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Scopus Author ID: 55671719200

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Employment (1)

Korea Institute of Industrial Technology: Incheon, KR

2019-01-01 to present (Joining R&D Group)
Employment
Source: Self-asserted source
Min-Su Kim

Education and qualifications (1)

Osaka University: Osaka, JP

Ph. D. (Graduate School of Engineering)
Education
Source: Self-asserted source
Min-Su Kim

Works (25)

Improving mechanical stability of Al/Cu ultrasonic bonded joint for battery tab by adopting electroplated Ni interlayer

Journal of Materials Science: Materials in Electronics
2024-02 | Journal article
DOI: 10.1007/s10854-023-11913-6
Contributors: Jong-Min Jeong; Dongjin Kim; Jungsoo Kim; Junghwan Bang; Seung-Boo Jung; Min-Su Kim
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Crossref

Highly increased hydrovoltaic power generation via surfactant optimization of carbon black solution for cellulose microfiber cylindrical generator

Surfaces and Interfaces
2023-06 | Journal article
DOI: 10.1016/j.surfin.2023.102853
Contributors: Jiyoon Youm; Seung-Hwan Lee; Inhee Cho; Da-Woon Jeong; Junghwan Bang; Hyung-Ho Park; Min-Su Kim
Source: check_circle
Crossref

Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer

Journal of Materials Science: Materials in Electronics
2021-01-20 | Journal article
DOI: 10.1007/s10854-020-04879-2
Contributors: Wonil Seo; Min-Su Kim; Yong-Ho Ko; Young-Ho Kim; Sehoon Yoo
Source: check_circle
Crossref

Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding

Journal of Materials Science: Materials in Electronics
2020-01-30 | Journal article
DOI: 10.1007/s10854-019-02634-w
Contributors: Tae-Young Lee; Min-Su Kim; Yong-Ho Ko; Young-Ho Kim; Sehoon Yoo
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Preferred source (of 2)‎

Effect of indium on deformation of binary In-Bi alloys

2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
2018 | Conference paper
DOI: 10.1109/EPTC.2017.8277499
EID:

2-s2.0-85050595827
Contributors: Jin, S.; Kim, M.-S.; Kanayama, S.; Nishikawa, H.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Laser-assisted selective fusing of thermal sprayed Ni-based self-fluxing alloys by using high-power diode lasers

Optics and Laser Technology
2018 | Journal article
DOI: 10.1016/j.optlastec.2017.10.021
EID:

2-s2.0-85032750133
Contributors: Chun, E.-J.; Kim, M.-S.; Nishikawa, H.; Park, C.; Suh, J.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Microstructural characterization of surface softening behavior for Cu-bearing martensitic steels after laser surface heat treatment

Metals
2018 | Journal article
DOI: 10.3390/met8060470
EID:

2-s2.0-85049015758
Contributors: Chun, E.-J.; Sim, A.; Kim, M.-S.; Kang, N.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Microstructure and mechanical properties of indium–bismuth alloys for low melting-temperature solder

Journal of Materials Science: Materials in Electronics
2018 | Journal article
DOI: 10.1007/s10854-018-9738-0
EID:

2-s2.0-85050822961
Contributors: Jin, S.; Kim, M.-S.; Kanayama, S.; Nishikawa, H.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Shear properties of In-Bi alloy joints with Cu substrates during thermal aging

Microelectronics Reliability
2018-09 | Journal article
DOI: 10.1016/j.microrel.2018.07.046
Contributors: Sanghun Jin; Min-Su Kim; Shutetsu Kanayama; Hiroshi Nishikawa
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Crossref
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Preferred source (of 2)‎

Microstructural characterization of Ni-based self-fluxing alloy after selective surface-engineering using diode laser

Applied Surface Science
2018-06 | Journal article
DOI: 10.1016/j.apsusc.2018.02.226
Contributors: Eun-Joon Chun; Changkyoo Park; Hiroshi Nishikawa; Min-Su Kim
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Crossref
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Preferred source (of 2)‎

Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

Journal of Alloys and Compounds
2017 | Journal article
DOI: 10.1016/j.jallcom.2017.09.011
EID:

2-s2.0-85029178767
Contributors: Bang, J.; Yu, D.-Y.; Ko, Y.-H.; Kim, M.-S.; Nishikawa, H.; Lee, C.-W.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Transmission electron microscopy investigation on the Oxidation behavior of Electroless Ni/Immersion Au surface finish at 250 C

