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Scopus Author ID: 56683248700
ResearcherID: AAE-8107-2021
SciProfiles: 464830

Keywords

MEMS Inertial Sensors

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China

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Employment (1)

Huazhong University of Science and Technology: Wuhan, Hubei, CN

2016-06-26 to present | Associate Professor/Dr. (Physics )
Employment
Source: Self-asserted source
HUAFENG LIU

Education and qualifications (2)

Imperial College London: London, London, GB

2012-04-01 to 2016-03-31 | PhD (Electrical and Electronic Engineering)
Education
Source: Self-asserted source
HUAFENG LIU

University of Southampton: Southampton, Southampton, GB

2010-09-17 to 2011-09-23 | MSc (Electronics ans Computer Science)
Education
Source: Self-asserted source
HUAFENG LIU

Works (50 of 64)

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Page 1 of 2

Multiaccelerometer-Based Method for High-Precision Angular Acceleration Measurement of Turntable

IEEE Transactions on Instrumentation and Measurement
2024 | Journal article
DOI: 10.1109/TIM.2024.3460928
Contributors: Yu Liang; Zhe Pei; Li Yu; Xukai Guo; Xiaobing Yu; Ji Fan; Chenyuan Hu; Liangcheng Tu; Zebing Zhou; Huafeng Liu
Source: check_circle
Crossref

Noise Analysis and In Situ Detection of the Electromagnetic Servo Actuator for a Nano-g Accelerometer With a Large Dynamic Range

IEEE Transactions on Instrumentation and Measurement
2024 | Journal article
DOI: 10.1109/TIM.2024.3351267
Contributors: Qiangwei Xu; Shitao Yan; Jinquan Liu; Huafeng Liu; Liangcheng Tu
Source: check_circle
Crossref

Tilt-Induced Noise Improvement of a Nano-g MEMS Accelerometer for Lunar Seismograph With Omnidirectional Deployment

IEEE Transactions on Instrumentation and Measurement
2024 | Journal article
DOI: 10.1109/TIM.2024.3481586
Contributors: Hao Ouyang; Ruikun Li; Qiu Wang; Yue Liu; Libo Qiu; Shaobo Qu; Huafeng Liu
Source: check_circle
Crossref

Towards True In-situ Temperature Compensation Utilizing Multiple Parameter Decoupling for Resonant MEMS Sensors Subject to Blue Sideband Excitation

IEEE Sensors Letters
2024 | Journal article
DOI: 10.1109/LSENS.2024.3374377
Contributors: Jingqian Xi; Zhuoyue Zheng; Huafeng Liu; Pan Zhang; Chun Zhao; Yuan Wang; Chen Wang; Michael Kraft; Rui P. Martins; Pui-In Mak
Source: check_circle
Crossref

An optomechanical MEMS geophone with a 2.5 ng/Hz1/2 noise floor for oil/gas exploration

Microsystems & Nanoengineering
2024-11-26 | Journal article
DOI: 10.1038/s41378-024-00802-5
Contributors: Shimin Jiao; Ziqiang Qu; Xujin Ma; Hao Ouyang; Wen Xiong; Shaolin Zhang; Qiu Wang; Huafeng Liu
Source: check_circle
Crossref

Electrostatic anti-spring-enhanced MEMS accelerometer with auto-tuning capability

2024-10-10 | Preprint
DOI: 10.21203/rs.3.rs-5038945/v1
Contributors: Huafeng LIU; Chen Wang; Yao Yuan; Milad Shojaeian; Sina Sadeghpour; Yuan Wang; Hang Gao; Jin-Hu Dou; Pan Zhang; Rui P. Martins et al.
Source: check_circle
Crossref

An electro-mechanical co-optimization platform for MEMS devices with freeform geometry based on a genetic algorithm

2024-09-09 | Preprint
DOI: 10.21203/rs.3.rs-4792905/v1
Contributors: Chen Wang; Xinyu Wu; Sina Sadeghpour; Milad Shojaeian; Linlin Wang; Aojie Quan; Yangyang Guan; Huafeng LIU; Yuan Wang; Pan Zhang et al.
Source: check_circle
Crossref

A Nano-g MOEMS Accelerometer Featuring Electromagnetic Force Balance With 157-dB Dynamic Range

IEEE Transactions on Industrial Electronics
2024-06 | Journal article
DOI: 10.1109/TIE.2023.3294597
Contributors: Ziqiang Qu; Hao Ouyang; Wen Xiong; Qiangwei Xu; Yuan Wang; Huafeng Liu
Source: check_circle
Crossref

Design, Fabrication, and Characterization of a Multicurved Surface Fusion Metal Resonant Gyroscope

