Personal information

No personal information available

Activities

Collapse all

Works (8)

Effect of water on the dielectric behavior of solder

Journal of Materials Science: Materials in Electronics
2021-09-03 | Journal article
DOI: 10.1007/s10854-021-06700-0
Contributors: Wenyi Yang; D. D. L. Chung
Source: check_circle
Crossref

Dielectric behavior discovered in electrically conductive thick film

Journal of Materials Science: Materials in Electronics
2021-07-30 | Journal article
DOI: 10.1007/s10854-021-06481-6
Contributors: D. D. L. Chung; Jonah T. Bannon; Wenyi Yang
Source: check_circle
Crossref

Electret behavior discovered in solder, specifically tin–silver

Journal of Materials Science: Materials in Electronics
2021-07-25 | Journal article
DOI: 10.1007/s10854-021-06434-z
Contributors: Wenyi Yang; D. D. L. Chung
Source: check_circle
Crossref

First report of the ferroelectric behavior of a metal, as shown for solder

Journal of Materials Science: Materials in Electronics
2021-06-29 | Journal article
DOI: 10.1007/s10854-021-06262-1
Contributors: Wenyi Yang; D. D. L. Chung
Source: check_circle
Crossref

Correction to: Electric polarization and depolarization of solder, and their effects on electrical conduction

Journal of Materials Science: Materials in Electronics
2021-05-21 | Journal article
DOI: 10.1007/s10854-021-05937-z
Contributors: Wenyi Yang; D. D. L. Chung
Source: check_circle
Crossref

Effect of the cooling rate in solidification on the electrical behavior of solder

Journal of Materials Science: Materials in Electronics
2021-03-22 | Journal article
DOI: 10.1007/s10854-021-05511-7
Contributors: Wenyi Yang; D. D. L. Chung
Source: check_circle
Crossref

Electric polarization and depolarization of solder, and their effects on electrical conduction

Journal of Materials Science: Materials in Electronics
2021-03-11 | Journal article
DOI: 10.1007/s10854-021-05337-3
Contributors: Wenyi Yang; D. D. L. Chung
Source: check_circle
Crossref

Effect of temperature on the electrical conduction and dielectric behavior of solder

Journal of Materials Science: Materials in Electronics
2021-03-08 | Journal article
DOI: 10.1007/s10854-021-05369-9
Contributors: Wenyi Yang; D. D. L. Chung
Source: check_circle
Crossref
How many people are using ORCID?