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Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding

Materials
2024-11-05 | Journal article
DOI: 10.3390/ma17225405
Contributors: Wenjie Li; Zhe Li; Fang-Yuan Zeng; Qi Zhang; Liwei Guo; Dan Li; Yong-Hui Ma; Zhi-Quan Liu
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Correction to: Nanotwinned Microstructure Engineering of Electroplated Copper for Enhanced Anti-corrosion in Alkaline Medium

Metals and Materials International
2024-01 | Journal article
DOI: 10.1007/s12540-023-01501-y
Contributors: Xing-Quan Liu; Zhe Li; Zhen-Jia Peng; Rui-Xun Wang; Zhi-Quan Liu
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Nanotwinned Microstructure Engineering of Electroplated Copper for Enhanced Anti-corrosion in Alkaline Medium

Metals and Materials International
2024-01 | Journal article
DOI: 10.1007/s12540-023-01489-5
Contributors: Xing-Quan Liu; Zhe Li; Zhen-Jia Peng; Rui-Xun Wang; Zhi-Quan Liu
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Will Better Sintering Quality of Ag Nanoparticles Lead to More Reliable Ag Bonding Interfaces?

Journal of Electronic Materials
2023-11 | Journal article
DOI: 10.1007/s11664-023-10677-3
Contributors: Baorui Sun; Minghui Zhang; Junjie Li; Zhe Li; Mingli Wen; Zhi-Quan Liu
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