Personal information
Taiwan
Activities
Employment (1)
2021-01-18
to
present
|
Product Engineer - Process Team
(DRAM Engineering Group)
Employment
Source:
Yu-Cheng Cheng
Education and qualifications (3)
2013-02-01
to
2019-02-01
|
Ph.D.
(Computer Science and Engineering)
Education
Source:
Yu-Cheng Cheng
2011-08-01
to
2013-01-31
|
Master of Science
(Computer Science and Engineering)
Education
Source:
Yu-Cheng Cheng
2007-08-01
to
2011-07-31
|
Bachelor of Science
(Computer Science and Engineering)
Education
Source:
Yu-Cheng Cheng
Professional activities (1)
2019-05-09
to
present
|
Honorary Membership
Membership
Source:
Yu-Cheng Cheng
Works (16)
IEEE Transactions on Circuits and Systems II: Express Briefs
2021-02-01
|
Journal article
Source:
Yu-Cheng Cheng
IEEE Access
2020-06-19
|
Journal article
Source:
Yu-Cheng Cheng
Computers and Electrical Engineering
2020-01
|
Journal article
Source:
Yu-Cheng Cheng
IET Circuits, Devices & Systems
2019-10-10
|
Journal article
Source:
Yu-Cheng Cheng
2019 IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 22)
2019-04
|
Conference poster
Source:
Yu-Cheng Cheng
2019-01
|
Dissertation or Thesis
Source:
Yu-Cheng Cheng
2018 IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 21)
2018-04
|
Conference poster
Source:
Yu-Cheng Cheng
2017 The 28th VLSI Design/CAD Symposium
2017-08
|
Conference paper
Source:
Yu-Cheng Cheng
2017 IEEE Conference on Dependable and Secure Computing
2017-08
|
Conference paper
Source:
Yu-Cheng Cheng
2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)
2016-10
|
Conference paper
Source:
Yu-Cheng Cheng
2016 IEEE Symposium on Low-Power and High-Speed Chips (COOL Chips XIX)
2016-04
|
Conference poster
Source:
Yu-Cheng Cheng
2015 The 26th VLSI Design/CAD Symposium
2015-08
|
Conference paper
Source:
Yu-Cheng Cheng
2015 IEEE Symposium on Low-Power and High-Speed Chips (COOL Chips XVIII)
2015-04
|
Conference poster
Source:
Yu-Cheng Cheng
IEEE Transactions on Circuits and Systems I: Regular Papers
2014-09-18
|
Journal article
Source:
Yu-Cheng Cheng
2013 IEEE Symposium on Low-Power and High-Speed Chips (COOL Chips XVI)
2013-04
|
Conference poster
Source:
Yu-Cheng Cheng
2013-01
|
Dissertation or Thesis
Source:
Yu-Cheng Cheng