Personal information

Other IDs

ResearcherID: GSJ-1735-2022

Countries

China

Biography

Microelectronic Packaging
Electronic Materials
Metal-Metal Bonding
Wafer bonding

Activities

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Education and qualifications (3)

Osaka University: Osaka, JP

2017-09-04 to 2021-03-21 | Doctor
Education
Source: Self-asserted source
Runhua Gao

Chongqing University: Chongqing, Sichuan, CN

2014-09-01 to 2017-06-01 | Master
Education
Source: Self-asserted source
Runhua Gao

Xihua University: Chengdu, Sichuan, CN

2010-09-01 to 2014-06-01 | Bachelor
Education
Source: Self-asserted source
Runhua Gao

Works (12)

Degradation in Electrothermal Characteristics and Failure Mechanism of SiC JBS With Different Die Attach Materials Under 300 ∘C Power Cycle Stress

IEEE Journal of Emerging and Selected Topics in Power Electronics
2024-08 | Journal article
DOI: 10.1109/JESTPE.2024.3380026
Contributors: Zheng Hu; Yidan Tang; Yamin Zhang; Runhua Gao; Xuan Li; Yun Bai; Xiaoli Tian; Jilong Hao; Chengyue Yang; Xinhua Wang et al.
Source: check_circle
Crossref

Heterogeneous integration of thick GaN and polycrystalline diamond at room temperature through dynamic plasma polishing and surface-activated bonding

Journal of Alloys and Compounds
2024-05 | Journal article
DOI: 10.1016/j.jallcom.2024.174075
Part of ISSN: 0925-8388
Contributors: Runhua Gao; Xinhua Wang; Fengwen Mu; Xiaojing Li; Chong Wei; Wu Zhou; Jin’an Shi; Ye Tian; Xiangjie Xing; Hongyue Li et al.
Source: Self-asserted source
Runhua Gao

High power added efficiency AlGaN/GaN MIS-HEMTs for wide band application

Hongwai Yu Haomibo Xuebao/Journal of Infrared and Millimeter Waves
2023 | Journal article
DOI: 10.11972/J.ISSN.1001-9014.2023.03.007
WOSUID: WOS:000994050800007
Contributors: Chen, Xiao-Juan; Zhang, Shen; Zhang, Yi-Chuan; Li, Yan-Kui; Gao, Run-Hua; Liu, Xin-Yu; Wei, Ke
Source: check_circle
Web of Science Researcher Profile Sync

A novel strategy for GaN-on-diamond device with a high thermal boundary conductance

Journal of Alloys and Compounds
2022-04 | Journal article
DOI: 10.1016/j.jallcom.2022.164076
Part of ISSN: 0925-8388
Source: Self-asserted source
Runhua Gao

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

Materials
2022-03-30 | Journal article
DOI: 10.3390/ma15072529
Contributors: Ying Meng; Runhua Gao; Xinhua Wang; Sen Huang; Ke Wei; Dahai Wang; Fengwen Mu; Xinyu Liu
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

2022-03-02 | Preprint
DOI: 10.20944/preprints202203.0038.v1
Contributors: Ying Meng; Runhua Gao; Xinhua Wang; Sen Huang; Ke Wei; Dahai Wang; Fengwen Mu; Xinyu Liu
Source: check_circle
Crossref
grade
Preferred source (of 3)‎

Low-temperature bonding of surface-activated polyimide to Cu Foil in Pt-catalyzed formic acid atmosphere

Journal of Materials Science: Materials in Electronics
2022-02 | Journal article
DOI: 10.1007/s10854-021-07463-4
Contributors: Ying Meng; Yang Xu; Runhua Gao; Xinhua Wang; Xiaojuan Chen; Sen Huang; Ke Wei; Dahai Wang; Haibo Yin; Kai Takeuchi et al.
Source: check_circle
Crossref

A Novel Strategy for GaN-on-Diamond Device with a High Thermal Boundary Conductance

ArXiv
2021 | Journal article
WOSUID: PPRN:11832091
Contributors: Mu, Fengwen; Xu, Bin; Wang, Xinhua; Gao, Runhua; Huang, Sen; Wei, Ke; Takeuchi, Kai; Chen, Xiaojuan; Yin, Haibo; Wang, Dahai et al.
Source: check_circle
Web of Science Researcher Profile Sync

Mechanical and microstructural enhancements of Ag microparticle-sintered joint by ultrasonic vibration

Journal of Materials Science: Materials in Electronics
2020-12-24 | Journal article
DOI: 10.1007/s10854-020-04684-x
Contributors: Runhua Gao; Yu-An Shen; Jiahui Li; Siliang He; Hiroshi Nishikawa
Source: check_circle
Crossref

Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding

Journal of Materials Science: Materials in Electronics
2020-09-01 | Journal article
DOI: 10.1007/s10854-020-04026-x
Contributors: Runhua Gao; Siliang He; Jiahui Li; Yu-An Shen; Hiroshi Nishikawa
Source: check_circle
Crossref

A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere

2019 International Conference on Electronics Packaging (ICEP)
2019-04 | Journal article
DOI: 10.23919/icep.2019.8733490
ISBN: 9784990218874
Source: Self-asserted source
Runhua Gao

Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles

Journal of Electronic Materials
2019-04 | Journal article
DOI: 10.1007/s11664-019-07046-4
Part of ISSN: 0361-5235
Part of ISSN: 1543-186X
Source: Self-asserted source
Runhua Gao

Peer review (11 reviews for 5 publications/grants)

Review activity for Chemical engineering journal. (3)
Review activity for Electronic Materials Letters. (1)
Review activity for Electronic materials letters. (1)
Review activity for Journal of materials science. (3)
Review activity for Journal of materials science. Materials in electronics (3)
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