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Experimental study on surface roughness and residual stress development in loose-abrasive polishing of hardened tool steel

Manufacturing Letters
2025-06 | Journal article
DOI: 10.1016/j.mfglet.2025.02.001
Contributors: Holger Ruehl; Yuxuan Li; Thomas Guenther; Bernd Breidenstein; André Zimmermann
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Mode-Split MEMS Gyroscopes Under Bending Stress: Detection Mode Coupling and the Relation to Cross-Axis Sensitivity

IEEE Sensors Letters
2025-02 | Journal article
DOI: 10.1109/LSENS.2024.3507212
Contributors: Wolfram Mayer; Burkhard Kuhlmann; Andrea Guerrieri; Tobias Hiller; Andre Zimmermann
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Product Development Processes for Individualized Products: A Case Study

IEEE Transactions on Engineering Management
2024 | Journal article
DOI: 10.1109/TEM.2023.3277019
Contributors: Faruk Civelek; Alexander Brem; Karl-Peter Fritz; André Zimmermann
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Optical interferometer using two-mode squeezed light for enhanced chip-integrated quantum metrology

Physical Review A
2024-07-26 | Journal article
DOI: 10.1103/PhysRevA.110.012621
Contributors: Patrick Tritschler; Torsten Ohms; André Zimmermann; Fabian Zschocke; Thomas Strohm; Peter Degenfeld-Schonburg
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Dielectric Properties of PEEK/PEI Blends as Substrate Material in High-Frequency Circuit Board Applications

Micromachines
2024-06-18 | Journal article
DOI: 10.3390/mi15060801
Contributors: Tim Scherzer; Marius Wolf; Kai Werum; Holger Ruckdäschel; Wolfgang Eberhardt; André Zimmermann
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A 10 V Transfer Standard Based on Low-Noise Solid-State Zener Voltage Reference ADR1000

Metrology
2024-03-05 | Journal article
DOI: 10.3390/metrology4010007
Contributors: André Bülau; Daniela Walter; André Zimmermann
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Investigating the Effects of Stress on Die Deformation and on Cross-Axis Offset Drift in Mode-Split MEMS Gyroscopes

IEEE Sensors Letters
2024-01 | Journal article
DOI: 10.1109/LSENS.2023.3335095
Contributors: Wolfram Mayer; Burkhard Kuhlmann; Tobias Hiller; Thorsten Balslink; Ulrich Kunz; André Zimmermann
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Detection Schemes for Two-Mode Squeezed Fiber Optic Sagnac Interferometry

IEEE Sensors Letters
2023-12 | Journal article
DOI: 10.1109/LSENS.2023.3333751
Contributors: Patrick Tritschler; Torsten Ohms; Peter Degenfeld-Schonburg; Fabian Zschocke; André Zimmermann
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Investigation of a Finite-Difference-Method based real-time viscous heating compensation in a nozzle viscometer for inline viscosity measurement of phenol resins

Polymer Testing
2023-11 | Journal article
DOI: 10.1016/j.polymertesting.2023.108188
Contributors: Peter Wappler; Romit Kulkarni; Thomas Guenther; Serhat Sahakalkan; Karl-Peter Fritz; André Zimmermann
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Injection Compression Molding of LDS-MID for Millimeter Wave Applications

Journal of Manufacturing and Materials Processing
2023-10-13 | Journal article
DOI: 10.3390/jmmp7050184
Contributors: Marius Wolf; Kai Werum; Wolfgang Eberhardt; Thomas Günther; André Zimmermann
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Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications

Journal of Manufacturing and Materials Processing
2023-08-03 | Journal article
DOI: 10.3390/jmmp7040139
Contributors: Marius Wolf; Kai Werum; Thomas Guenther; Lisa Schleeh; Wolfgang Eberhardt; André Zimmermann
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Injection Molding of Encapsulated Diffractive Optical Elements

Micromachines
2023-06-09 | Journal article
DOI: 10.3390/mi14061223
Contributors: Stefan Wagner; Kevin Treptow; Sascha Weser; Marc Drexler; Serhat Sahakalkan; Wolfgang Eberhardt; Thomas Guenther; Christof Pruss; Alois Herkommer; André Zimmermann
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Adhesion-Induced Demolding Forces of Hard Coated Microstructures Measured with a Novel Injection Molding Tool

