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Regional Innovation Centre for Electrical Engineering

Other IDs

ResearcherID: M-8283-2014
Scopus Author ID: 24081533300

Keywords

diagnostics, soldering, interconnection

Countries

Czech Republic

Activities

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Employment (1)

University of West Bohemia: Pilsen, CZ

Employment
Source: Self-asserted source
Frantisek Steiner

Education and qualifications (1)

University of West Bohemia: Pilsen, CZ

1996-09-01 to 2001-01-18 | Ph.D.
Education
Source: Self-asserted source
Frantisek Steiner

Works (50 of 61)

Items per page:
Page 1 of 2

Defect Trends in Fire Alarm Systems: A Basis for Risk-Based Inspection (RBI) Approaches

Safety
2024-11 | Journal article | Author
DOI: 10.3390/safety10040095
Contributors: Stefan Veit; Frantisek Steiner
Source: check_circle
Multidisciplinary Digital Publishing Institute

Proposed Changes to the Inspection Strategy for Fire Alarm Systems: Empirical Analysis of Weak Points and Technical Influencing Factors

Safety
2024-06 | Journal article | Author
DOI: 10.3390/safety10020051
Contributors: Stefan Veit; Frantisek Steiner
Source: check_circle
Multidisciplinary Digital Publishing Institute

Comparison of Conductive Ribbons Reliability during Electrical Current Ageing

Proceedings of the 2020 International Conference on Diagnostics in Electrical Engineering, Diagnostika 2020
2020 | Conference paper
DOI: 10.1109/Diagnostika49114.2020.9214774
EID:

2-s2.0-85094827650
Contributors: Hirman, M.; Navratil, J.; Steiner, F.; Hamacek, A.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Design, fabrication and risk assessment of IoT unit for products manufactured in industry 4.0 factory

Procedia Manufacturing
2020 | Conference paper
DOI: 10.1016/j.promfg.2020.10.165
EID:

2-s2.0-85099805884

Part of ISSN: 23519789
Contributors: Hirman, M.; Benesova, A.; Sima, K.; Steiner, F.; Tupa, J.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Effect of washing cycles on glued conductive joints used on stretchable smart textile ribbons

Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020
2020 | Conference paper
DOI: 10.1109/ESTC48849.2020.9229797
EID:

2-s2.0-85096595340
Contributors: Hirman, M.; Navratil, J.; Steiner, F.; Hamacek, A.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Electrical Resistance of Solder Joints on Conductive Ribbons

Proceedings of the International Spring Seminar on Electronics Technology
2020 | Conference paper
DOI: 10.1109/ISSE49702.2020.9120981
EID:

2-s2.0-85087616990

Part of ISSN: 21612536 21612528
Contributors: Hirman, M.; Navratil, J.; Steiner, F.; Hamacek, A.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Influence of production and operating conditions on properties of acrylic conformal coatings

Proceedings of the International Spring Seminar on Electronics Technology
2020 | Conference paper
DOI: 10.1109/ISSE49702.2020.9121076
EID:

2-s2.0-85087657650

Part of ISSN: 21612536 21612528
Contributors: Steiner, F.; Hirman, M.; Rous, P.; Hornak, J.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Optimization of Contacting Technological Process on Printed Conductive Pattern for Wearable Electronics

Proceedings of the International Spring Seminar on Electronics Technology
2020 | Conference paper
DOI: 10.1109/ISSE49702.2020.9120877
EID:

2-s2.0-85087617768

Part of ISSN: 21612536 21612528
Contributors: Benesova, A.; Hirman, M.; Hlina, J.; Tupa, J.; Steiner, F.; Reboun, J.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Reliability of Glued SMD Components on Smart Textile

Proceedings of the International Spring Seminar on Electronics Technology
2020 | Conference paper
DOI: 10.1109/ISSE49702.2020.9121133
EID:

2-s2.0-85087615667

Part of ISSN: 21612536 21612528
Contributors: Hirman, M.; Navratil, J.; Steiner, F.; Hamacek, A.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

The role of process management in the context of industry 4.0

Proceedings of the International Conference on Industrial Engineering and Operations Management
2020 | Conference paper
EID:

2-s2.0-85088939954

Part of ISSN: 21698767
Contributors: Svehla, M.; Rericha, T.; Tupa, J.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Alternative technology for SMD components connection by non-conductive adhesive on a flexible substrate

