Personal information
Verified email addresses
a.mohan.2@warwick.ac.uk
anand.mohan@warwick.ac.uk
anandmohan051293@gmail.com
anand.mohan@brunel.ac.uk
Verified email domains
brunel.ac.uk
warwick.ac.uk
Activities
Works (11)
Journal of Advanced Joining Processes
2024
|
Journal article
EID:
2-s2.0-85190720978
Contributors:
Mohan, A.;
Hayat, Q.;
Dinda, S.K.;
Pamarthi, V.V.;
Franciosa, P.;
Ceglarek, D.;
Auinger, M.
Source:
Anand Mohan
via
Scopus - Elsevier
grade
Preferred source
(of
2)
Journal of Advanced Joining Processes
2024-11
|
Journal article
Contributors:
Anand Mohan;
Pasquale Franciosa;
Dan Dai;
Dariusz Ceglarek
Source:
check_circle
Crossref
grade
Preferred source
(of
2)
2024 IEEE International Conference on Systems, Man, and Cybernetics (SMC)
2024-10-06
|
Conference paper
Contributors:
Dan Dai;
Anand Mohan;
Pasquale Franciosa;
Tong Zhang;
C. L. Philip Chen;
Dariusz Ceglarek
Source:
Anand Mohan
Journal of Laser Applications
2023
|
Journal article
EID:
2-s2.0-85174940824
Contributors:
Hayat, Q.;
Franciosa, P.;
Chianese, G.;
Mohan, A.;
Ceglarek, D.;
Griffiths, A.;
Harris, C.
Source:
Anand Mohan
via
Scopus - Elsevier
grade
Preferred source
(of
2)
International Journal of Advanced Manufacturing Technology
2023
|
Journal article
EID:
2-s2.0-85144892705
Contributors:
Mohan, A.;
Franciosa, P.;
Ceglarek, D.;
Auinger, M.
Source:
Anand Mohan
via
Scopus - Elsevier
grade
Preferred source
(of
2)
Science and Technology of Welding and Joining
2023-07-04
|
Journal article
Contributors:
Anand Mohan;
Dariusz Ceglarek;
Pasquale Franciosa;
Michael Auinger
Source:
Anand Mohan
grade
Preferred source
(of
2)
Materials Today: Proceedings
2022
|
Journal article
|
Writing - original draft, Methodology, Software
Contributors:
Anand Mohan
Source:
Anand Mohan
grade
Preferred source
(of
2)
International Journal of Advanced Manufacturing Technology
2022
|
Journal article
EID:
2-s2.0-85139259410
Contributors:
Mohan, A.;
Ceglarek, D.;
Auinger, M.
Source:
Anand Mohan
via
Scopus - Elsevier
grade
Preferred source
(of
2)
Journal of Materials Research and Technology
2022
|
Journal article
EID:
2-s2.0-85144816981
Contributors:
Sun, T.;
Mohan, A.;
Liu, C.;
Franciosa, P.;
Ceglarek, D.
Source:
Anand Mohan
via
Scopus - Elsevier
grade
Preferred source
(of
2)
Research Square
2021
|
Other
EID:
2-s2.0-85166888129
Contributors:
Mohan, A.;
Ceglarek, D.;
Auinger, M.
Source:
Anand Mohan
via
Scopus - Elsevier
Metallurgical and Materials Transactions A
2021-05
|
Journal article
Contributors:
Anand Mohan
Source:
Anand Mohan
grade
Preferred source
(of
2)