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Employment (3)

University of Sheffield: Sheffield, Sheffield, GB

2016-01-01 to 2017-07-31 (III-nitride semiconductor material and devices, EEE)
Employment
Source: Self-asserted source
Liancheng Wang

Singapore University of Technology and Design, Singapore: SINGAPORE, SG

2015-04-01 to 2015-12-31 (Engineering Product Development Pillar [EPD], SUTD-MIT International Design Centre)
Employment
Source: Self-asserted source
Liancheng Wang

Nanyang Technological University, Singapore: SINGAPORE, SG

2013-07-26 to 2015-04-01 (LUMINOUS! Centre of Excellence for Semiconductor Lighting and Displays)
Employment
Source: Self-asserted source
Liancheng Wang

Education and qualifications (3)

Central South University: Changsha, Hunan, CN

Education
Source: Self-asserted source
Liancheng Wang

Chinese Academy of Sciences, Beijing, China: Peking, CN

2008-09-01 to 2013-07-15 | PhD (Institute of Semiconductors)
Education
Source: Self-asserted source
Liancheng Wang

Central South University: Changsha, NanHu, CN

2004-09-01 to 2008-07-15 | Bachelor (Material Science and Technology )
Education
Source: Self-asserted source
Liancheng Wang

Works (32)

Investigation on the electrical-thermal-mechanical performance of multi-chip SiC power device with Cu clip interconnect

IEEE Journal of Emerging and Selected Topics in Power Electronics
2025 | Journal article
DOI: 10.1109/JESTPE.2025.3544806
Contributors: Ping Wu; Yi Fan; Xiaoyang Mei; Haoquan Qian; Mingming Yi; Hongwei Liu; Wenhui Zhu; Liancheng Wang
Source: check_circle
Crossref

Enhanced Anti-Oxidation Copper-Based Conductive Inks for Low Porosity Copper Films in Power Electronics

IEEE Transactions on Components, Packaging and Manufacturing Technology
2024 | Journal article
DOI: 10.1109/TCPMT.2024.3417261
Contributors: Mingming Yi; Wenhui Zhu; Ping Wu; Yiou Qiu; Guoliao Sun; Liancheng Wang
Source: check_circle
Crossref

Improvement Heat Dissipation of Flip Chip Double-Sided Cooling IGBT Module Using AlSiC-Interposer Technology

IEEE Transactions on Components, Packaging and Manufacturing Technology
2024-11 | Journal article
DOI: 10.1109/TCPMT.2024.3469160
Contributors: Guoliao Sun; Cheng Peng; Jing Wen; Hongwei Liu; Wenhui Zhu; Liancheng Wang
Source: check_circle
Crossref

Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules

IEEE Transactions on Components, Packaging and Manufacturing Technology
2024-09 | Journal article
DOI: 10.1109/TCPMT.2024.3447124
Contributors: Guoliao Sun; Wen Jing; Siyuan Lu; Cheng Peng; Wenhui Zhu; Liancheng Wang
Source: check_circle
Crossref

Reducing Thermal Interface Resistance by Oxygen Plasma Treatment for FCBGA Advanced Package

IEEE Transactions on Components, Packaging and Manufacturing Technology
2024-02 | Journal article
DOI: 10.1109/TCPMT.2024.3357126
Contributors: Mingming Yi; Ping Wu; Yiou Qiu; Jing Wen; Wenhui Zhu; Liancheng Wang
Source: check_circle
Crossref

Linearly polarized light emission from GaN micro-LEDs for 3D display

Applied Physics Letters
2023-03-13 | Journal article
DOI: 10.1063/5.0137993
Contributors: Jinpeng Huang; Yi Xu; Binru Zhou; Huming Zhan; Peng Cao; Junxi Wang; Jinmin Li; Xiaoyan Yi; Anlian Pan; Liancheng Wang
Source: check_circle
Crossref

GaN-based resonant cavity micro-LEDs for AR application

Applied Physics Letters
2022-11-14 | Journal article
DOI: 10.1063/5.0117568
Contributors: Jinpeng Huang; Minglei Tang; Binru Zhou; Zhiqiang Liu; Xiaoyan Yi; Junxi Wang; Jinmin Li; Anlian Pan; Liancheng Wang
Source: check_circle
Crossref

Investigation of Vehicle-Oriented Double-Sided Cooling Power Module With BGA Technology

IEEE Journal of Emerging and Selected Topics in Power Electronics
2022-10 | Journal article
DOI: 10.1109/JESTPE.2022.3192519
Contributors: Cheng Peng; Wenhui Zhu; Pan Ke; Ran Li; Xiaoping Dai; Liancheng Wang
Source: check_circle
Crossref

