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Ajou University: Suwon, KR

2024-09-01 to present | Assistant Professor (Department of Intelligence Semiconductor Engineering)
Employment
Source: Self-asserted source
Hayoung Lee

Works (41)

Multi-Stage Enhanced Diagnosis With Fault Candidate Reduction

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
2025 | Journal article
DOI: 10.1109/TCAD.2025.3549352
Contributors: Hyojoon Yun; Hyeonchan Lim; Hayoung Lee; Sungho Kang
Source: check_circle
Crossref

A Robust Test Architecture for Low-Power AI Accelerators

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
2025-04 | Journal article
DOI: 10.1109/TCAD.2024.3476464
Contributors: Hayoung Lee; Juyong Lee; Sungho Kang
Source: check_circle
Crossref

A Cost-Effective Per-Pin ALPG for High-Speed Memory Testing

IEEE Transactions on Very Large Scale Integration (VLSI) Systems
2025-03 | Journal article
DOI: 10.1109/TVLSI.2024.3486332
Contributors: Juyong Lee; Hayoung Lee; Sooryeong Lee; Sungho Kang
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A New Pipelined Output Data Reducer of BOST for Improved Parallelism

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
2025-02 | Journal article
DOI: 10.1109/TCAD.2024.3445258
Contributors: Sooryeong Lee; Hayoung Lee; Juyong Lee; Sungho Kang
Source: check_circle
Crossref

Effective Parallel Redundancy Analysis Using GPU for Memory Repair

IEEE Transactions on Very Large Scale Integration (VLSI) Systems
2025-02 | Journal article
DOI: 10.1109/TVLSI.2024.3454286
Contributors: Seung Ho Shin; Hayoung Lee; Sungho Kang
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Crossref
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A Built-In Self-Repair With Maximum Fault Collection and Fast Analysis Method for HBM

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
2024 | Journal article
DOI: 10.1109/TCAD.2024.3499903
Contributors: Joonsik Yoon; Hayoung Lee; Youngki Moon; Seung Ho Shin; Sungho Kang
Source: check_circle
Crossref

A New Fail Address Memory Architecture for Cost-Effective ATE

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
2024 | Journal article
DOI: 10.1109/TCAD.2023.3337708
Contributors: Hayoung Lee; Sooryeong Lee; Sungho Kang
Source: check_circle
Crossref

A New ISA for High-Speed and Area-Efficient ALPG

IEEE Transactions on Circuits and Systems II: Express Briefs
2024 | Journal article
DOI: 10.1109/TCSII.2024.3364057
Contributors: Juyong Lee; Hayoung Lee; Sooryeong Lee; Sungho Kang
Source: check_circle
Crossref

An Area-Efficient Systolic Array Redundancy Architecture for Reliable AI Accelerator

IEEE Transactions on Very Large Scale Integration (VLSI) Systems
2024 | Journal article
DOI: 10.1109/TVLSI.2024.3421563
Contributors: Hayoung Lee; Jongho Park; Sungho Kang
Source: check_circle
Crossref

An Efficient Scan Diagnosis for Intermittent Faults Using CNN With Multi-Channel Data

IEEE Access
2024 | Journal article
DOI: 10.1109/ACCESS.2024.3475229
Contributors: Hyojun Yun; Hyeonchan Lim; Hayoung Lee; Doohyun Yoon; Sungho Kang
Source: check_circle
Crossref

GRAP: Efficient GPU-Based Redundancy Analysis Using Parallel Evaluation for Cross Faults

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
2024 | Journal article
DOI: 10.1109/TCAD.2024.3370108
Contributors: Seung Ho Shin; Hayoung Lee; Sungho Kang
Source: check_circle
Crossref

RA-Aware Fail Data Collection Architecture for Cost Reduction

IEEE Transactions on Very Large Scale Integration (VLSI) Systems
2024-06 | Journal article
DOI: 10.1109/TVLSI.2023.3343369
Contributors: Hayoung Lee; Sooryeong Lee; Sungho Kang
Source: check_circle
Crossref

STRAIT: Self-Test and Self-Recovery for AI Accelerator

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
2023 | Journal article
DOI: 10.1109/TCAD.2023.3236875
Contributors: Hayoung Lee; Jihye Kim; Jongho Park; Sungho Kang
Source: check_circle
Crossref

GPU-Based Redundancy Analysis using Partitioning Method for Memory Repair

2023 20th International SoC Design Conference (ISOCC)
2023-10-25 | Conference paper
DOI: 10.1109/isocc59558.2023.10396265
Contributors: Younwoo Yoo; Hayoung Lee; Seung Ho Shin; Sungho Kang
Source: Self-asserted source
Hayoung Lee

