Personal information
Verified email domains
cea.fr
Activities
Employment (1)
2020-01-06
to
present
|
Bonding Process Engineer
Employment
Source:
Karine Abadie
Works (11)
Japanese Journal of Applied Physics
2025-04-01
|
Journal article
Contributors:
L. G. Michaud;
K. Abadie;
F. Fournel;
C. Morales;
V. Larrey;
B. Caulfield;
M. Wimplinger
Source:
check_circle
Crossref
Japanese Journal of Applied Physics
2025-03-01
|
Journal article
Contributors:
K. Abadie;
P. Renaud;
F. Fournel;
L. G. Michaud;
M. Danner;
M. Dornetshumer;
C. Lecouvey;
A.-M. Papon;
I. Chevalier;
T. Monniez
et al.
Source:
check_circle
Crossref
Journal of Applied Physics
2024-07-28
|
Journal article
Contributors:
Lucas Colonel;
Q. Lomonaco;
K. Abadie;
L. G. Michaud;
C. Morales;
S. Moreau;
F. Mazen;
F. Fournel;
D. Landru;
F. Rieutord
Source:
check_circle
Crossref
Semiconductor Science and Technology
2022-04-01
|
Journal article
Contributors:
K Abadie;
F Fournel;
C Morales;
F Mazen;
L Vignoud;
J-P Colonna;
J Widiez
Source:
check_circle
Crossref
grade
Preferred source
(of
2)
International Journal of Adhesion and Adhesives
2019
|
Journal article
EID:
2-s2.0-85063632393
Contributors:
Abadie, K.;
Montméat, P.;
Enot, T.;
Fournel, F.;
Wimplinger, M.
Source:
Karine Abadie
via
Scopus - Elsevier
Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
2017
|
Conference paper
EID:
2-s2.0-85022197299
Contributors:
Larrey, V.;
Vauche, L.;
Veinberg-Vidal, E.;
Tedjini, M.;
Morales, C.;
Foumel, F.;
Abadie, K.
Source:
Karine Abadie
via
Scopus - Elsevier
IMAPS 12th International Conference and Exhibition on Device Packaging
2016
|
Conference paper
EID:
2-s2.0-84995569120
Contributors:
Uhrmann, T.;
Brandl, E.;
Abadie, K.;
Wimplinger, M.;
Burggraf, J.;
Bravin, J.;
Fournel, F.;
Fournel, P.
Source:
Karine Abadie
via
Scopus - Elsevier
2016 6th Electronic System-Integration Technology Conference, ESTC 2016
2016
|
Conference paper
EID:
2-s2.0-85015037602
Contributors:
Abadie, K.;
Fournel, F.;
Montmeat, P.;
Wimplinger, M.
Source:
Karine Abadie
via
Scopus - Elsevier
ECS Transactions
2016
|
Conference paper
EID:
2-s2.0-84991516833
Contributors:
Abadie, K.;
Fournel, F.;
Morales, C.;
Moriceau, H.;
Wimplinger, M.
Source:
Karine Abadie
via
Scopus - Elsevier
IMAPS 12th International Conference and Exhibition on Device Packaging
2016
|
Conference paper
EID:
2-s2.0-84995680639
Contributors:
Abadie, K.;
Brandl, E.;
Fournel, F.;
Montméat, P.;
Wimplinger, M.;
Burggraf, J.;
Uhrmann, T.;
Bravin, J.
Source:
Karine Abadie
via
Scopus - Elsevier
ECS Transactions
2014
|
Conference paper
EID:
2-s2.0-84921386236
Contributors:
Vial, K.;
Fournel, F.;
Wimplinger, M.;
Burggraf, J.;
Bravin, J.;
Montméat, P.;
Pellat, M.
Source:
Karine Abadie
via
Scopus - Elsevier