Self-powered asymmetric metal–semiconductor–metal AlN deep ultraviolet detector

Optics Letters
2022-02-01 | Journal article
DOI: 10.1364/OL.443638
Contributors: Tao Li; Wenqing Song; Lei Zhang; Jianchang Yan; Wenhui Zhu; Liancheng Wang
Source: check_circle
Crossref

Improving the Modulation Bandwidth of GaN‐Based Light‐Emitting Diodes for High‐Speed Visible Light Communication: Countermeasures and Challenges

Advanced Photonics Research
2021-12 | Journal article
DOI: 10.1002/adpr.202100093
Contributors: Rongqiao Wan; Liancheng Wang; Jinpeng Huang; Xiaoyan Yi; Hao-Chung Kuo; Jinmin Li
Source: check_circle
Crossref

Unidirectional-emitting GaN-based micro-LED for 3D display

Optics Letters
2021-07-15 | Journal article
DOI: 10.1364/OL.430021
Contributors: Jinpeng Huang; Zelin Hu; Xiang Gao; Yi Xu; Liancheng Wang
Source: check_circle
Crossref

Pixel crosstalk in naked-eye micro-LED 3D display

Applied Optics
2021-07-10 | Journal article
DOI: 10.1364/AO.429975
Contributors: Yi Xu; Jiawei Cui; Zelin Hu; Xiang Gao; Liancheng Wang
Source: check_circle
Crossref

3D-MSM AlN Deep Ultraviolet Detector

IEEE Journal of Quantum Electronics
2021-06 | Journal article
DOI: 10.1109/JQE.2021.3075543
Contributors: Tao Li; Wenqing Song; Rongqiao Wan; Lei Zhang; Jianchang Yan; Wenhui Zhu; Liancheng Wang
Source: check_circle
Crossref

Circularly polarized light emission from a GaN micro-LED integrated with functional metasurfaces for 3D display

Optics Letters
2021-06-01 | Journal article
DOI: 10.1364/OL.415150
Contributors: Xiang Gao; Yi Xu; Jinpeng Huang; Zelin Hu; Wenhui Zhu; Xiaoyan Yi; Liancheng Wang
Source: check_circle
Crossref

Investigation on the Reliability of Die-Attach Structures for Double-Sided Cooling Power Module

IEEE Transactions on Components, Packaging and Manufacturing Technology
2021-05 | Journal article
DOI: 10.1109/TCPMT.2021.3065704
Contributors: Cheng Peng; Qiang Huang; Fang Qi; Pan Ke; Xiaoping Dai; Wenhui Zhu; Liancheng Wang
Source: check_circle
Crossref

Thermomechanical reliability of a Cu/Sn-3.5Ag solder joint with a Ni insertion layer in flip chip bonding for 3D interconnection

Journal of Materials Science: Materials in Electronics
2021-05-19 | Journal article
DOI: 10.1007/s10854-021-05819-4
Contributors: Chu Tang; Wenhui Zhu; Zhuo Chen; Liancheng Wang
Source: check_circle
Crossref

Amorphous gallium oxide (a-Ga2O3)-based high-temperature bendable solar-blind ultraviolet photodetector

Semiconductor Science and Technology
2021-04-01 | Journal article
DOI: 10.1088/1361-6641/abe42c
Contributors: Lingxing Xiong; Lei Zhang; Qipu Lv; Tao Li; Wenqing Song; Jiawei Si; Wenhui Zhu; Liancheng Wang
Source: check_circle
Crossref

Influence of Al content on ZnO/Al bilayer-structure ultraviolet photodetector

Semiconductor Science and Technology
2021-04-01 | Journal article
DOI: 10.1088/1361-6641/abe49c
Contributors: Jiawei Si; Wenqing Song; Liancheng Wang; Wenhui Zhu; Lei Zhang
Source: check_circle
Crossref

Multiplexing multifoci optical metasurfaces for information encoding in the ultraviolet spectrum

Applied Optics
2021-03-10 | Journal article
DOI: 10.1364/AO.413921
Contributors: Jinpeng Huang; Xiang Gao; Zelin Hu; Jianchang Yan; Xiaoyan Yi; Liancheng Wang
Source: check_circle
Crossref

A Finite Element Analysis on the Reliability of Heavy Bonding Wire for High-Power IGBT Module

IEEE Transactions on Components, Packaging and Manufacturing Technology
2021-02 | Journal article
DOI: 10.1109/TCPMT.2020.3028386
Contributors: Qiang Huang; Cheng Peng; Serwaa Frimpong-Manso Ellen; Wenhui Zhu; Liancheng Wang
Source: check_circle
Crossref

Influence of Ag Layer on Microstructural Evolution and Joining Properties With Zn Foil for Power Electronics

IEEE Transactions on Components, Packaging and Manufacturing Technology
2020-08 | Journal article
DOI: 10.1109/TCPMT.2020.3007170
Contributors: Yidian Shi; Wenhui Zhu; Liancheng Wang
Source: check_circle
Crossref

