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Works (8)

Junction-to-Case Thermal Resistance Measurement and Analysis of Press-Pack IGBTs Under Double-Side Cooling Condition

IEEE Transactions on Power Electronics
2022-07 | Journal article
DOI: 10.1109/TPEL.2022.3151411
Contributors: Jie Chen; Erping Deng; Yiming Zhang; Yongzhang Huang
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The Influence and Application of Bond Wires Failure on Electrothermal Characteristics of IGBT Module

IEEE Transactions on Components, Packaging and Manufacturing Technology
2021-09 | Journal article
DOI: 10.1109/TCPMT.2021.3102242
Contributors: Jie Chen; Erping Deng; Peng Liu; Shaohua Yang; Yongzhang Huang
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Study of IGBTs Reliability Under Coupled Electrical–Thermal Environment

IEEE Journal of Emerging and Selected Topics in Power Electronics
2021-08 | Journal article
DOI: 10.1109/JESTPE.2020.2988847
Contributors: Heli Meng; Yanhao Wang; Xiahui Zheng; Jie Chen; Yuxuan Wu; Anqi Li; Yongzhang Huang
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Calibration Method of Junction Temperature Measurement for Press-Pack IGBTs

IEEE Transactions on Components, Packaging and Manufacturing Technology
2021-07 | Journal article
DOI: 10.1109/TCPMT.2021.3084966
Contributors: Jie Chen; Erping Deng; Yiming Zhang; Yongzhang Huang
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Crossref

Sequential V ce(T) Method for the Accurate Measurement of Junction Temperature Distribution Within Press-Pack IGBTs

IEEE Transactions on Power Electronics
2021-04 | Journal article
DOI: 10.1109/TPEL.2020.3024815
Contributors: Yiming Zhang; Erping Deng; Zhibin Zhao; Jie Chen; Yushan Zhao; Jiaqi Guo; Xiang Cui
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Crossref

Temperature Distribution Evaluation of Single Chip by Multiple Currents V CE (T) Method

IEEE Transactions on Components, Packaging and Manufacturing Technology
2021-03 | Journal article
DOI: 10.1109/TCPMT.2020.3040309
Contributors: Jie Chen; Erping Deng; Xiaoliang Ying; Yongzhang Huang
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The Distributed Heat Source Modeling Method for the Finite Element Simulation of IGBTs

IEEE Transactions on Components, Packaging and Manufacturing Technology
2021-01 | Journal article
DOI: 10.1109/TCPMT.2020.3012534
Contributors: Jie Chen; Erping Deng; Zixuan Zhao; Yongzhang Huang
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Crossref

Investigations on Averaging Mechanisms of Virtual Junction Temperature Determined by V CE (T) Method for IGBTs

IEEE Transactions on Electron Devices
2020-03 | Journal article
DOI: 10.1109/TED.2020.2969727
Contributors: Jie Chen; Erping Deng; Luhong Xie; Xiaoliang Ying; Yongzhang Huang
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