IEEE Sensors Journal
2024-03-15 | Journal article
DOI: 10.1109/JSEN.2024.3358059
Contributors: Qi Cai; Xiaoming Zhang; Xue Liu; Wenqiang Wei; Chong Shen; Chong Li; Huafeng Liu; Huiliang Cao
Source: check_circle
Crossref

Micro-Electro-Mechanical Systems Microphones: A Brief Review Emphasizing Recent Advances in Audible Spectrum Applications

Micromachines
2024-02-29 | Journal article
DOI: 10.3390/mi15030352
Contributors: Zhuoyue Zheng; Chen Wang; Linlin Wang; Zeyu Ji; Xiaoxiao Song; Pui-In Mak; Huafeng Liu; Yuan Wang
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Multiple Parameter Decoupling for Resonant MEMS Sensors Exploiting Blue Sideband Excitation

Journal of Microelectromechanical Systems
2023 | Journal article
DOI: 10.1109/JMEMS.2023.3293464
Contributors: Jingqian Xi; Lei Xu; Yuan Wang; Huafeng Liu; Xingyin Xiong; Xudong Zou; Chengxin Li; Fangjing Hu; Chen Wang; Michael Kraft et al.
Source: check_circle
Crossref

Analysis of the Frequency-Dependent Vibration Rectification Error in Area-Variation-Based Capacitive MEMS Accelerometers

Micromachines
2023-12-28 | Journal article
DOI: 10.3390/mi15010065
Contributors: Shaolin Zhang; Zhi Li; Qiu Wang; Yuanxia Yang; Yongzhen Wang; Wen He; Jinquan Liu; Liangcheng Tu; Huafeng Liu
Source: check_circle
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A Nano-g Electromagnetic Accelerometer With 152-dB Wide Dynamic Range

IEEE Sensors Journal
2023-02-15 | Journal article
DOI: 10.1109/JSEN.2023.3234195
Contributors: Qiangwei Xu; Shitao Yan; Huafeng Liu; Jinquan Liu; Wenjie Wu; Liangcheng Tu
Source: check_circle
Crossref

Nano-g accelerometer with differential Fabry–Pérot interferometer for low-frequency noise suppression

Sensors and Actuators A: Physical
2022-10 | Journal article
DOI: 10.1016/j.sna.2022.113874
Contributors: Hao Ouyang; Ziqiang Qu; Huafeng Liu; Chenyuan Hu; Shitao Yan; Yongzhen Wang; Liangcheng Tu
Source: check_circle
Crossref

A Closed-Loop System for Resonant MEMS Sensors Subject to Blue-Sideband Excitation

Journal of Microelectromechanical Systems
2022-08 | Journal article
DOI: 10.1109/JMEMS.2022.3183021
Contributors: Lei Xu; Jingqian Xi; Lu Gao; Fangzheng Li; Jianyuan Pi; Chengxin Li; Kunfeng Wang; Xingyin Xiong; Yuan Wang; Huafeng Liu et al.
Source: check_circle
Crossref

Comparison study of high-sensitivity area-changed capacitive displacement transducers with low-impedance and high-impedance readout circuits

Review of Scientific Instruments
2022-08-01 | Journal article
DOI: 10.1063/5.0087555
Contributors: Qiangwei Xu; Qiu Wang; Yongzhen Wang; Shitao Yan; Huafeng Liu; Liangcheng Tu
Source: check_circle
Crossref

A Resonant Lorentz-Force Magnetometer Exploiting Blue Sideband Actuation to Enhance Sensitivity and Resolution

Journal of Microelectromechanical Systems
2022-06 | Journal article
DOI: 10.1109/JMEMS.2022.3162015
Contributors: Yuan Wang; Xiaoxiao Song; Jingqian Xi; Fangzheng Li; Lei Xu; Huafeng Liu; Chen Wang; Shuangyang Kuang; Liang-Cheng Tu; Michael Kraft et al.
Source: check_circle
Crossref

2.4 ng/√Hz low-noise fiber-optic MEMS seismic accelerometer

Optics Letters
2022-02-01 | Journal article
DOI: 10.1364/ol.443236
Part of ISSN: 0146-9592
Part of ISSN: 1539-4794
Source: Self-asserted source
HUAFENG LIU

Design of a large-range rotary microgripper with freeform geometries using a genetic algorithm

Microsystems & Nanoengineering
2022-01-06 | Journal article
DOI: 10.1038/s41378-021-00336-0
Contributors: Chen Wang; Yuan Wang; Weidong Fang; Xiaoxiao Song; Aojie Quan; Michiel Gidts; Hemin Zhang; Huafeng Liu; Jian Bai; Sina Sadeghpour et al.
Source: check_circle
Crossref

