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Employment (1)

Araca, Inc.: Tucson, US

Employment
Source: Self-asserted source
Yasa Sampurno

Works (19)

Tribological, Thermal, Kinetic, and Surface Microtextural Characterization of Prime p-Type <100> Silicon Wafer CMP for Direct Wafer Bonding Applications

Electronic Materials
2025-01-08 | Journal article
DOI: 10.3390/electronicmat6010001
Contributors: Michelle Yap; Catherine Yap; Yasa Sampurno; Glenn Whitener; Jason Keleher; Len Borucki; Ara Philipossian
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Crossref
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Slurry Activation for Enhanced Surface Redox Reactions in CMP

Solid State Phenomena
2023-08-14 | Journal article
DOI: 10.4028/p-zDs0xu
Contributors: Ara Philipossian; Yasa Sampurno; Fritz Redeker; Kiana A. Cahue; Jason J. Keleher
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Crossref

Understanding the Reasons Behind Defect Levels in Post-Copper-CMP Cleaning Processes with Different Chemistries and PVA Brushes

ECS Journal of Solid State Science and Technology
2021-06-01 | Journal article
DOI: 10.1149/2162-8777/ac0b8d
Contributors: Y. Sampurno; A. Philipossian; A. N. Linhart; K. M. Wortman-Otto; W-T Tseng; D. Tamboli; J. J. Keleher
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Crossref

Communication—An Analysis of Shear Forces in Post-CMP PVA Brush Scrubbing for Stationary and Rotating Wafers

ECS Journal of Solid State Science and Technology
2021-03-01 | Journal article
DOI: 10.1149/2162-8777/abe4a7
Contributors: Y. Sampurno; A. N. Linhart; K. M. Wortman-Otto; A. Philipossian; J. J. Keleher
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Crossref

Tribological, Thermal, Kinetic, and Pad Micro-Textural Studies Using Polyphenylene Sulfide Retaining Rings in Interlayer Dielectric Chemical Mechanical Planarization

ECS Journal of Solid State Science and Technology
2020-12-01 | Journal article
DOI: 10.1149/2162-8777/abd14b
Contributors: Ara Philipossian; Yasa Sampurno; Michael Tustin; Anton Schranner
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Crossref

Determining instantaneous removal rates in metal chemical mechanical planarization

Japanese Journal of Applied Physics
2020-07-01 | Journal article
DOI: 10.35848/1347-4065/ab8f07
Contributors: Ricky Philipossian; Yasa Sampurno; Ara Philipossian
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Crossref

Effect of conditioner disc wear on frictional, thermal, kinetic and pad micro-textural attributes of interlayer dielectric and tungsten chemical mechanical planarization

Japanese Journal of Applied Physics
2020-07-01 | Journal article
DOI: 10.35848/1347-4065/ab9353
Contributors: Juan Cristobal Mariscal; Hossein Dadashazar; Jeffrey McAllister; Yasa Sampurno; Ara Philipossian
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Crossref

Correlating Shear Force and Coefficient of Friction to Platen Motor Current in Copper, Cobalt, and Shallow Trench Isolation Chemical Mechanical Planarization at Steady-State Conditions

ECS Journal of Solid State Science and Technology
2020-02-03 | Journal article
DOI: 10.1149/2162-8777/ab6e47
Contributors: C. Frank; R. Headley; Y. Sampurno; A. Philipossian
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Crossref

Correlating Coefficient of Friction and Shear Force to Platen Motor Current in Tungsten and Interlayer Dielectric Chemical Mechanical Planarization at Highly Non-Steady-State Conditions

ECS Journal of Solid State Science and Technology
2019 | Journal article
DOI: 10.1149/2.0251910jss
Contributors: R. Headley; C. Frank; Y. Sampurno; A. Philipossian
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Crossref

Correlating Removal Rate to Directivity in Copper Chemical Mechanical Planarization

ECS Journal of Solid State Science and Technology
2019 | Journal article
DOI: 10.1149/2.0201911jss
Contributors: Jeffrey McAllister; Hossein Dadashazar; Yasa Sampurno; Sung Gyu Kim; Dongyoul Park; Heeill Kwon; Yongbin Lee; Ara Philipossian
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Crossref

Correlating Shear Force and Coefficient of Friction to Platen Motor Current in Copper, Cobalt, and Shallow Trench Isolation Chemical Mechanical Planarization at Highly Non-Steady-State Conditions

ECS Journal of Solid State Science and Technology
2019 | Journal article
DOI: 10.1149/2.0121911jss
Contributors: C. Frank; R. Headley; Y. Sampurno; A. Philipossian
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Crossref

Impact of Polisher Kinematics and Conditioner Disc Designs on Fluid Transport during Chemical Mechanical Planarization

ECS Journal of Solid State Science and Technology
2019 | Journal article
DOI: 10.1149/2.0241911jss
Contributors: Jeffrey McAllister; Hossein Dadashazar; Juan Cristobal Mariscal; Yasa Sampurno; Ara Philipossian
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Crossref

Inferences of Slurry Bow Wave Width from Mean Coefficient of Friction and Directivity in Chemical Mechanical Planarization

ECS Journal of Solid State Science and Technology
2019 | Journal article
DOI: 10.1149/2.0031905jss
Contributors: Gabriela Diaz; Yasa Sampurno; Siannie Theng; Ara Philipossian
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Crossref

Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In

ECS Journal of Solid State Science and Technology
2019 | Journal article
DOI: 10.1149/2.0141905jss
Contributors: Juan Cristobal Mariscal; Jeffrey McAllister; Yasa Sampurno; Jon Sierra Suarez; Leonard Borucki; Ara Philipossian
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Crossref

Insights into Tungsten Chemical Mechanical Planarization: Part II. Effect of Pad Surface Micro-Texture on Frictional, Thermal and Kinetic Aspects of the Process

ECS Journal of Solid State Science and Technology
2019 | Journal article
DOI: 10.1149/2.0251905jss
Contributors: Juan Cristobal Mariscal; Jeffrey McAllister; Yasa Sampurno; Jon Sierra Suarez; Leonard Borucki; Ara Philipossian
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Crossref

Insights into Tungsten Chemical Mechanical Planarization: Part III. Mini-Marathons and Associated Numerical Simulations

ECS Journal of Solid State Science and Technology
2019 | Journal article
DOI: 10.1149/2.0281905jss
Contributors: Juan Cristobal Mariscal; Jeffrey McAllister; Yasa Sampurno; Jon Sierra Suarez; Leonard Borucki; Ara Philipossian
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Crossref

Pad-Wafer-Slurry Interface Information from Force Data

ECS Journal of Solid State Science and Technology
2019 | Journal article
DOI: 10.1149/2.0211905jss
Contributors: L. Borucki; Y. Sampurno; A. Philipossian
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Crossref

Ultra-Rapid Determination of Material Removal Rates Based Solely on Tribological Data in Chemical Mechanical Planarization

ECS Journal of Solid State Science and Technology
2019 | Journal article
DOI: 10.1149/2.0061905jss
Contributors: Calliandra Stuffle; Leticia Vazquez Bengochea; Yasa Sampurno; Ara Philipossian
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Crossref

Effect of Conditioner Type and Downforce, and Pad Surface Micro-Texture on SiO<sub>2</sub> Chemical Mechanical Planarization Performance

Micromachines
2019-04 | Journal article | Author
DOI: 10.3390/mi10040258
Contributors: Jeffrey McAllister; Calliandra Stuffle; Yasa Sampurno; Dale; Jon Sierra Suarez; Leonard Borucki; Ara Philipossian
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Multidisciplinary Digital Publishing Institute
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