Polymers
2023-03-03 | Journal article
DOI: 10.3390/polym15051285
Contributors: Maximilian Schoenherr; Holger Ruehl; Thomas Guenther; André Zimmermann; Bernd Gundelsweiler
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Direct Processing of PVD Hard Coatings via Focused Ion Beam Milling for Microinjection Molding

Micromachines
2023-01-22 | Journal article
DOI: 10.3390/mi14020294
Contributors: Holger Ruehl; Thomas Guenther; André Zimmermann
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Review on Excess Noise Measurements of Resistors

Sensors
2023-01-18 | Journal article
DOI: 10.3390/s23031107
Contributors: Daniela Walter; André Bülau; André Zimmermann
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Image Analysis Based Evaluation of Print Quality for Inkjet Printed Structures

Journal of Manufacturing and Materials Processing
2023-01-10 | Journal article
DOI: 10.3390/jmmp7010020
Contributors: Tim Horter; Holger Ruehl; Wenqi Yang; Yu-Sheng Chiang; Kerstin Glaeser; André Zimmermann
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Integrated Stress Sensors for Humidity Performance Drift Analysis and Compensation in Inertial Measurement Units

Journal of Microelectromechanical Systems
2022-12 | Journal article
DOI: 10.1109/JMEMS.2022.3191090
Contributors: Clemens Jurgschat; Falk Roewer; Imre Toth; Torsten Ohms; Andre Zimmermann
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Inkjet-Printed Temperature Sensors Characterized according to Standards

Sensors
2022-10-24 | Journal article
DOI: 10.3390/s22218145
Contributors: Jonas Jäger; Adrian Schwenck; Daniela Walter; André Bülau; Kerstin Gläser; André Zimmermann
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Aerosol Jet Printing and Interconnection Technologies on Additive Manufactured Substrates

Journal of Manufacturing and Materials Processing
2022-10-09 | Journal article
DOI: 10.3390/jmmp6050119
Contributors: Kai Werum; Ernst Mueller; Juergen Keck; Jonas Jaeger; Tim Horter; Kerstin Glaeser; Sascha Buschkamp; Maximilian Barth; Wolfgang Eberhardt; André Zimmermann
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Embedding and Contacting of Electrical Components for Hybrid Additive Manufacturing

IEEE Transactions on Components, Packaging and Manufacturing Technology
2022-08 | Journal article
DOI: 10.1109/TCPMT.2022.3195967
Contributors: K. Schmidt; B. Polzinger; M. Runtze; A. Zimmermann
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Experimental Investigation of Moisture Induced Offset Drifts on Plastic Packaged MEMS Sensor Devices

Journal of Microelectromechanical Systems
2022-08 | Journal article
DOI: 10.1109/JMEMS.2022.3177165
Contributors: Clemens Jurgschat; Rolf Scheben; Imre Toth; Torsten Ohms; Oliver Kohn; Andre Zimmermann
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Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime Characterization

Micromachines
2022-08-01 | Journal article
DOI: 10.3390/mi13081240
Contributors: Rafat Saleh; Sophie Schütt; Maximilian Barth; Thassilo Lang; Wolfgang Eberhardt; André Zimmermann
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Contacting Inkjet-Printed Silver Structures and SMD by ICA and Solder

IEEE Transactions on Components, Packaging and Manufacturing Technology
2022-07 | Journal article
DOI: 10.1109/TCPMT.2022.3169558
Contributors: Jonas Jager; Sascha Buschkamp; Kai Werum; Kerstin Glaser; Tobias Grozinger; Wolfgang Eberhardt; Andre Zimmermann
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Graph neural networks for parameter estimation in micro-electro-mechanical system testing

Array
2022-07 | Journal article
DOI: 10.1016/j.array.2022.100162
Contributors: Monika Elisabeth Heringhaus; Alexander Buhmann; Jürgen Müller; André Zimmermann
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Towards Reliable Parameter Extraction in MEMS Final Module Testing Using Bayesian Inference