Design of AlN ultraviolet metasurface for single-/multi-plane holography

Applied Optics
2020-05-10 | Journal article
DOI: 10.1364/AO.392799
Contributors: Xiang Gao; Rongqiao Wan; Jianchang Yan; Liancheng Wang; Xiaoyan Yi; Junxi Wang; Wenhui Zhu; Jinmin Li
Source: check_circle
Crossref

Influence of deposition temperature on amorphous Ga2O3 solar-blind ultraviolet photodetector

Semiconductor Science and Technology
2020-05-01 | Journal article
DOI: 10.1088/1361-6641/ab6ac1
Contributors: Wenhui Zhu; Lingxing Xiong; Jiawei Si; Zelin Hu; Xiang Gao; Linyun Long; Tao Li; Rongqiao Wan; Lei Zhang; Liancheng Wang
Source: check_circle
Crossref

Crystal phase evolution in kinked GaN nanowires

Nanotechnology
2020-04-03 | Journal article
DOI: 10.1088/1361-6528/ab6479
Contributors: Shaoteng Wu; Shaofei Wu; Wenqing Song; Liancheng Wang; Xiaoyan Yi; Zhiqiang Liu; Junxi Wang; Jinmin Li
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Crossref

Semi-polar (11–22) GaN epitaxial films with significantly reduced defect densities grown on m-plane sapphire using a sequence of two in situ SiNx interlayers

Applied Physics Letters
2019-04 | Journal article
DOI: 10.1063/1.5085012
Contributors: Kun Xing; Chiyao Tseng; Liancheng Wang; Pingfeng Chi; Jiangtao Wang; Posung Chen; Huaguo Liang
Source: check_circle
Crossref

High-performance ultra-low-k fluorine-doped nanoporous organosilica films for inter-layer dielectric

Journal of Materials Science
2019-02-22 | Journal article
DOI: 10.1007/s10853-018-3013-x
Contributors: Ganglong Li; Guang Zheng; Zijun Ding; Lei Shi; Junhui Li; Zhuo Chen; Liancheng Wang; Andrew A. O. Tay; Wenhui Zhu
Source: check_circle
Crossref

Horizontal GaN nanowires grown on Si (111) substrate: the effect of catalyst migration and coalescence

Nanotechnology
2019-01-25 | Journal article
DOI: 10.1088/1361-6528/aaee55
Contributors: Shaoteng Wu; Liancheng Wang; Zhiqiang Liu; Xiaoyan Yi; Yunyu Wang; Cheng Cheng; Chen Lin; Tao Feng; Shuo Zhang; Tao Li et al.
Source: check_circle
Crossref

Crystallographic orientation control and optical properties of GaN nanowires

RSC Advances
2018 | Journal article
DOI: 10.1039/C7RA11408G
Contributors: Shaoteng Wu; Liancheng Wang; Xiaoyan Yi; Zhiqiang Liu; Jianchang Yan; Guodong Yuan; Tongbo Wei; Junxi Wang; Jinmin Li
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Crossref

Ultrafast growth of horizontal GaN nanowires by HVPE through flipping the substrate

Nanoscale
2018 | Journal article
DOI: 10.1039/C8NR00175H
Contributors: Shaoteng Wu; Liancheng Wang; Zhiqiang Liu; Xiaoyan Yi; Yang Huang; Chao Yang; Tongbo Wei; Jianchang Yan; Guodong Yuan; Junxi Wang et al.
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Crossref

Design of aluminum nitride metalens for broadband ultraviolet incidence routing

Nanophotonics
2018-12-19 | Journal article
DOI: 10.1515/nanoph-2018-0151
Contributors: Linhao Guo; Zelin Hu; Rongqiao Wan; Linyun Long; Tao Li; Jianchang Yan; Yun Lin; Lei Zhang; Wenhui Zhu; Liancheng Wang
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Crossref

Impurity resonant state p-doping layer for high-efficiency nitride-based light-emitting diodes

Semiconductor Science and Technology
2018-11-01 | Journal article
DOI: 10.1088/1361-6641/aadc01
Contributors: Zhiqiang Liu; Xiaoyan Yi; Liancheng Wang; Tongbo Wei; Guodong Yuan; Jianchang Yan; Junxi Wang; Jinmin Li; Yi Shi; Yong Zhang
Source: check_circle
Crossref

Nanostructure nitride light emitting diodes via the Talbot effect using improved colloidal photolithography

Nanoscale
2017 | Journal article
DOI: 10.1039/C7NR01586K
Contributors: Liancheng Wang; Zhiqiang Liu; Zhi Li; Yiyun Zhang; Hongjian Li; Xiaoyan Yi; Junxi Wang; Guohong Wang; Jinmin Li
Source: check_circle
Crossref
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