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Employment (2)

Technische Universität Berlin: Berlin, Berlin, DE

2016-10-01 to present | Head of Lab (Mixed Signal Circuit Design)
Employment
Source: Self-asserted source
Philipp Scholz

Technische Universität Berlin: Berlin, Berlin, DE

2011-12-20 to 2016-09-30 | PostDoc (Semiconductor Devices)
Employment
Source: Self-asserted source
Philipp Scholz

Works (6)

Design and Characterization of a Variable Gain D-Band LNA for Optimized Link Budgeting for a 6G Receiver in 22FDX

IEEE Transactions on Microwave Theory and Techniques
2024-02 | Journal article
DOI: 10.1109/TMTT.2023.3298197
Contributors: Patrick James Artz; Quang Huy Le; Dang Khoa Huynh; Philipp Scholz; Thomas Kämpfe; Steffen Lehmann; Thomas Mausolf; Friedel Gerfers
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Crossref

Digital Non-Linear Transmitter Equalization for PAM-N-Based VCSEL Links Enabling Robust Data Transmission of 100 Gbit/s and Beyond

Photonics
2023-03-07 | Journal article
DOI: 10.3390/photonics10030280
Contributors: Urs Hecht; Nikolay Ledentsov, Jr.; Helia Ordouei; Patrick Kurth; Philipp Scholz; Nikolay Ledentsov; Friedel Gerfers
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Crossref

A 3-GS/s RF Track-and-Hold Amplifier Utilizing Body-Biasing With >55-dBFS SNR and >67-dBc SFDR Up to 3 GHz in 22-nm CMOS SOI

IEEE Open Journal of the Solid-State Circuits Society
2022 | Journal article
DOI: 10.1109/OJSSCS.2022.3217019
Contributors: Enne Wittenhagen; Patrick James Artz; Philipp Scholz; Friedel Gerfers
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Crossref

A 9-bit, 45 mW, 0.05 mm2 Source-Series-Terminated DAC Driver With Echo Canceller in 22-nm CMOS for In-Vehicle Communication

IEEE Solid-State Circuits Letters
2021 | Journal article
DOI: 10.1109/LSSC.2020.3048752
Contributors: Hossein Ghafarian; Suhas Shivapakash; Sanaz Mortazavi; Philipp Scholz; Nima Lotfi; Friedel Gerfers
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Crossref

A 3.1-dBm E-Band Truly Balanced Frequency Quadrupler in 22-nm FDSOI CMOS

IEEE Microwave and Wireless Components Letters
2020-12 | Journal article
DOI: 10.1109/LMWC.2020.3028053
Contributors: Soenke Vehring; Yaoshun Ding; Philipp Scholz; Friedel Gerfers
Source: check_circle
Crossref

IC Debug and Fault Isolation for an Age of IoE and High Data Rates—A Vision

IEEE Transactions on Components, Packaging and Manufacturing Technology
2018-05 | Journal article
DOI: 10.1109/TCPMT.2018.2816985
Contributors: Christian Boit; Philipp Scholz
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