro-bump solder joints under electro-thermo-mechanical coupled loads

2019-01 to 2021-12 | Grant
Natural Science Foundation of Guangxi Province (Nanning, Guangxi, CN)
GRANT_NUMBER:

2018GXNSFBA281065
Source: Self-asserted source
Wangyun Li

Creep behavior and failure mechanism of micro-bump solder joints with inhomogeneous configuration and microstructure under electro-thermo-mechanical coupled loads

2018-12 to 2021-11 | Grant
Science and Technology Planning Project of Guangxi Province of China (Nanning, Guangxi, CN)
GRANT_NUMBER:

Guike AD18281021
Source: Self-asserted source
Wangyun Li

Works (50 of 74)

Items per page:
Page 1 of 2

Electric current stressing enhanced damping properties in Sn5Sb solder

Soldering & Surface Mount Technology
2024-05-15 | Journal article
DOI: 10.1108/ssmt-02-2024-0005
Part of ISSN: 0954-0911
Part of ISSN: 0954-0911
Contributors: Linqiang Liu; Feng Chen; Wangyun Li
Source: Self-asserted source
Wangyun Li

Preparation of NiTip/Al composites with controllable phase transformation and damping behavior by friction stir processing

Science China Technological Sciences
2024-02 | Journal article
DOI: 10.1007/s11431-023-2487-y
Part of ISSN: 1674-7321
Part of ISSN: 1869-1900
Contributors: Xiao Wu; HongJie Jiang; WangYun Li; ChongYu Liu; HongFeng Huang; ShuHui Liu; LiLi Wei
Source: Self-asserted source
Wangyun Li

Phase transition and damping behavior of Al matrix composites reinforced by a NiTi particle layer

Journal of Materials Science
2023-12 | Journal article
DOI: 10.1007/s10853-023-09111-0
Part of ISSN: 0022-2461
Part of ISSN: 1573-4803
Contributors: Chaoyi Ding; Hongjie Jiang; Wangyun Li; Chongyu Liu; Hongfeng Huang; Shuhui Liu; Lili Wei
Source: Self-asserted source
Wangyun Li

Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints at low temperatures

Microelectronics Reliability
2023-11 | Journal article
DOI: 10.1016/j.microrel.2023.115093
Part of ISSN: 0026-2714
Contributors: W.Y. Li; F. Chen; J. Gui; S.L. He; H.B. Qin; J.Q. Huang
Source: Self-asserted source
Wangyun Li

Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures

Microelectronics Reliability
2023-11 | Journal article
DOI: 10.1016/j.microrel.2023.115105
Part of ISSN: 0026-2714
Contributors: W.Y. Li; C.T. Chen; M. Ueshima; T. Kobatake; K. Suganuma
Source: Self-asserted source
Wangyun Li

Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules

Journal of Materials Research and Technology
2023-09 | Journal article
DOI: 10.1016/j.jmrt.2023.07.254
Part of ISSN: 2238-7854
Contributors: Yuxin Xu; Xiaoming Qiu; Wangyun Li; Suyu Wang; Ninshu Ma; Minoru Ueshima; chuantong Chen; Katsuaki Suganuma
Source: Self-asserted source
Wangyun Li

Minor Ag induced shear performance alternation in BGA structure Cu/SnBi/Cu solder joints under electric current stressing

Journal of Materials Research and Technology
2023-07 | Journal article | Author
DOI: 10.1016/j.jmrt.2023.07.045
Part of ISSN: 2238-7854
Contributors: Wangyun Li; Lanqing Mo; Xingmin Li; Jian Wang; Hongbo Qin; Siliang He
Source: Self-asserted source
Wangyun Li

Low‐Temperature Solidifiable Liquid Metal with Ultrahigh Thermal Conductivity Enabled by Spontaneous Phase Transition for Electronics’ Safety and Long‐Life Cooling