Journal of Nanoscience and Nanotechnology
2017 | Journal article
DOI: 10.1166/jnn.2017.15152
EID:

2-s2.0-85027310543
Contributors: Kim, M.-S.; Nishikawa, H.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Influence of ENIG defects on shear strength of pressureless Ag nanoparticle sintered joint under isothermal aging

Microelectronics Reliability
2017-09 | Journal article
DOI: 10.1016/j.microrel.2017.06.083
Contributors: Min-Su Kim; Hiroshi Nishikawa
Source: check_circle
Crossref
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Preferred source (of 2)‎

Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016
2016 | Conference paper
EID:

2-s2.0-84995642356
Contributors: Nishikawa, H.; Matsunaga, K.; Kim, M.-S.; Saito, M.; Mizuno, J.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Reliability of Ag nanoporous bonding joint for high temperature die attach under temperature cycling

Materials Transactions
2016 | Journal article
DOI: 10.2320/matertrans.MD201518
EID:

2-s2.0-84978437148
Contributors: Kim, M.-S.; Matsunaga, K.; Ko, Y.-H.; Lee, C.-W.; Nishikawa, H.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Effect of Au nanoporous structure on bonding strength

ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
2015 | Conference paper
DOI: 10.1109/ICEP-IAAC.2015.7111127
EID:

2-s2.0-84936128976
Contributors: Matsunaga, K.; Kim, M.-S.; Nishikawa, H.; Saito, M.; Mizuno, J.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Effect of isothermal aging on microstructure and joint strength of Ag nanoporous bonding for high temperature die attach

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
2015 | Conference paper
DOI: 10.1109/IMPACT.2015.7365186
EID:

2-s2.0-84964273808
Contributors: Kim, M.-S.; Nishikawa, H.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Effects of bonding temperature on microstructure, fracture behavior and joint strength of Ag nanoporous bonding for high temperature die attach

Materials Science and Engineering A
2015 | Journal article
DOI: 10.1016/j.msea.2015.08.015
EID:

2-s2.0-84939556530
Contributors: Kim, M.-S.; Nishikawa, H.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Effect of isothermal aging on the growth behavior of Cu/Al intermetallic compounds

2014 | Conference paper
DOI:

10.1109/ICEP.2014.6826679

EID:

2-s2.0-84903723151
Contributors: Mokhtari, O.; Kim, M.-S.; Nishikawa, H.; Kawashiro, F.; Itou, S.; Maeda, T.; Hirose, T.; Eto, T.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Effect of joining conditions on the joint strength of Ag nanoporous bonding

2014 | Conference paper
DOI:

10.1109/ICEP.2014.6826734

EID:

2-s2.0-84903736191
Contributors: Kim, M.-S.; Nishikawa, H.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Microstructural change of Ag nanoporous bonding joint and interdiffusion of Cu/Ag during thermal aging

2014 | Conference paper
DOI:

10.1109/LTB-3D.2014.6886181

EID:

2-s2.0-84906980123
Contributors: Kim, M.-S.; Nishikawa, H.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Relationship between bonding conditions and strength for joints using a Au nanoporous sheet

2014 | Conference paper
DOI:

10.1109/ESTC.2014.6962855

EID:

2-s2.0-84918572618
Contributors: Matsunaga, K.; Kim, M.-S.; Nishikawa, H.; Saito, M.; Mizuno, J.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Silver nanoporous sheet for solid-state die attach in power device packaging

2014 | Journal article
DOI:

10.1016/j.scriptamat.2014.08.010

EID:

2-s2.0-84908125595
Contributors: Kim, M.-S.; Nishikawa, H.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Thermal stability of electroless nickel/immersion gold surface finish for direct bond copper

2014 | Conference paper
DOI:

10.1109/ESTC.2014.6962845

EID:

2-s2.0-84918593569
Contributors: Kim, M.-S.; Nishikawa, H.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier

Fabrication of nanoporous silver and microstructural change during dealloying of melt-spun Al-20 at.%Ag in hydrochloric acid

2013 | Journal article
DOI:

10.1007/s10853-013-7360-3

EID:

2-s2.0-84878637991
Contributors: Kim, M.-S.; Nishikawa, H.
Source: Self-asserted source
Min-Su Kim via Scopus - Elsevier
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