Personal information

Other IDs

Scopus Author ID: 55724575200

Keywords

MEMS, Nanomechanics

Biography

- Freescale semicondoctor(1993~2011): Staff Sr. Engineer for MEMS Sensor Development
- Tohoku University/Micro System Integration Center (2012 ~ ) Reserch Associate / Assistant Professor/Jr. Associate professor/Associate professor

Activities

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Employment (3)

Tohoku University: Sendai, JP

2022-10-01 to present | Associate Professor (Micro System Integration Center)
Employment
Source: Self-asserted source
YUKIO SUZUKI

Tohoku University: Sendai, Miyagi, JP

2012-04-01 to 2022-09-30 | Reserch Associate/Assistant Professor/Jr. Associate Professor (uSIC)
Employment
Source: Self-asserted source
YUKIO SUZUKI

Freescale Semiconductor Inc: Sendai, Miyagi, JP

1993-04-01 to 2011-12-31 | Staff Sr. Engineer (Sensor and analog device engineering, SND Fab)
Employment
Source: Self-asserted source
YUKIO SUZUKI

Education and qualifications (2)

Tohoku University: sendai, JP

2013-04-01 to 2016-03-28 | Doctor (Robotics/ Enginiering)
Education
Source: Self-asserted source
YUKIO SUZUKI

Tokyo university of science: Tokyo, JP

1993-03-28 | BS
Education
Source: Self-asserted source
YUKIO SUZUKI

Works (28)

Mechanical Quality Factor Evaluation of Damping Film Materials for Polymer/PZT Composite MEMS Actuator

Journal of Microelectromechanical Systems
2024 | Journal article
DOI: 10.1109/JMEMS.2024.3436865
Contributors: Xuchen Wang; Yukio Suzuki; Chung-Min Li; Shuji Tanaka
Source: check_circle
Crossref

Vacuum-Sealed MEMS Resonators Based on Silicon Migration Sealing and Hydrogen Diffusion

Journal of Microelectromechanical Systems
2024 | Journal article
DOI: 10.1109/JMEMS.2024.3382768
Contributors: Tianjiao Gong; Muhammad Jehanzeb Khan; Yukio Suzuki; Takashiro Tsukamoto; Shuji Tanaka
Source: check_circle
Crossref

Investigation of Vapor HF Sacrificial Etching Characteristics Through Submicron Release Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal

Journal of Microelectromechanical Systems
2023-08 | Journal article
DOI: 10.1109/jmems.2023.3281854
Part of ISSN: 1057-7157
Part of ISSN: 1941-0158
Contributors: Tianjiao Gong; Yukio Suzuki; Muhammad Jehanzeb Khan; Karla Hiller; Shuji Tanaka
Source: Self-asserted source
YUKIO SUZUKI

Characterization of Vapor HF Sacrificial Etching Through Submicron Relase Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal

2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
2023-01-15 | Conference paper
DOI: 10.1109/mems49605.2023.10052275
Contributors: Tianjiao Gong; Yukio Suzuki; Muhammad J. Khan; Karla Hiller; Shuji Tanaka
Source: Self-asserted source
YUKIO SUZUKI

Mems Resonator Vacuum-Sealed by Silicon Migration and Hydrogen Outdiffusion

2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
2023-01-15 | Conference paper
DOI: 10.1109/mems49605.2023.10052449
Contributors: Muhammad Jehanzeb Khan; Yukio Suzuki; Tianjiao Gong; Takashiro Tsukamoto; Shuji Tanaka
Source: Self-asserted source
YUKIO SUZUKI

Improved Vacuum Level of Silicon-Migration-Sealed Cavity by Hydrogen Diffusion Annealing for Wafer-Level Packaging for Mems

IEEE Symposium on Mass Storage Systems and Technologies
2022 | Conference paper
DOI: 10.1109/MEMS51670.2022.9699602
EID:

2-s2.0-85126392053

Part of ISSN: 21601968
Contributors: Suzuki, H.; Suzuki, Y.; Kanamori, Y.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

PZT MEMS Speaker Integrated with Silicon-Parylene Composite Corrugated Diaphragm

IEEE Symposium on Mass Storage Systems and Technologies
2022 | Conference paper
DOI: 10.1109/MEMS51670.2022.9699539
EID:

2-s2.0-85126391269

Part of ISSN: 21601968
Contributors: Hirano, Y.; Suzuki, Y.; Fujita, N.; Li, C.-M.; Chiba, H.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