Advanced Engineering Materials
2023-06 | Journal article
DOI: 10.1002/adem.202201817
Part of ISSN: 1438-1656
Part of ISSN: 1527-2648
Contributors: Zenghuang Zheng; Song Wei; Yiren Yang; Dan Zhang; Daoguo Yang; Wangyun Li; Jingdong Guo
Source: Self-asserted source
Wangyun Li

Fine Pitch Micro Via Interconnection with Reliable Electroless/electric Cu plating Layers Combined with High Power DUV Picosecond Laser for Organic Substrates

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
2023-05 | Conference paper
DOI: 10.1109/ectc51909.2023.00236
Contributors: Ming-Chun Hsieh; Zheng Zhang; Masahiko Nishijima; Aiji Suetake; Chuantong Chen; Hiroyoshi Yoshida; Wangyun Li; Rieko Okumura; Hidekazu Homma; Koji Kita et al.
Source: Self-asserted source
Wangyun Li

High reliability design Ag sinter joining on softened Ni-P /Pt/Ag metallization substrate during harsh thermal cycling

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
2023-05 | Conference paper
DOI: 10.1109/ectc51909.2023.00114
Contributors: Chuantong Chen; Yang Liu; Wangyun Li; Fupeng Huo; Minoru Ueshima; Takehsi Sakamoto; Yukinori Oda; Katsuaki Suganuma
Source: Self-asserted source
Wangyun Li

Effect of Aging and Thermal Shock on the Reliability of Silver Sintered Die Attach for SiC Power Devices

2023 International Conference on Electronics Packaging (ICEP)
2023-04-19 | Conference paper
DOI: 10.23919/icep58572.2023.10129729
Contributors: Wangyun Li; Chuantong Chen; Yang Liu; Minoru Ueshima; Takeshi Sakamoto; Katsuaki Suganuma
Source: Self-asserted source
Wangyun Li

Rapid silver sinter joining technology for large area chips

2023 International Conference on Electronics Packaging (ICEP)
2023-04-19 | Conference paper
DOI: 10.23919/icep58572.2023.10129731
Contributors: Luobin Zhang; Chuantong Chen; Fupeng Huo; Wangyun Li; Katsuaki Suganuma
Source: Self-asserted source
Wangyun Li

Elevated damping properties of lead-free solders under electric current stressing

Scripta Materialia
2023-03 | Journal article | Author
DOI: 10.1016/j.scriptamat.2022.115230
Part of ISSN: 1359-6462
Contributors: Wangyun Li; Linqiang Liu
Source: Self-asserted source
Wangyun Li

Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density

Journal of Materials Science: Materials in Electronics
2022 | Journal article
DOI: 10.1007/s10854-022-08507-z
EID:

2-s2.0-85131672358

Part of ISSN: 1573482X 09574522
Contributors: Li, X.; Wang, J.; Qin, H.; He, S.; Li, W.; Wei, S.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions

Soldering and Surface Mount Technology
2022 | Journal article
DOI: 10.1108/SSMT-05-2022-0043
EID:

2-s2.0-85134160410

Part of ISSN: 17586836 09540911
Contributors: Li, W.; Liu, L.; Li, X.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Influence of Microstructure Evolution on the Current Density and Temperature Gradient of Line-Type Cu/Sn58Bi/Cu Microscale Solder Joints Under Current Stressing

Journal of Electronic Materials
2022 | Journal article
DOI: 10.1007/s11664-021-09377-7
EID:

2-s2.0-85122136433

Part of ISSN: 1543186X 03615235
Contributors: Qin, H.; Lei, C.; Luan, X.; Wen, Q.; Li, W.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Influence of phase inhomogeneity on the mechanical behavior of microscale Cu/Sn–58Bi/Cu solder joints

Journal of Materials Science: Materials in Electronics
2022 | Journal article
DOI: 10.1007/s10854-021-07289-0
EID:

2-s2.0-85118570207

Part of ISSN: 1573482X 09574522
Contributors: Qin, H.; Qin, W.; Li, W.; Long, X.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Shear performance of microscale ball grid array structure Cu(Ni)/Sn–3.0Ag–0.5Cu/Cu(Ni) solder joints at low temperatures