Redundancy Analysis Simplification Scheme for High-Speed Memory Repair

2023 20th International SoC Design Conference (ISOCC)
2023-10-25 | Conference paper
DOI: 10.1109/isocc59558.2023.10396258
Contributors: Hayoung Lee; Younwoo Yoo; Seung Ho Shin; Sungho Kang
Source: Self-asserted source
Hayoung Lee

TRUST: Through-Silicon via Repair Using Switch Matrix Topology

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
2023-07 | Journal article
DOI: 10.1109/TCAD.2022.3220711
Contributors: Hayoung Lee; Seung Ho Shin; Younwoo Yoo; Sungho Kang
Source: check_circle
Crossref

An Improved Early Termination Methodology Using Convolutional Neural Network

2022 19th International SoC Design Conference (ISOCC)
2022-10-19 | Conference paper
DOI: 10.1109/isocc56007.2022.10031485
Contributors: Seung Ho Shin; Hayoung Lee; Sooryeong Lee; Younwoo Yoo; Sungho Kang
Source: Self-asserted source
Hayoung Lee

FAME: Fault Address Memory Structure for Repair Time Reduction

2022 19th International SoC Design Conference (ISOCC)
2022-10-19 | Conference paper
DOI: 10.1109/isocc56007.2022.10031369
Contributors: Hayoung Lee; Sooryeong Lee; Younwoo Yoo; Seung Ho Shin; Sungho Kang
Source: Self-asserted source
Hayoung Lee

PROG: Per-Row Output Generator for BOST

2022 19th International SoC Design Conference (ISOCC)
2022-10-19 | Conference paper
DOI: 10.1109/isocc56007.2022.10031319
Contributors: Sooryeong Lee; Hayoung Lee; Younwoo Yoo; Seung Ho Shin; Sungho Kang
Source: Self-asserted source
Hayoung Lee

ZOS: Zero Overhead Scan for Systolic Array-based AI accelerator

2022 19th International SoC Design Conference (ISOCC)
2022-10-19 | Conference paper
DOI: 10.1109/isocc56007.2022.10031441
Contributors: Jihye Kim; Hayoung Lee; Jongho Park; Sunho Kang
Source: Self-asserted source
Hayoung Lee

Multibank Optimized Redundancy Analysis Using Efficient Fault Collection

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
2022-08 | Journal article
DOI: 10.1109/TCAD.2021.3109859
Contributors: Hogyeong Kim; Hayoung Lee; Donghyun Han; Sungho Kang
Source: check_circle
Crossref

ECMO: ECC Architecture Reusing Content-Addressable Memories for Obtaining High Reliability in DRAM

IEEE Transactions on Very Large Scale Integration (VLSI) Systems
2022-06 | Journal article
DOI: 10.1109/TVLSI.2022.3153894
Contributors: Hayoung Lee; Younwoo Yoo; Seung Ho Shin; Sungho Kang
Source: check_circle
Crossref

ECC-Aware Fast and Reliable Pattern Matching Redundancy Analysis for Highly Reliable Memory

IEEE Access
2021 | Journal article
DOI: 10.1109/ACCESS.2021.3115496
Contributors: Donghyun Han; Hayoung Lee; Seungtaek Lee; Sungho Kang
Source: check_circle
Crossref

Effective Spare Line Allocation Built-in Redundancy Analysis With Base Common Spare for Yield Improvement of 3D Memory

IEEE Access
2021 | Journal article
DOI: 10.1109/ACCESS.2021.3082949
Contributors: Donghyun Han; Hayoung Lee; Sungho Kang
Source: check_circle
Crossref

On-Chip Error Detection Reusing Built-In Self-Repair for Silicon Debug

IEEE Access
2021 | Journal article
DOI: 10.1109/ACCESS.2021.3071517
Contributors: Hayoung Lee; Hyunggoy Oh; Sungho Kang
Source: check_circle
Crossref

An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA

2021 18th International SoC Design Conference (ISOCC)
2021-10-06 | Conference paper
DOI: 10.1109/isocc53507.2021.9613980
Contributors: Seung Ho Shin; Hayoung Lee; Younwoo Yoo; Sungho Kang
Source: Self-asserted source
Hayoung Lee

Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory

2021 18th International SoC Design Conference (ISOCC)
2021-10-06 | Conference paper
DOI: 10.1109/isocc53507.2021.9613892
Contributors: Younwoo Yoo; Hayoung Lee; Seung Ho Shin; Sungho Kang
Source: Self-asserted source
Hayoung Lee

Fine-Grained Defect Diagnosis for CMOL FPGA Circuits

IEEE Access
2020 | Journal article
DOI: 10.1109/ACCESS.2020.3022027
Contributors: Jihye Kim; Hayoung Lee; Seokjun Jang; Sungho Kang
Source: check_circle
Crossref

Fail Memory Configuration Set for RA Estimation

2020 IEEE International Test Conference (ITC)
2020-11-01 | Conference paper
DOI: 10.1109/itc44778.2020.9325273
ISBN: 9781728191133
Source: Self-asserted source
Hayoung Lee

Redundancy Analysis Optimization with Clustered Known Solutions for High Speed Repair

2020 International SoC Design Conference (ISOCC)
2020-10-21 | Conference paper
DOI: 10.1109/isocc50952.2020.9332931
ISBN: 9781728183312
Source: Self-asserted source
Hayoung Lee
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W-ERA: One-Time Memory Repair with Wafer-Level Early Repair Analysis for Cost Reduction

2020 IEEE International Test Conference in Asia (ITC-Asia)
2020-09 | Conference paper
DOI: 10.1109/itc-asia51099.2020.00028
ISBN: 9781728189444
Source: Self-asserted source
Hayoung Lee

GPU-Based Redundancy Analysis Using Concurrent Evaluation

IEEE Transactions on Very Large Scale Integration (VLSI) Systems
2020-03 | Journal article
DOI: 10.1109/tvlsi.2019.2954549
Part of ISSN: 1063-8210
Part of ISSN: 1557-9999
Source: Self-asserted source
Hayoung Lee

Dynamic Built-In Redundancy Analysis for Memory Repair

IEEE Transactions on Very Large Scale Integration (VLSI) Systems
2019-10 | Journal article
DOI: 10.1109/tvlsi.2019.2920999
Part of ISSN: 1063-8210
Part of ISSN: 1557-9999
Source: Self-asserted source
Hayoung Lee

Redundancy Analysis based on Fault Distribution for Memory with Complex Spares

2019 International SoC Design Conference (ISOCC)
2019-10-06 | Conference paper
DOI: 10.1109/isocc47750.2019.9078503
ISBN: 9781728124780
Source: Self-asserted source
Hayoung Lee

3D Memory Formed of Unrepairable Memory Dice and Spare Layer

TENCON 2018 - 2018 IEEE Region 10 Conference
2018-10 | Conference paper
DOI: 10.1109/tencon.2018.8650278
ISBN: 9781538654576
Source: Self-asserted source
Hayoung Lee

Fault Group Pattern Matching With Efficient Early Termination for High-Speed Redundancy Analysis

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
2018-07 | Journal article
DOI: 10.1109/tcad.2017.2760505
Part of ISSN: 0278-0070
Part of ISSN: 1937-4151
Source: Self-asserted source
Hayoung Lee

Fast Built-In Redundancy Analysis Based on Sequential Spare Line Allocation

IEEE Transactions on Reliability
2018-03 | Journal article
DOI: 10.1109/tr.2017.2778301
Part of ISSN: 0018-9529
Part of ISSN: 1558-1721
Source: Self-asserted source
Hayoung Lee

An Area-Efficient BIRA With 1-D Spare Segments

IEEE Transactions on Very Large Scale Integration (VLSI) Systems
2018-01 | Journal article
DOI: 10.1109/tvlsi.2017.2752298
Part of ISSN: 1063-8210
Part of ISSN: 1557-9999
Source: Self-asserted source
Hayoung Lee

A new repair scheme for TSV-based 3D memory using base die repair cells

2017 International SoC Design Conference (ISOCC)
2017-11 | Conference paper
DOI: 10.1109/isocc.2017.8368804
ISBN: 9781538622858
Source: Self-asserted source
Hayoung Lee

Discussion of cost-effective redundancy architectures

2016 International SoC Design Conference (ISOCC)
2016-10 | Conference paper
DOI: 10.1109/isocc.2016.7799751
ISBN: 9781509032198
Source: Self-asserted source
Hayoung Lee

A scan segment skip technique for low power test

2015 International SoC Design Conference (ISOCC)
2015-11 | Conference paper
DOI: 10.1109/isocc.2015.7401669
ISBN: 9781467393089
Source: Self-asserted source
Hayoung Lee
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