Sensors
2022-07-20 | Journal article
DOI: 10.3390/s22145408
Contributors: Monika E. Heringhaus; Yi Zhang; André Zimmermann; Lars Mikelsons
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Influence of Parametric Nonlinearities on Closed-Loop Operated MEMS Gyroscopes

Journal of Microelectromechanical Systems
2022-06 | Journal article
DOI: 10.1109/JMEMS.2022.3156817
Contributors: Andreas Wagner; Martin Putnik; Tobias Hiller; Peter Degenfeld-Schonburg; Andre Zimmermann
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Use of PtC Nanotips for Low-Voltage Quantum Tunneling Applications

Micromachines
2022-06-28 | Journal article
DOI: 10.3390/mi13071019
Contributors: Michael Haub; Thomas Guenther; Martin Bogner; André Zimmermann
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Material Property Variability of Composites in Thermo-Mechanical Studies Involving Virtual Design of Experiments

IEEE Transactions on Components, Packaging and Manufacturing Technology
2022-05 | Journal article
DOI: 10.1109/TCPMT.2022.3163460
Contributors: Mateus Bagetti Jeronimo; Hubert Straub; Martin Hager; Andre Zimmermann
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Characterization of Wire-Bonding on LDS Materials and HF-PCBs for High-Frequency Applications

Journal of Manufacturing and Materials Processing
2022-01-11 | Journal article
DOI: 10.3390/jmmp6010009
Contributors: Thomas Guenther; Kai Werum; Ernst Müller; Marius Wolf; André Zimmermann
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Investigation of Focused Ion and Electron Beam Platinum Carbon Nano-Tips with Transmission Electron Microscopy for Quantum Tunneling Vacuum Gap Applications

Applied Sciences
2021-12-11 | Journal article
DOI: 10.3390/app112411793
Contributors: Michael Haub; Thomas Günther; Martin Bogner; André Zimmermann
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Characterization and Benchmark of a Novel Capacitive and Fluidic Inclination Sensor

Sensors
2021-12-01 | Journal article
DOI: 10.3390/s21238030
Contributors: Adrian Schwenck; Thomas Guenther; André Zimmermann
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Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding Compounds

Applied Mechanics
2021-11-30 | Journal article
DOI: 10.3390/applmech2040057
Contributors: Mehmet Haybat; Thomas Guenther; Romit Kulkarni; Serhat Sahakalkan; Tobias Grözinger; Thilo Rothermel; Sascha Weser; André Zimmermann
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Minimally Invasive Sensors for Transurethral Impedance Spectroscopy

IEEE Sensors Journal
2021-10-15 | Journal article
DOI: 10.1109/JSEN.2021.3108779
Contributors: Carina Veil; Simon Petillon; Jonas Hotz; Andrea Knoller; Andre Zimmermann; Oliver Sawodny
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Digital Process Chain for Processing of Bend-Sensitive Functional Structures on a Flexible Substrate

IEEE Transactions on Components, Packaging and Manufacturing Technology
2021-09 | Journal article
DOI: 10.1109/TCPMT.2021.3101910
Contributors: Rafat Saleh; Ferdinand Mohn; Maximilian Barth; Wolfgang Eberhardt; Andre Zimmermann
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Determining the Nonlinear Motion of MEMS Gyroscopes Using the Harmonic Balancing Method

Journal of Microelectromechanical Systems
2021-08 | Journal article
DOI: 10.1109/JMEMS.2021.3078320
Contributors: Andreas Wagner; Martin Putnik; Kreshnik Ramici; Peter Degenfeld-Schonburg; Andre Zimmermann
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Towards a Tailored Engineering Design Process for Individualized Micro-Mechatronic Systems with a Novel Case-Based Methodology

Applied Sciences
2021-08-27 | Journal article
DOI: 10.3390/app11177909
Contributors: Faruk Civelek; Karl-Peter Fritz; André Zimmermann
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Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane

Sensors
2021-08-18 | Journal article
DOI: 10.3390/s21165557
Contributors: Adrian Schwenck; Tobias Grözinger; Thomas Günther; Axel Schumacher; Dietmar Schuhmacher; Kai Werum; André Zimmermann
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Mechanical behaviour of polymer derived ceramics – a review