Materials Today Communications
2022 | Journal article
DOI: 10.1016/j.mtcomm.2022.103149
EID:

2-s2.0-85122927899

Part of ISSN: 23524928
Contributors: Li, W.; Gui, J.; Qin, H.; Yang, D.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Shear performance of microscale ball grid array structure Sn–3.0Ag–0.5Cu solder joints with different surface finish combinations under electro-thermo-mechanical coupled loads

Journal of Materials Science: Materials in Electronics
2022 | Journal article
DOI: 10.1007/s10854-021-07682-9
EID:

2-s2.0-85124083586

Part of ISSN: 1573482X 09574522
Contributors: Wang, B.; Li, W.; Pan, K.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Tensile Performance of Inhomogeneous Microscale Cu/Sn-58Bi/Cu Solder Joints under Electro-thermo-mechanical Coupled Loads,电-热-力耦合载荷下非均匀组织Cu/Sn-58Bi/Cu微焊点拉伸力学性能研究

Jixie Gongcheng Xuebao/Journal of Mechanical Engineering
2022 | Journal article
DOI: 10.3901/JME.2022.02.307
EID:

2-s2.0-85128295064

Part of ISSN: 05776686
Contributors: Li, W.; Li, X.; Wang, J.; Liang, J.; Qin, H.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Weakened strengthening effect in the Ag added microscale SnBi joints under current stressing

Materials Letters
2022 | Journal article
DOI: 10.1016/j.matlet.2022.131677
EID:

2-s2.0-85122572042

Part of ISSN: 18734979 0167577X
Contributors: Li, X.; Wang, J.; Liang, J.; Li, W.; Qin, H.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Fatigue performance of Cu/Sn–3.0Ag–0.5Cu/Cu solder joints at different current densities

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
2022-12-07 | Conference paper
DOI: 10.1109/eptc56328.2022.10013209
Contributors: Longgen Liu; Bo Wang; Wangyun Li; Yubing Gong; Kailin Pan
Source: Self-asserted source
Wangyun Li

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Journal of Materials Research and Technology
2022-11 | Journal article
DOI: 10.1016/j.jmrt.2022.10.056
Part of ISSN: 2238-7854
Contributors: Siliang He; Yu-An Shen; Bifu Xiong; Fupeng Huo; Jiahui Li; Jinguo Ge; Zhiliang Pan; Wangyun Li; Chuan Hu; Hiroshi Nishikawa
Source: Self-asserted source
Wangyun Li

Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density

Journal of Materials Science: Materials in Electronics
2022-11 | Journal article
DOI: 10.1007/s10854-022-09200-x
Part of ISSN: 0957-4522
Part of ISSN: 1573-482X
Contributors: Yubing Gong; Longgen Liu; Siliang He; Haidong Yan; Wangyun Li; Hongbo Qin
Source: Self-asserted source
Wangyun Li

Effect of electric current stressing on mechanical performance of solders and solder joints: A review

Journal of Materials Science
2022-10 | Journal article | Author
DOI: 10.1007/s10853-022-07715-6
Part of ISSN: 0022-2461
Part of ISSN: 1573-4803
Contributors: Bo Wang; Wangyun Li; Shuye Zhang; Xingmin Li; Kailin Pan
Source: Self-asserted source
Wangyun Li

The addition of Ag on the shear performance of aged BGA structure SnBi solder joints with same volume and different thicknesses

2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
2022-08-10 | Conference paper
DOI: 10.1109/icept56209.2022.9872680
Contributors: Lan-qing Mo; Xue-ling Chen; Long-geng Liu; Yu-bing Gong; Hong-bo Qin; Wang-yun Li
Source: Self-asserted source
Wangyun Li

The breakdown of Anand constitutive model in life prediction of microscale BGA structure Sn–3.0Ag–0.5Cu joints stressed with electric current

2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
2022-08-10 | Conference paper
DOI: 10.1109/icept56209.2022.9873211
Contributors: Bo Wang; Wang-Yun Li; Wei Huang; Yu-Bing Gong; Jian Xu; Kai-Lin Pan
Source: Self-asserted source
Wangyun Li