Cross-Coupling Coefficient Estimation of a Nano-g Accelerometer by Continuous Rotation Modulation on a Tilted Rate Table

IEEE Transactions on Instrumentation and Measurement
2021 | Journal article
DOI: 10.1109/TIM.2021.3070601
Contributors: Mengqi Zhang; Shitao Yan; Zhongguang Deng; Peng Chen; Zhi Li; Ji Fan; Huafeng Liu; Jinquan Liu; Liangcheng Tu
Source: check_circle
Crossref

A Resonant Lorentz-Force Magnetometer Featuring Slotted Double-Ended Tuning Fork Capable of Operating in a Bias Magnetic Field

Journal of Microelectromechanical Systems
2021-12 | Journal article
DOI: 10.1109/JMEMS.2021.3113769
Contributors: Yuan Wang; Xiaoxiao Song; Fangzheng Li; Lu Gao; Chengxin Li; Jingqian Xi; Huafeng Liu; Chun Zhao; Chen Wang; Liang-Cheng Tu et al.
Source: check_circle
Crossref

In-Situ Compensation on Temperature Coefficient of the Scale Factor for a Single-Axis Nano-g Force-Balance MEMS Accelerometer

IEEE Sensors Journal
2021-09-15 | Journal article
DOI: 10.1109/JSEN.2021.3098797
Contributors: Dandan Liu; Wenjie Wu; Shitao Yan; Qiangwei Xu; Yuanlei Wang; Huafeng Liu; Jinquan Liu; Ji Fan; Liangcheng Tu
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Crossref

On Enhancing the Sensitivity of Resonant Thermometers Based on Parametric Modulation

Journal of Microelectromechanical Systems
2021-08 | Journal article
DOI: 10.1109/JMEMS.2021.3079442
Contributors: Chengxin Li; Jingqian Xi; Yuan Wang; Fangzheng Li; Lu Gao; Huafeng Liu; Chun Zhao; Liang-Cheng Tu
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Crossref

Towards a Hybrid Mass Sensing System by Combining a QCM Mass Sensor With a 3-DOF Mode Localized Coupled Resonator Stiffness Sensor

IEEE Sensors Journal
2021-04-01 | Journal article
DOI: 10.1109/JSEN.2021.3052046
Contributors: Yuan Wang; Huafeng Liu; Chen Wang; Chun Zhao; Jean-Michel Redoute; Serguei Stoukatch; Qijun Xiao; Liang-Cheng Tu; Michael Kraft
Source: check_circle
Crossref

A diamagnetic levitation based inertial sensor for geophysical application

Sensors and Actuators, A: Physical
2020 | Journal article
DOI: 10.1016/j.sna.2020.112122
EID:

2-s2.0-85086075232

Part of ISBN:

09244247
Contributors: Wang, Q.; Ren, X.; Jiao, S.; Lei, X.; Zhang, S.; Liu, H.; Luo, P.; Tu, L.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

A High-resolution Area-change-based Capacitive MEMS Accelerometer for Tilt Sensing

INERTIAL 2020 - 7th IEEE International Symposium on Inertial Sensors and Systems, Proceedings
2020 | Conference paper
DOI: 10.1109/INERTIAL48129.2020.9090016
EID:

2-s2.0-85085489964
Contributors: Rao, K.; Liu, H.; Wei, X.; Wu, W.; Hu, C.; Fan, J.; Liu, J.; Tu, L.-C.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

A high-resolution area-change-based capacitive MEMS tilt sensor

Sensors and Actuators A: Physical
2020 | Journal article
DOI: 10.1016/J.SNA.2020.112191
WOSUID: WOS:000572843000013
Contributors: Rao, Kang; Liu, Huafeng; Wei, Xiaoli; Wu, Wenjie; Hu, Chenyuan; Fan, Ji; Liu, Jinquan; Tu, Liangcheng
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Web of Science Researcher Profile Sync

A low-temperature-operated direct fabrication method for all-solid-state flexible micro-supercapacitors

Journal of Power Sources
2020 | Journal article
DOI: 10.1016/j.jpowsour.2019.227415
EID:

2-s2.0-85075387892
Contributors: Wang, Y.; Sun, L.; Song, P.; Zhao, C.; Kuang, S.; Liu, H.; Xiao, D.; Hu, F.; Tu, L.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

A method for improving out-of-plane robustness of an area-changed capacitive displacement transducer used in a micro-accelerometer

Sensors and Actuators, A: Physical
2020 | Journal article
DOI: 10.1016/j.sna.2020.112156
EID:

2-s2.0-85086826839

Part of ISBN:

09244247
Contributors: Yan, S.; Liu, H.; Xu, Q.; Liu, D.; Zhang, M.; Wu, W.; Tu, L.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

Research progress on a 0.3 ng/Hz<sup>1/2</sup> ultra-high sensitivity MEMS accelerometer,0.3 ng/Hz<sup>1/2</sup>超高灵敏度MEMS加速度计研究进展

Zhongguo Guanxing Jishu Xuebao/Journal of Chinese Inertial Technology
2020 | Journal article
DOI: 10.13695/j.cnki.12-1222/o3.2020.01.016
EID:

2-s2.0-85085275961

Part of ISBN:

10056734
Contributors: Wang, Q.; Liu, H.; Xu, Q.; Song, X.; Yan, S.; Tu, L.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

Design of freeform geometries in a MEMS accelerometer with a mechanical motion preamplifier based on a genetic algorithm

Microsystems & Nanoengineering
2020-11-30 | Journal article
DOI: 10.1038/s41378-020-00214-1
Contributors: Chen Wang; Xiaoxiao Song; Weidong Fang; Fang Chen; Ioannis Zeimpekis; Yuan Wang; Aojie Quan; Jian Bai; Huafeng Liu; Gerold Schropfer et al.
Source: check_circle
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Measurement of Tidal Tilt by a Micromechanical Inertial Sensor Employing Quasi-Zero- Stiffness Mechanism

Journal of Microelectromechanical Systems
2020-10 | Journal article
DOI: 10.1109/JMEMS.2020.3001928
Contributors: Wenjie Wu; Dandan Liu; Huafeng Liu; Shitao Yan; Shihao Tang; Jinquan Liu; Fangjing Hu; Ji Fan; Liangcheng Tu
Source: check_circle
Crossref

Micromachined Accelerometers with Sub-µg/√Hz Noise Floor: A Review

Sensors
2020-07-21 | Journal article
DOI: 10.3390/s20144054
Contributors: Chen Wang; Fang Chen; Yuan Wang; Sina Sadeghpour; Chenxi Wang; Mathieu Baijot; Rui Esteves; Chun Zhao; Jian Bai; Huafeng Liu et al.
Source: check_circle
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An Integrated Gold-Film Temperature Sensor for In Situ Temperature Measurement of a High-Precision MEMS Accelerometer

Sensors
2020-06-29 | Journal article
DOI: 10.3390/s20133652
Contributors: Xiaoxiao Song; Huafeng Liu; Yanyan Fang; Chun Zhao; Ziqiang Qu; Qiu Wang; Liang-Cheng Tu
Source: check_circle
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Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer

Sensors
2020-02-21 | Journal article
DOI: 10.3390/s20041186
Contributors: Dandan Liu; Huafeng Liu; Jinquan Liu; Fangjing Hu; Ji Fan; Wenjie Wu; Liangcheng Tu
Source: check_circle
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grade
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A MEMS Gravimeter Qualified for Earth Tides Measurement

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
2019 | Conference paper
DOI: 10.1109/TRANSDUCERS.2019.8808444
EID:

2-s2.0-85071952107
Contributors: Tang, S.; Liu, H.; Yan, S.; Xu, X.; Wu, W.; Tu, L.C.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

A Novel Qcm Mass Sensing System Incorporated with A 3-Dof Mode Localized Coupled Resonator Stiffness Sensor

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
2019 | Conference paper
DOI: 10.1109/TRANSDUCERS.2019.8808225
EID:

2-s2.0-85071925763
Contributors: Wang, Y.; Wang, C.; Zhao, C.; Liu, H.; Cerica, D.; Baijot, M.; Dupont, F.; Stoukatch, S.; Kraft, M.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

A Universal High-Sensitivity Area-Variation Capacitive Displacement Transducer (CDT) Based on Fringe Effect

IEEE Access
2019 | Journal article
DOI: 10.1109/ACCESS.2019.2947570
Contributors: Qiu Wang; Shitao Yan; Qiangwei Xu; Shaolin Zhang; Xiaoxiao Song; Chun Zhao; Fangjing Hu; Huafeng Liu; Liangcheng Tu
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Digital microfluidics for terahertz digital and programmable metamaterials: A proof-of-concept study

Asia-Pacific Microwave Conference Proceedings, APMC
2019 | Conference paper
DOI: 10.23919/APMC.2018.8617165
EID:

2-s2.0-85061832652
Contributors: Hu, F.; Song, P.; Luo, K.; Liu, H.; Zhang, K.; Hu, Z.; Tu, L.-C.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

