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Model-Based Optimization of CMP Process Parameters for Uniform Material Removal Selectivity in Cu/Barrier Planarization

ECS Journal of Solid State Science and Technology
2022-02-01 | Journal article
DOI: 10.1149/2162-8777/ac4ffb
Contributors: Wazir Akbar; Özgür Ertunç
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A Coupled Material Removal Model for Chemical Mechanical Polishing Processes

ECS Journal of Solid State Science and Technology
2021-10-01 | Journal article
DOI: 10.1149/2162-8777/ac3057
Contributors: Wazir Akbar; Özgür Ertunç
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