Abnormal Shear Performance of Microscale Ball Grid Array Structure Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints with Increasing Current Density

Crystals
2022-01 | Journal article | Author
DOI: 10.3390/cryst12010085
Contributors: Bo Wang; Wangyun Li; Kailin Pan
Source: check_circle
Multidisciplinary Digital Publishing Institute
grade
Preferred source (of 2)‎

Adsorption behavior of HCOOH on the crystal surfaces of Cu(111) and (100)

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
2021 | Conference paper
DOI: 10.1109/ICEPT52650.2021.9567947
EID:

2-s2.0-85118451702
Contributors: Jiang, L.; Liu, T.; He, S.; Qin, H.; Li, W.; Yang, D.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Effect of IMC morphology on the current density and temperature gradient of line-type Cu/Sn/Cu solder joint

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
2021 | Conference paper
DOI: 10.1109/ICEPT52650.2021.9568011
EID:

2-s2.0-85118466623
Contributors: Tang, J.; Liu, T.; Ding, C.; Wang, J.; Qin, H.; Li, W.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Optical Performance Analysis of UVC-LED Package Structure Based on Ray-Tracing Simulation

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
2021 | Conference paper
DOI: 10.1109/ICEPT52650.2021.9568171
EID:

2-s2.0-85118432236
Contributors: Li, J.; Li, W.; Yang, D.; Qin, Y.; Cao, S.; Liu, F.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Research on Thermal Characteristics of High Power 3D Microchannel Multichip Package

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
2021 | Conference paper
DOI: 10.1109/ICEPT52650.2021.9568240
EID:

2-s2.0-85118469201
Contributors: Wei, X.; Yang, D.; Li, W.; Wang, X.; Lu, G.; Xue, S.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Size effect on tensile performance of microscale Cu/Sn3.0Ag0.5Cu/Cu joints at low temperatures

Journal of Materials Science: Materials in Electronics
2021 | Journal article
DOI: 10.1007/s10854-021-07226-1
EID:

2-s2.0-85118219359

Part of ISSN: 1573482X 09574522
Contributors: Gui, J.; Li, X.; Wang, J.; Li, W.; Qin, H.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Study on Gold Wire Sweep in Cantilever Chip-Stacked Package during Molding Process

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
2021 | Conference paper
DOI: 10.1109/ICEPT52650.2021.9568050
EID:

2-s2.0-85118464396
Contributors: Cao, S.; Yang, D.; Li, W.; Wang, X.; Xue, S.; Yun, Z.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Study on leadframe overflow prevention of soldering paste using fluid-structure coupling analysis

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
2021 | Conference paper
DOI: 10.1109/ICEPT52650.2021.9568000
EID:

2-s2.0-85118423401
Contributors: Lu, G.; Yang, D.; Li, W.; Wang, X.; Wei, X.; Ai, B.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

The mechanical and physical properties of the phases in the microstructure of Sn- Bi solder alloy

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
2021 | Conference paper
DOI: 10.1109/ICEPT52650.2021.9568177
EID:

2-s2.0-85118470763
Contributors: Lei, C.; Luan, X.; Liu, Z.; Qin, H.; Hou, B.; Li, W.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Wettability Improvement of Solder in Fluxless Soldering under Formic Acid Atmosphere

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
2021 | Conference paper
DOI: 10.1109/ICEPT52650.2021.9568105
EID:

2-s2.0-85118452884
Contributors: Bi, Y.; He, S.; Li, W.; Yang, D.; Nishikawa, H.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing

Microelectronics Reliability
2020 | Journal article
DOI: 10.1016/j.microrel.2020.113995
EID:

2-s2.0-85096207499

Part of ISSN: 00262714
Contributors: Qin, H.; Liu, T.; Li, W.; Yue, W.; Yang, D.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Research on the anisotropic mechanical behavior of microscale Sn58Bi solder matrix via finite element simulation

2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020
2020 | Conference paper
DOI: 10.1109/ICEPT50128.2020.9202950
EID:

2-s2.0-85093360002
Contributors: Qin, W.; Kuang, T.-F.; DIng, C.; Lei, C.-Y.; Li, W.-Y.; Qin, H.-B.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints after deep cryogenic treatment with different time

2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020
2020 | Conference paper
DOI: 10.1109/ICEPT50128.2020.9202647
EID:

2-s2.0-85093360925
Contributors: Gui, J.; Li, X.-M.; Li, W.-Y.; Yan, H.-D.; Qin, H.-B.; Huang, J.-Q.; Yang, D.-G.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Tensile performance of line-type microscale Cu/Sn-58Bi/Cu joints under electro-thermo-mechanical coupled loads

2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020
2020 | Conference paper
DOI: 10.1109/ICEPT50128.2020.9202518
EID:

2-s2.0-85093361730
Contributors: Li, X.-M.; Gui, J.; Li, W.-Y.; Yan, H.-D.; Qin, H.-B.; Huang, J.-Q.; Yang, D.-G.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Void Eliminating Process of Sintered-Silver Die Attachment in Anaerobic-Sintering Atmospheres

2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020
2020 | Conference paper
DOI: 10.1109/ICEPT50128.2020.9202689
EID:

2-s2.0-85093366314
Contributors: Liang, P.; Yan, H.; Li, W.; Yang, D.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Analysis of Temperature Response Characteristics of Voltage RMS Sensor Packaging Based on Diode

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019
2019 | Conference paper
DOI: 10.1109/ICEPT47577.2019.245123
EID:

2-s2.0-85084949318
Contributors: Wang, X.; Yang, D.; Fan, Y.; Li, W.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Anisotropic mechanical characteristics of Cu6Sn5 micro-cantilever under bending load

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019
2019 | Conference paper
DOI: 10.1109/ICEPT47577.2019.245279
EID:

2-s2.0-85084954628
Contributors: Wangyun Li
Source: Self-asserted source
Wangyun Li
grade
Preferred source (of 2)‎

Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints with shrinking volume at low and cryogenic temperatures

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019
2019 | Conference paper
DOI: 10.1109/ICEPT47577.2019.245195
EID:

2-s2.0-85084946063
Contributors: Li, W.-Y.; Peng, G.-Q.; Cheng, T.-X.; Qin, H.-B.; Huang, J.-Q.; Yang, D.-G.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

The influence of phase inhomogeneity on the current density and temperature gradient in Cu/Sn58Bi/Cu solder joint

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019
2019 | Conference paper
DOI: 10.1109/ICEPT47577.2019.245309
EID:

2-s2.0-85084952374
Contributors: Wen, Q.-Z.; Guo, L.; Qin, H.-B.; Li, W.-Y.; Yang, D.-G.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

A novel and facile synthesis of nano SnO2 with various morphologies by electric current stressing

Rare Metal Materials and Engineering
2018 | Journal article
Source: Self-asserted source
Wangyun Li

Influence of pressure on the mechanical and electronic properties of wurtzite and zinc-blende gaN crystals

Crystals
2018 | Journal article
DOI: 10.3390/cryst8110428
EID:

2-s2.0-85057278663

Part of ISSN: 20734352
Contributors: Qin, H.; Kuang, T.; Luan, X.; Li, W.; Xiao, J.; Zhang, P.; Yang, D.; Zhang, G.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads

Microelectronics Reliability
2018 | Journal article
DOI: 10.1016/j.microrel.2017.10.031
EID:

2-s2.0-85032804366

Part of ISSN: 00262714
Contributors: Li, W.Y.; Zhang, X.P.; Qin, H.B.; Mai, Y.-W.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier

Low and cryogenic temperature mechanical performance and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints with the decreasing dimension

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
2018 | Conference paper
DOI: 10.1109/ICEPT.2018.8480659
EID:

2-s2.0-85056419514
Contributors: Li, W.-Y.; Zhang, X.-P.
Source: Self-asserted source
Wangyun Li via Scopus - Elsevier
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