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Works (10)

Impacts of the Pressure Distribution on Dynamic Avalanche in Single Press-Pack IGBT Chip

IEEE Transactions on Power Electronics
2024-07 | Journal article
DOI: 10.1109/TPEL.2024.3381921
Contributors: Tianchen Li; Yaohua Wang; Yiming Zhang; Jiayu Fan; Xuebao Li; Lei Qi; Xiang Cui
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Thermo-Hygroscopic-Mechanical Coupling Simulation Method for Power Electronics Under Power Cycling Test

IEEE Transactions on Power Electronics
2023-09 | Journal article
DOI: 10.1109/TPEL.2023.3290749
Contributors: Yanhao Wang; Erping Deng; Tianhua Wu; Yiming Zhang; Luhong Xie; Yongzhang Huang
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Advanced Power Cycling Test Integrated With Voltage, Current, Temperature, and Humidity Stress

IEEE Transactions on Power Electronics
2023-06 | Journal article
DOI: 10.1109/TPEL.2023.3246498
Contributors: Yanhao Wang; Erping Deng; Lixin Wu; Haiyang Cao; Yuxing Yan; Pin Zeng; Yiming Zhang; Yushan Zhao; Yongzhang Huang
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Influence of the Uneven Temperature Distribution on the Electrode Warpage of PP IGBTs

IEEE Transactions on Power Electronics
2023-04 | Journal article
DOI: 10.1109/TPEL.2022.3227589
Contributors: Yiming Zhang; Erping Deng; Jiaqi Guo; Zhibin Zhao; Yan Zhong; Lei Zhang; Xinling Tang; Xiang Cui
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Crossref

On the image method of separable variable problems

Physica Scripta
2023-03-01 | Journal article
DOI: 10.1088/1402-4896/acb7aa
Contributors: Yiming Zhang; Zhibin Zhao; Chongqing Jiao; Xiang Cui
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Influence of Thermal Coupling on Lifetime Under Power Cycling Test

IEEE Transactions on Power Electronics
2022-11 | Journal article
DOI: 10.1109/TPEL.2022.3182146
Contributors: Yushan Zhao; Erping Deng; Maoyang Pan; Yiming Zhang; Yongzhang Huang
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Research on the Multiphysics Field-Circuit Coupling Model of Press Pack IGBT Considering the Application of Hybrid HVDC Breakers

IEEE Journal of Emerging and Selected Topics in Power Electronics
2021-08 | Journal article
DOI: 10.1109/JESTPE.2020.3019433
Contributors: Erping Deng; Oliver Wenzel; Zhibin Zhao; Yiming Zhang; Xiaoliang Ying; Jinyuan Li; Yongzhang Huang
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Crossref

Calibration Method of Junction Temperature Measurement for Press-Pack IGBTs

IEEE Transactions on Components, Packaging and Manufacturing Technology
2021-07 | Journal article
DOI: 10.1109/TCPMT.2021.3084966
Contributors: Jie Chen; Erping Deng; Yiming Zhang; Yongzhang Huang
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Sequential V ce(T) Method for the Accurate Measurement of Junction Temperature Distribution Within Press-Pack IGBTs

IEEE Transactions on Power Electronics
2021-04 | Journal article
DOI: 10.1109/TPEL.2020.3024815
Contributors: Yiming Zhang; Erping Deng; Zhibin Zhao; Jie Chen; Yushan Zhao; Jiaqi Guo; Xiang Cui
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Crossref

A Physical Thermal Network Model of Press Pack IGBTs Considering Spreading and Coupling Effects

IEEE Transactions on Components, Packaging and Manufacturing Technology
2020-10 | Journal article
DOI: 10.1109/TCPMT.2020.3020967
Contributors: Yiming Zhang; Erping Deng; Zhibin Zhao; Shi Fu; Xiang Cui
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