International Materials Reviews
2021-08-18 | Journal article
DOI: 10.1080/09506608.2020.1784616
Contributors: Ravindran Sujith; Sudagar Jothi; Andre Zimmermann; Fritz Aldinger; Ravi Kumar
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Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist

Micromachines
2021-07-21 | Journal article
DOI: 10.3390/mi12080856
Contributors: Florian Janek; Nadine Eichhorn; Sascha Weser; Kerstin Gläser; Wolfgang Eberhardt; André Zimmermann
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Transfer Learning for Test Time Reduction of Parameter Extraction in MEMS Accelerometers

Journal of Microelectromechanical Systems
2021-06 | Journal article
DOI: 10.1109/JMEMS.2021.3065975
Contributors: Monika E. Heringhaus; Jurgen Muller; Dominik Messner; Andre Zimmermann
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Feasibility Study of Soft Tooling Inserts for Injection Molding with Integrated Automated Slides

Micromachines
2021-06-22 | Journal article
DOI: 10.3390/mi12070730
Contributors: Tobias Vieten; Dennis Stahl; Peter Schilling; Faruk Civelek; André Zimmermann
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Development and Proof of Concept of a Miniaturized MEMS Quantum Tunneling Accelerometer Based on PtC Tips by Focused Ion Beam 3D Nano-Patterning

Sensors
2021-05-30 | Journal article
DOI: 10.3390/s21113795
Contributors: Michael Haub; Martin Bogner; Thomas Guenther; André Zimmermann; Hermann Sandmaier
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Soft Tooling-Friendly Inductive Mold Heating—A Novel Concept

Micromachines
2021-04-17 | Journal article
DOI: 10.3390/mi12040454
Contributors: Tobias Vieten; Davide Zanin; Andrea Knöller; Thomas Litwin; Wolfgang Eberhardt; André Zimmermann
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Hybrid Additive Manufacturing by Embedded Electrical Circuits Using 3-D Dispensing

IEEE Transactions on Components, Packaging and Manufacturing Technology
2021-03 | Journal article
DOI: 10.1109/TCPMT.2021.3054835
Contributors: K. Schmidt; B. Polzinger; M. Metry; S. Koppe; A. Zimmermann
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Bending Setups for Reliability Investigation of Flexible Electronics

Micromachines
2021-01-13 | Journal article
DOI: 10.3390/mi12010078
Contributors: Rafat Saleh; Maximilian Barth; Wolfgang Eberhardt; André Zimmermann
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Open-Eco-Innovation for SMEs with Pan-European Key Enabling Technology Centres

Clean Technologies
2020-10-13 | Journal article
DOI: 10.3390/cleantechnol2040026
Contributors: Faruk Civelek; Romit Kulkarni; Karl-Peter Fritz; Tanja Meyer; Costas Troulos; Thomas Guenther; André Zimmermann
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Identification of the Viscoelastic Properties of Soft Thermal Interface Layers Through Forward and Inverse Measurement Techniques

IEEE Transactions on Instrumentation and Measurement
2020-07 | Journal article
DOI: 10.1109/TIM.2019.2950824
Contributors: Alaa Fezai; Anuj Sharma; Wolfgang Muller-Hirsch; Andre Zimmermann
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Feasibility Study of an Automated Assembly Process for Ultrathin Chips

Micromachines
2020-06-30 | Journal article
DOI: 10.3390/mi11070654
Contributors: Florian Janek; Ebru Saller; Ernst Müller; Thomas Meißner; Sascha Weser; Maximilian Barth; Wolfgang Eberhardt; André Zimmermann
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Surface Optimization of Micro-Integrated Reflective Optical Elements by Thermoset Injection Molding

Applied Sciences
2020-06-18 | Journal article
DOI: 10.3390/app10124197
Contributors: Thomas Guenther; Lars Diegel; Marcel Roeder; Marc Drexler; Mehmet Haybat; Peter Wappler; Mahdi Soltani; André Zimmermann
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Temperature Dependence of the Steering Angles of a Silicon Photonic Optical Phased Array

IEEE Photonics Journal
2020-04 | Journal article
DOI: 10.1109/JPHOT.2020.2966618
Contributors: Pedro Andrei Krochin Yepez; Ulrike Scholz; Andre Zimmermann
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