Journal of Materials Science: Materials in Electronics
2019 | Journal article
DOI: 10.1007/s10854-019-01789-w
EID:

2-s2.0-85068867587

Part of ISSN: 1573482X 09574522
Contributors: Hirman, M.; Navratil, J.; Steiner, F.; Dzugan, T.; Hamacek, A.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Bend Testing of SMD Chip Resistors Glued on Flexible Substrates

Proceedings of the International Spring Seminar on Electronics Technology
2019 | Conference paper
DOI: 10.1109/ISSE.2019.8810230
EID:

2-s2.0-85072286275

Part of ISSN: 21612536 21612528
Contributors: Hirman, M.; Neuhofer, T.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Comparison of QFN chips glued by ACA and NCA adhesives on the flexible substrate

2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
2019 | Conference paper
DOI: 10.23919/EMPC44848.2019.8951828
EID:

2-s2.0-85078843953
Contributors: Hirman, M.; Steiner, F.; Navratil, J.; Hamacek, A.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Determination of changes in process management within industry 4.0

Procedia Manufacturing
2019 | Conference paper
DOI: 10.1016/j.promfg.2020.01.112
EID:

2-s2.0-85083532508

Part of ISSN: 23519789
Contributors: Benešová, A.; Hirman, M.; Steiner, F.; Tupa, J.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Project management during the industry 4.0 implementation with risk factor analysis

Procedia Manufacturing
2019 | Conference paper
DOI: 10.1016/j.promfg.2020.01.208
EID:

2-s2.0-85083533138

Part of ISSN: 23519789
Contributors: Hirman, M.; Benesova, A.; Steiner, F.; Tupa, J.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Relationship of Soldering Profile, Voids Formation and Strength of Soldered Joints

Proceedings of the International Spring Seminar on Electronics Technology
2019 | Conference paper
DOI: 10.1109/ISSE.2019.8810303
EID:

2-s2.0-85072284201

Part of ISSN: 21612536 21612528
Contributors: Steiner, F.; Wirth, V.; Hirman, M.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Reliability of glued joints on flexible substrates during accelerated current ageing

Proceedings of the International Spring Seminar on Electronics Technology
2019 | Conference paper
DOI: 10.1109/ISSE.2019.8810273
EID:

2-s2.0-85072304077

Part of ISSN: 21612536 21612528
Contributors: Hirman, M.; Navratil, J.; Steiner, F.; Hamacek, A.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Requirements for education 4.0 and study programs within industry 4.0

Proceedings of the International Conference on Industrial Engineering and Operations Management
2019 | Conference paper
EID:

2-s2.0-85085918583

Part of ISSN: 21698767
Contributors: Benesova, A.; Hirman, M.; Steiner, F.; Tupa, J.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Analysis of Education Requirements for Electronics Manufacturing within Concept Industry 4.0

Proceedings of the International Spring Seminar on Electronics Technology
2018 | Conference paper
DOI: 10.1109/ISSE.2018.8443681
EID:

2-s2.0-85053351424

Part of ISSN: 21612536 21612528
Contributors: Benesova, A.; Hirman, M.; Steiner, F.; Tupa, J.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Current trends in the management of diagnostic processes in testing laboratories

2018 International Conference on Diagnostics in Electrical Engineering, Diagnostika 2018
2018 | Conference paper
DOI: 10.1109/DIAGNOSTIKA.2018.8526136
EID:

2-s2.0-85058238142
Contributors: Benesova, A.; Hirman, M.; Steiner, F.; Tupa, J.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Influence of Increased Voltage on the Characteristics of Printed Circuit Board Protective Coatings

2018 International Conference on Diagnostics in Electrical Engineering, Diagnostika 2018
2018 | Conference paper
DOI: 10.1109/DIAGNOSTIKA.2018.8526141
EID:

2-s2.0-85058213194
Contributors: Hirman, M.; Steiner, F.; Hornak, J.; Pihera, J.; Rous, P.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Optimization of Soldering Process to Reduce Contamination and Related Consequences

Proceedings of the International Spring Seminar on Electronics Technology
2018 | Conference paper
DOI: 10.1109/ISSE.2018.8443691
EID:

2-s2.0-85053322741

Part of ISSN: 21612536 21612528
Contributors: Steiner, F.; Hirman, M.; Rendl, K.; Wirth, V.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