DUV-LED packaging using high density TSV in silicon cavity and laser-glass-frit-bonded UV transmitting glass cap

Sensors and Actuators A: Physical
2022-09 | Journal article
DOI: 10.1016/j.sna.2022.113700
Part of ISSN: 0924-4247
Contributors: Hirofumi Chiba; Yukio Suzuki; Yoshiaki Yasuda; Tianjiao Gong; Shuji Tanaka
Source: Self-asserted source
YUKIO SUZUKI

Membrane-supported LSI with integrated heater and temperature monitor for on-site annealing-recovery from 20 kGy gamma ray irradiation damage

Sensors and Actuators A: Physical
2022-08 | Journal article
DOI: 10.1016/j.sna.2022.113677
Part of ISSN: 0924-4247
Contributors: Tianjiao Gong; Yukio Suzuki; Akinori Takeyama; Takeshi Ohshima; Shuji Tanaka
Source: Self-asserted source
YUKIO SUZUKI

Development of silicon wafer packaging technology for deep UV LED

Electrical Engineering in Japan (English translation of Denki Gakkai Ronbunshi)
2021 | Journal article
DOI: 10.1002/eej.23298
EID:

2-s2.0-85096965660

Part of ISSN: 15206416 04247760
Contributors: Chiba, H.; Suzuki, Y.; Yasuda, Y.; Kumagai, M.; Koyama, T.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Membrane-Heater-Integrated LSI for On-Site Annealing-Recovery from 20 KGY Gamma Ray Irradiation Damage

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2021 | Conference paper
DOI: 10.1109/MEMS51782.2021.9375332
EID:

2-s2.0-85103444490

Part of ISSN: 10846999
Contributors: Gong, T.; Suzuki, Y.; Takeyama, A.; Ohshima, T.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Silicon migration seal wafer-level vacuum encapsulation

Electronics and Communications in Japan
2021 | Journal article
DOI: 10.1002/ecj.12283
EID:

2-s2.0-85096648603

Part of ISSN: 19429541 19429533
Contributors: Suzuki, Y.; Dupuit, V.; Kojima, T.; Kanamori, Y.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Development of silicon wafer packaging technology for deep uv led

IEEJ Transactions on Sensors and Micromachines
2020 | Journal article
DOI: 10.1541/IEEJSMAS.140.152
EID:

2-s2.0-85091835409

Part of ISSN: 13475525 13418939
Contributors: Chiba, H.; Suzuki, Y.; Yasuda, Y.; Kumagai, M.; Koyama, T.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Screening of process factors for silicon torsional bar by static pure torsion destructive test,静的純ねじり試験によるシリコントーションバーの破壊強度向上法の探索

IEEJ Transactions on Sensors and Micromachines
2020 | Journal article
DOI: 10.1541/ieejsmas.140.285
EID:

2-s2.0-85092697123

Part of ISSN: 13475525 13418939
Contributors: Suzuki, Y.; Ohyanagi, E.; Chiba, H.; Hikichi, K.; Kojima, T.; Kanamori, Y.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Silicon Migration Seal for Wafer-Level Vacuum Encapsulation

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2020 | Conference paper
DOI: 10.1109/MEMS46641.2020.9056414
EID:

2-s2.0-85083179171

Part of ISSN: 10846999
Contributors: Suzuki, Y.; Dupuit, V.; Kojima, T.; Suzuki, H.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Silicon migration seal wafer-level vacuum encapsulation

IEEJ Transactions on Sensors and Micromachines
2020 | Journal article
DOI: 10.1541/IEEJSMAS.140.165
EID:

2-s2.0-85091858592

Part of ISSN: 13475525 13418939
Contributors: Suzuki, Y.; Dupuit, V.; Kojima, T.; Kanamori, Y.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Ultracompact Silicon Wafer Packaging of Deep UV LED with Excellent Cooling Performance and Light Utilization Efficiency

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2020 | Conference paper
DOI: 10.1109/MEMS46641.2020.9056370
EID:

2-s2.0-85083157726

Part of ISSN: 10846999
Contributors: Chiba, H.; Suzuki, Y.; Yasuda, Y.; Kumagai, M.; Koyama, T.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Metal-bonding-based hermetic wafer-level MEMS packaging technology using in-plane feedthrough: Hermeticity and high frequency characteristics of thick gold film feedthrough

Electrical Engineering in Japan (English translation of Denki Gakkai Ronbunshi)
2019 | Journal article
DOI: 10.1002/eej.23193
EID:

2-s2.0-85060350640

Part of ISSN: 15206416 04247760
Contributors: Moriyama, M.; Suzuki, Y.; Totsu, K.; Hirano, H.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Accelerating MEMS development by open collaboration at hands-on-access fab, Tohoku University

Sensors and Materials
2018 | Journal article
DOI: 10.18494/SAM.2018.1804
EID:

2-s2.0-85046107585

Part of ISSN: 09144935
Contributors: Totsu, K.; Moriyama, M.; Suzuki, Y.; Esashi, M.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Integrated 3-axis tactile sensor using quad-seesaw-electrode structure on platform LSI with through silicon vias

Sensors and Actuators, A: Physical
2018 | Journal article
DOI: 10.1016/j.sna.2018.02.013
EID:

2-s2.0-85042199165

Part of ISSN: 09244247
Contributors: Hata, Y.; Suzuki, Y.; Muroyama, M.; Nakayama, T.; Nonomura, Y.; Chand, R.; Hirano, H.; Omura, Y.; Fujiyoshi, M.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Metal-bonding-based hermetic wafer-level MEMS packaging technology using in-plane feedthrough -hermeticity and high frequency characteristics of thick gold film feedthrough

IEEJ Transactions on Sensors and Micromachines
2018 | Journal article
DOI: 10.1541/ieejsmas.138.485
EID:

2-s2.0-85054539136

Part of ISSN: 13475525 13418939
Contributors: Moriyama, M.; Suzuki, Y.; Totsu, K.; Hirano, H.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

300 μm Deep through silicon via in laser-ablated CMOS multi-project wafer for cost-effective development of integrated MEMS

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2017 | Conference paper
DOI: 10.1109/MEMSYS.2017.7863515
EID:

2-s2.0-85015793344

Part of ISSN: 10846999
Contributors: Suzuki, Y.; Fukushi, H.; Muroyama, M.; Hata, Y.; Nakayama, T.; Chand, R.; Hirano, H.; Nonomura, Y.; Funabashi, H.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Fully-integrated, fully-differential 3-axis tactile sensor on platform LSI with TSV-based surface-mountable structure

2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)
2017-06 | Conference paper
DOI: 10.1109/transducers.2017.7994095
Contributors: Yoshiyuki Hata; Yukio Suzuki; Masanori Muroyama; Takahiro Nakayama; Yutaka Nonomura; Rakesh Chand; Hideki Hirano; Yoshiteru Omura; Motohiro Fujiyoshi; Shuji Tanaka
Source: Self-asserted source
YUKIO SUZUKI

Free-standing subwavelength grid infrared cut filter of 90 mm diameter for LPP EUV light source

Sensors and Actuators, A: Physical
2015 | Journal article
DOI: 10.1016/j.sna.2014.07.006
EID:

2-s2.0-84938997775

Part of ISSN: 09244247
Contributors: Suzuki, Y.; Totsu, K.; Moriyama, M.; Esashi, M.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier
grade
Preferred source (of 2)‎

Free-standing subwavelength grid infrared rejection filter of 90 MM diameter for LPP EUV light source

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2014 | Conference paper
DOI: 10.1109/MEMSYS.2014.6765682
EID:

2-s2.0-84899013144

Part of ISSN: 10846999
Contributors: Suzuki, Y.; Totsu, K.; Moriyama, M.; Esashi, M.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Hands-on-access fabrication facility for MEMS Development and production

Proceedings of the International Display Workshops
2013 | Conference paper
EID:

2-s2.0-85026197322

Part of ISSN: 18832490
Contributors: Totsu, K.; Moriyama, M.; Suzuki, Y.; Ono, T.; Yoshida, S.; Esashi, M.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

Low-stress epitaxial polysilicon process for micromirror devices

IEEJ Transactions on Sensors and Micromachines
2013 | Journal article
DOI: 10.1541/ieejsmas.133.223
EID:

2-s2.0-84880047490

Part of ISSN: 13418939 13475525
Contributors: Suzuki, Y.; Totsu, K.; Watanabe, H.; Moriyama, M.; Esashi, M.; Tanaka, S.
Source: Self-asserted source
YUKIO SUZUKI via Scopus - Elsevier

A high aspect ratio MEMS process with surface micromachined polysilicon for high accuracy inertial sensing

2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)
2013-06 | Conference paper
DOI: 10.1109/transducers.2013.6626690
Contributors: A. Geisberger; S. Schroeder; J. Dixon; Y. Suzuki; J. Makwana; S. Qureshi
Source: Self-asserted source
YUKIO SUZUKI
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