Earth Tremors Observation by a Diamagnetic Levitation Based Inertial Sensor

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
2019 | Conference paper
DOI: 10.1109/TRANSDUCERS.2019.8808752
EID:

2-s2.0-85071924921
Contributors: Wang, Q.; Ren, X.; Yan, S.; Jiao, S.; Xu, X.; Lei, X.; Xu, Q.; Hu, C.; Xu, Z.; Liu, H. et al.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

Genetic algorithm for electro-mechanical co-optimization of a MEMS accelerometer comprising a mechanical motion pre-amplifier with a 2nd-order sigma delta modulator

2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019
2019 | Conference paper
DOI: 10.1109/DTIP.2019.8752896
EID:

2-s2.0-85069531120
Contributors: Wang, C.; Liu, H.; Wang, Y.; Song, X.; Bai, J.; Kraft, M.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

Genetic Algorithm for the Design of Freeform Geometries in a MEMS Accelerometer Comprising a Mechanical Motion Pre-Amplifier

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
2019 | Conference paper
DOI: 10.1109/TRANSDUCERS.2019.8808710
EID:

2-s2.0-85071938350
Contributors: Wang, C.; Liu, H.; Song, X.; Chen, F.; Zeimpekis, I.; Wang, Y.; Bai, J.; Wang, K.; Kraft, M.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

Precise Control of Electroplated 3D Solder Bumps for MEMS Packaging Applications

Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
2019 | Conference paper
DOI: 10.23919/LTB-3D.2019.8735223
EID:

2-s2.0-85068362527
Contributors: Wei, X.L.; Liu, J.Q.; Liu, H.F.; Tu, L.C.; Fan, J.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

SEIS: Insight’s Seismic Experiment for Internal Structure of Mars

Space Science Reviews
2019 | Journal article
DOI: 10.1007/s11214-018-0574-6
EID:

2-s2.0-85060754712
Contributors: Lognonné, P.; Banerdt, W.B.; Giardini, D.; Pike, W.T.; Christensen, U.; Laudet, P.; de Raucourt, S.; Zweifel, P.; Calcutt, S.; Bierwirth, M. et al.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

Wafer-scale vertically aligned carbon nanotubes for broadband terahertz wave absorption

Carbon
2019 | Journal article
DOI: 10.1016/j.carbon.2019.08.001
EID:

2-s2.0-85071028778
Contributors: Sun, L.; Zhu, M.; Zhao, C.; Song, P.; Wang, Y.; Xiao, D.; Liu, H.; Tsang, S.H.; Teo, E.H.T.; Hu, F. et al.
Source: Self-asserted source
HUAFENG LIU via Scopus - Elsevier

Passive Method for Reducing Temperature Sensitivity of a Microelectromechanical Seismic Accelerometer for Marsquake Monitoring Below 1 Nano- g

Physical Review Applied
2019-12-26 | Journal article
DOI: 10.1103/PhysRevApplied.12.064057
Contributors: Huafeng Liu; W.T. Pike; Constantinos Charalambous; Alexander E. Stott
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A high-sensitivity MEMS gravimeter with a large dynamic range

Microsystems & Nanoengineering
2019-10-07 | Journal article
DOI: 10.1038/s41378-019-0089-7
Contributors: Shihao Tang; Huafeng Liu; Shitao Yan; Xiaochao Xu; Wenjie Wu; Ji Fan; Jinquan Liu; Chenyuan Hu; Liangcheng Tu
Source: check_circle
Crossref
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A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process

Micromachines
2019-06-07 | Journal article
DOI: 10.3390/mi10060380
Contributors: Kang Rao; Xiaoli Wei; Shaolin Zhang; Mengqi Zhang; Chenyuan Hu; Huafeng Liu; Liang-Cheng Tu
Source: check_circle
Crossref
grade
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Electroplating of 3D Sn-rich solder for MEMS packaging applications

Journal of Micromechanics and Microengineering
2019-04-01 | Journal article
DOI: 10.1088/1361-6439/ab0639
Contributors: X L Wei; J Q Liu; H F Liu; W J Wu; J Fan; L C Tu
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A method for alleviating the effect of pinhole defects in inter-metal dielectric films

Journal of Micromechanics and Microengineering
2019-01-01 | Journal article
DOI: 10.1088/1361-6439/aaf376
Contributors: Xiaoxiao Song; Qiu Wang; Huafeng Liu; Guangbin Dou; Hao Li; Wenjie Wu; Fangjing Hu; Ji Fan; Jinquan Liu; Liang-Cheng Tu
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Peer review (28 reviews for 12 publications/grants)

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