SMD Components Assembly on a Flexible Substrate by Non-Conductive Adhesives

Proceedings of the International Spring Seminar on Electronics Technology
2018 | Conference paper
DOI: 10.1109/ISSE.2018.8443655
EID:

2-s2.0-85053292671

Part of ISSN: 21612536 21612528
Contributors: Hirman, M.; Navratil, J.; Steiner, F.; Dzugan, T.; Hamacek, A.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Aspects of Risk Management Implementation for Industry 4.0

Procedia Manufacturing
2017 | Journal article
DOI: 10.1016/j.promfg.2017.07.248
EID:

2-s2.0-85029856553

Part of ISSN: 23519789
Contributors: Tupa, J.; Simota, J.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Comparison of the characteristics of PCB protective coatings

Proceedings of the International Spring Seminar on Electronics Technology
2017 | Conference paper
DOI: 10.1109/ISSE.2017.8000928
EID:

2-s2.0-85029899733

Part of ISSN: 21612536 21612528
Contributors: Fridrichovsky, M.; Steiner, F.; Hirman, M.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Influence of flexible substrate roughness with aerosol jet printed pads on the mechanical shear strength of glued joints

Proceedings of the International Spring Seminar on Electronics Technology
2017 | Conference paper
DOI: 10.1109/ISSE.2017.8000911
EID:

2-s2.0-85029897369

Part of ISSN: 21612536 21612528
Contributors: Hirman, M.; Navratil, J.; Soukup, R.; Hamacek, A.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Optimization of solder paste quantity considering the properties of solder joints

Soldering and Surface Mount Technology
2017 | Journal article
DOI: 10.1108/SSMT-10-2016-0025
EID:

2-s2.0-85011112580

Part of ISSN: 09540911
Contributors: Hirman, M.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Connection technologies quality improving

Proceedings of the International Spring Seminar on Electronics Technology
2016 | Conference paper
DOI: 10.1109/ISSE.2016.7563217
EID:

2-s2.0-84988857187
Contributors: Benešová, A.; Šimota, J.; Hirrnan, M.; Navrátil, J.; Tupa, J.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Influence of electrically conductive adhesive quantity on insulation distance and shear strength of glued joints

Proceedings of the International Spring Seminar on Electronics Technology
2016 | Conference paper
DOI: 10.1109/ISSE.2016.7563175
EID:

2-s2.0-84988837571
Contributors: Hirman, M.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Methodologies to improve experimental research processes in soldering technology

Periodica Polytechnica, Electrical Engineering
2016 | Journal article
DOI: 10.3311/PPee.9684
EID:

2-s2.0-84989855864
Contributors: Benešová, A.; Hirman, M.; Navrátil, J.; Šimota, J.; Tupa, J.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Properties of temperature stable solder pastes

2016 6th Electronic System-Integration Technology Conference, ESTC 2016
2016 | Conference paper
DOI: 10.1109/ESTC.2016.7764724
EID:

2-s2.0-85015043148
Contributors: Stuna, J.; Steiner, F.; Hirman, M.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity

Journal of Electrical Engineering
2016 | Journal article
DOI: 10.1515/jee-2016-0025
EID:

2-s2.0-84978120249
Contributors: Hirman, M.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

A comparison of the shear strength of conductive adhesives and soldering alloys

Proceedings of the International Spring Seminar on Electronics Technology
2015 | Conference paper
DOI: 10.1109/ISSE.2015.7247983
EID:

2-s2.0-84958177052
Contributors: Hirman, M.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Correlation analysis of wettability, intermetallic compound formation and PCB contamination

Circuit World
2015 | Journal article
DOI: 10.1108/cw-10-2014-0047
WOSUID:

WOS:000353302000004
Contributors: Steiner, F.; Rendl, K.; Wirth, V.
Source: Self-asserted source
Frantisek Steiner via ResearcherID
grade
Preferred source (of 2)‎

Effect of multiple reflow cycles on intermetallic compound creation

Proceedings of the International Spring Seminar on Electronics Technology
2015 | Conference paper
DOI: 10.1109/ISSE.2015.7247995
EID:

2-s2.0-84958177504
Contributors: Wirth, V.; Rendl, K.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Impact of no-clean fluxes cleaning on PCB ionic contamination

