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ResearcherID: P-5490-2016

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Employment (1)

National Institute of Standards and Technology: Gaithersburg, MD, US

2016-09 to present | NRC Postdoctoral Researcher (Materials Measurement Laboratory)
Employment
Source: Self-asserted source
Trevor Braun

Education and qualifications (2)

University of Washington: Seattle, Washington, US

2011 to present (Chemical Engineering)
Education
Source: Self-asserted source
Trevor Braun

Colorado School of Mines: Golden, Colorado, US

2007 to 2011 | BS (Chemical Engineering)
Education
Source: Self-asserted source
Trevor Braun

Works (16)

Mechanism of Bismuth Stimulated Bottom-up Gold Feature Filling

Journal of The Electrochemical Society
2022-12-01 | Journal article
DOI: 10.1149/1945-7111/acaccc
Contributors: D. Josell; T. M. Braun; T. P. Moffat
Source: check_circle
Crossref

Mapping Surface Chemistry During Superfilling with Shell-Isolated Nanoparticle Enhanced Raman Spectroscopy and X-ray Photoelectron Spectroscopy

Journal of The Electrochemical Society
2022-08-01 | Journal article
DOI: 10.1149/1945-7111/ac8023
Contributors: David Raciti; Trevor Braun; Angela R. Hight Walker; Thomas P. Moffat
Source: check_circle
Crossref

Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias

Journal of The Electrochemical Society
2022-03-01 | Journal article
DOI: 10.1149/1945-7111/ac5ad8
Contributors: S.-H. Kim; T. M. Braun; H.-J. Lee; T. P. Moffat; D. Josell
Source: check_circle
Crossref

Simulating the Influence of Supporting Electrolyte Concentration on Copper Electrodeposition in Microvias

Journal of The Electrochemical Society
2022-01-01 | Journal article
DOI: 10.1149/1945-7111/ac4845
Contributors: T. M. Braun; J. John; N. Jayaraju; D. Josell; T. P. Moffat
Source: check_circle
Crossref

Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias

Journal of The Electrochemical Society
2021-11-01 | Journal article
DOI: 10.1149/1945-7111/ac2bea
Contributors: S.-H. Kim; H.-J. Lee; T. M. Braun; T. P. Moffat; D. Josell
Source: check_circle
Crossref

Simulating Cu electrodeposition in high aspect ratio features: Effect of control mode and uncompensated resistance in S-NDR systems

Electrochimica Acta
2021-04 | Journal article
DOI: 10.1016/j.electacta.2021.137925
Contributors: T.M. Braun; D. Josell; T.P. Moffat
Source: check_circle
Crossref

Editors' Choice—Simulation of Copper Electrodeposition in Through-Hole Vias

Journal of The Electrochemical Society
2020 | Journal article
DOI: 10.1149/2.0102001JES
Contributors: T. M. Braun; D. Josell; J. John; T. P. Moffat
Source: check_circle
Crossref

Simulation of Copper Electrodeposition in Millimeter Size Through-Silicon Vias

Journal of The Electrochemical Society
2020-12-01 | Journal article
DOI: 10.1149/1945-7111/abd112
Contributors: T. M. Braun; D. Josell; S. Deshpande; J. John; T. P. Moffat
Source: check_circle
Crossref

Microelectrode Studies of S-NDR Copper Electrodeposition: Potentiodynamic and Galvanodynamic Measurements and Simulations

Journal of The Electrochemical Society
2020-01-05 | Journal article
DOI: 10.1149/1945-7111/ab8e86
Contributors: T. M. Braun; D. Josell; T. P. Moffat
Source: check_circle
Crossref

Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias

Journal of The Electrochemical Society
2019 | Journal article
DOI: 10.1149/2.0341901jes
Contributors: T. M. Braun; D. Josell; M. Silva; J. Kildon; T. P. Moffat
Source: check_circle
Crossref

Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction

Journal of The Electrochemical Society
2018 | Journal article
DOI: 10.1149/2.0911807jes
Contributors: T. M. Braun; S.-H. Kim; H.-J. Lee; T. P. Moffat; D. Josell
Source: check_circle
Crossref

Analytical and Computational Scaling Relationships for the Coupled Phenomena that Control Local Bipolar Electrochemical Behavior

Journal of The Electrochemical Society
2016 | Journal article
DOI: 10.1149/2.0041614jes
Contributors: Trevor M. Braun; Daniel T. Schwartz
Source: Self-asserted source
Trevor Braun via Crossref Metadata Search

Remote Control Electrodeposition: Principles for Bipolar Patterning of Substrates without an Electrical Connection

J. Electrochem. Soc.
2016 | Journal article
DOI: 10.1149/2.0031612jes
Contributors: Trevor M. Braun; Daniel T. Schwartz
Source: Self-asserted source
Trevor Braun via Crossref Metadata Search

The Emerging Role of Electrodeposition in Additive Manufacturing

Interface magazine
2016-01-01 | Journal article
DOI: 10.1149/2.f07161if
Contributors: T. M. Braun; D. T. Schwartz
Source: Self-asserted source
Trevor Braun via Crossref Metadata Search

Bipolar Electrochemical Displacement: A New Phenomenon with Implications for Self-Limiting Materials Patterning

ChemElectroChem
2015-10 | Journal article
DOI: 10.1002/celc.201500356
Contributors: Trevor M. Braun; Daniel T. Schwartz
Source: Self-asserted source
Trevor Braun via Crossref Metadata Search

Localized Electrodeposition and Patterning Using Bipolar Electrochemistry

Journal of the Electrochemical Society
2015-02 | Journal article
DOI: 10.1149/2.1031504jes
Contributors: T. M. Braun; D. T. Schwartz
Source: Self-asserted source
Trevor Braun via Crossref Metadata Search

Peer review (2 reviews for 2 publications/grants)

Review activity for ACS combinatorial science. (1)
Review activity for Langmuir : (1)
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