Proceedings of the International Spring Seminar on Electronics Technology
2015 | Conference paper
DOI: 10.1109/ISSE.2015.7247989
EID:

2-s2.0-84958172034
Contributors: Rendl, K.; Wirth, V.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Influence of electrically conductive adhesive amount on shear strength of glued joints

International Conference on Applied Electronics
2015 | Conference paper
EID:

2-s2.0-84955314909
Contributors: Hirman, M.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Innovated relays for railway signalling and interlocking

International Conference on Applied Electronics
2015 | Conference paper
EID:

2-s2.0-84955279460
Contributors: Konecny, I.; Kroupa, M.; Polansky, R.; Prosr, P.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Influence of reflow soldering profiles on creation of IMC at the interface of SnBi/Cu

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, ISSE 2014
2014 | Conference paper
DOI: 10.1109/ISSE.2014.6887582
EID:

2-s2.0-84908650955
Contributors: Hirman, M.; Rendl, K.; Steiner, F.; Wirth, V.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology (Isse) - Advances in Electronic System Integration
2014 | Journal article
WOSUID:

WOS:000346580500030
Contributors: Hirman, M.; Rendl, K.; Steiner, F.; Wirth, V.
Source: Self-asserted source
Frantisek Steiner via ResearcherID

Process variability reduction by using the design of experiment - A case study

FAIM 2014 - Proceedings of the 24th International Conference on Flexible Automation and Intelligent Manufacturing: Capturing Competitive Advantage via Advanced Manufacturing and Enterprise Transformation
2014 | Conference paper
EID:

2-s2.0-84960926097
Contributors: Machac, J.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Risk management methodology covering the entire product lifecycle

Lecture Notes in Mechanical Engineering
2013 | Book
DOI: 10.1007/978-3-319-00557-7_5
EID:

2-s2.0-84951155812
Contributors: Machac, J.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Automatic testing of multimedia units

Proceedings of the International Spring Seminar on Electronics Technology
2012 | Conference paper
DOI: 10.1109/ISSE.2012.6273074
EID:

2-s2.0-84867040929
Contributors: Wirth, V.; Blecha, T.; Herc, L.; Klocker, L.; Linhart, R.; Rendl, K.; Sehnal, P.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Influence of intermetallic compounds growth on properties of lead-free solder joints

Proceedings of the International Spring Seminar on Electronics Technology
2012 | Conference paper
DOI: 10.1109/ISSE.2012.6273075
EID:

2-s2.0-84867056411
Contributors: Novak, T.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Long-term behavior of IMCs in lead-free solder joints

Proceedings of the International Spring Seminar on Electronics Technology
2011 | Conference paper
DOI: 10.1109/ISSE.2011.6053573
EID:

2-s2.0-82955171573
Contributors: Novak, T.; Hujer, T.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Long-Term Behavior of IMCs in Lead-Free Solder Joints

2011 34th International Spring Seminar on Electronics Technology
2011 | Book chapter
WOSUID:

WOS:000374108800035
Contributors: Novak, T.; Hujer, T.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via ResearcherID

The area of spread solderability test use for roughness influence assessment

ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings
2010 | Conference paper
DOI: 10.1109/ISSE.2010.5547277
EID:

2-s2.0-77956946929
Contributors: Novák, T.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Decision support systems in controlling and optimizing of diagnostic processes

ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings
2009 | Conference paper
DOI: 10.1109/ISSE.2009.5206993
EID:

2-s2.0-70449574158
Contributors: Hujer, T.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier

Decision Support Systems in Controlling and Optimizing of Diagnostic Processes

2009 32nd International Spring Seminar on Electronics Technology
2009 | Book
WOSUID:

WOS:000277445500096
Contributors: Hujer, Tomas; Steiner, Frantisek; Ieee,
Source: Self-asserted source
Frantisek Steiner via ResearcherID

Surface roughness influence on solderability

ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings
2009 | Conference paper
DOI: 10.1109/ISSE.2009.5206976
EID:

2-s2.0-70449565120
Contributors: Novák, T.; Steiner, F.
Source: Self-asserted source
Frantisek Steiner via Scopus - Elsevier
Items per page:
Page 1 of 2

Peer review (2 reviews for 2 publications/grants)

Review activity for Applied surface science. (1)
Review activity for Microelectronics and reliability. (1)
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