Personal information
Verified email domains
stanford.edu
missouri.edu
ugent.be
Activities
Employment (4)
2023-09-01
to
present
|
Postdoctoral Scholar
(Chemical Engineering)
Employment
Source:
Andreas Werbrouck
2021-09-01
to
2023-08-31
|
Postdoctoral Scholar
(Chemical Engineering)
Employment
Source:
Andreas Werbrouck
2021-06-01
to
2021-08-31
|
Postdoctoral Scholar
(Solid State Sciences)
Employment
Source:
Andreas Werbrouck
2016-09-01
to
2021-06-01
|
PhD Student
(Solid State Sciences)
Employment
Source:
Andreas Werbrouck
Works (20)
Chemistry of Materials
2025-02-06
|
Journal article
Contributors:
Jacqueline Lewis;
Jingwei Shi;
Andreas Werbrouck;
Stacey F. Bent
Source:
check_circle
Crossref
ACS Applied Materials & Interfaces
2025-01-29
|
Journal article
Contributors:
Giulio D’Acunto;
Sanzeeda Baig Shuchi;
Xueli Zheng;
Long Viet Than;
Eva M. Geierstanger;
Maggy Harake;
Andy Cui;
Andreas Werbrouck;
Miika Mattinen;
Yi Cui
et al.
Source:
check_circle
Crossref
Chemistry of Materials
2025-01-14
|
Journal article
Contributors:
Alexander Shearer;
Fabian Pieck;
Josiah Yarbrough;
Andreas Werbrouck;
Ralf Tonner-Zech;
Stacey F. Bent
Source:
check_circle
Crossref
Chemistry of Materials
2024
|
Journal article
EID:
2-s2.0-85181814699
Contributors:
Rothman, A.;
Werbrouck, A.;
Bent, S.F.
Source:
Andreas Werbrouck
via
Scopus - Elsevier
Chemistry of Materials
2024
|
Journal article
EID:
2-s2.0-85190743346
Contributors:
Lee, Y.;
Seo, S.;
Shearer, A.B.;
Werbrouck, A.;
Kim, H.;
Bent, S.F.
Source:
Andreas Werbrouck
via
Scopus - Elsevier
grade
Preferred source
(of
2)
AIChE Journal
2024-12
|
Journal article
Contributors:
Nikhila C. Paranamana;
Amit K. Datta;
Quinton K. Wyatt;
Ryan C. Gettler;
Andreas Werbrouck;
Matthias J. Young
Source:
check_circle
Crossref
grade
Preferred source
(of
2)
Advanced Energy Materials
2024-12-23
|
Journal article
Contributors:
Nikhila C. Paranamana;
Andreas Werbrouck;
Amit K. Datta;
Xiaoqing He;
Matthias J. Young
Source:
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Crossref
2024-12-12
|
Preprint
Contributors:
Alexander Shearer;
Yukio Cho;
Miso Kim;
Andreas Werbrouck;
Tzu-Ling Liu;
Chris Takacs;
Bonggeun Shong;
Stacey F Bent
Source:
check_circle
Crossref
Journal of Vacuum Science & Technology A
2024-12-01
|
Journal article
Contributors:
Ajay Ravi;
Long Viet Than;
Jacqueline Lewis;
Jingwei Shi;
Andreas Werbrouck;
Jingyi Han;
Miika Mattinen;
Stacey F. Bent
Source:
check_circle
Crossref
grade
Preferred source
(of
2)
ACS Applied Materials & Interfaces
2024-11-20
|
Journal article
Contributors:
Robin R. Petit;
Resul Ozdemir;
Hannes Van Avermaet;
Luca Giordano;
Jakob Kuhs;
Andreas Werbrouck;
Matthias Filez;
Jolien Dendooven;
Zeger Hens;
Philippe F. Smet
et al.
Source:
check_circle
Crossref
grade
Preferred source
(of
2)
Applied Physics Reviews
2022
|
Journal article
EID:
2-s2.0-85126392100
Contributors:
Henderick, L.;
Dhara, A.;
Werbrouck, A.;
Dendooven, J.;
Detavernier, C.
Source:
Andreas Werbrouck
via
Scopus - Elsevier
Chemistry of Materials
2022
|
Journal article
EID:
2-s2.0-85139129849
Contributors:
Poonkottil, N.;
Minjauw, M.M.;
Werbrouck, A.;
Checchia, S.;
Solano, E.;
Nisula, M.;
Franquet, A.;
Detavernier, C.;
Dendooven, J.
Source:
Andreas Werbrouck
via
Scopus - Elsevier
grade
Preferred source
(of
2)
Journal of Physical Chemistry C
2022
|
Journal article
EID:
2-s2.0-85123361224
Contributors:
Poonkottil, N.;
Ramachandran, R.K.;
Solano, E.;
Srinath, N.V.;
Feng, J.-Y.;
Werbrouck, A.;
Van Daele, M.;
Filez, M.;
Minjauw, M.M.;
Poelman, H.
et al.
Source:
Andreas Werbrouck
via
Scopus - Elsevier
grade
Preferred source
(of
2)
Journal of Materials Chemistry A
2022
|
Journal article
EID:
2-s2.0-85124963845
Contributors:
Werbrouck, A.;
Mattelaer, F.;
Dhara, A.;
Nisula, M.;
Minjauw, M.;
Munnik, F.;
Dendooven, J.;
Detavernier, C.
Source:
Andreas Werbrouck
via
Scopus - Elsevier
grade
Preferred source
(of
2)
Dalton Transactions
2021
|
Journal article
EID:
2-s2.0-85100429355
Contributors:
Santo Domingo Peñaranda, J.;
Nisula, M.;
Vandenbroucke, S.S.T.;
Minjauw, M.M.;
Li, J.;
Werbrouck, A.;
Keukelier, J.;
Pitillas Martínez, A.I.;
Dendooven, J.;
Detavernier, C.
Source:
Andreas Werbrouck
via
Scopus - Elsevier
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
2021
|
Journal article
EID:
2-s2.0-85115205495
Contributors:
Werbrouck, A.;
Van de Kerckhove, K.;
Depla, D.;
Poelman, D.;
Smet, P.F.;
Dendooven, J.;
Detavernier, C.
Source:
Andreas Werbrouck
via
Scopus - Elsevier
grade
Preferred source
(of
3)
Journal of Physical Chemistry C
2020
|
Journal article
EID:
2-s2.0-85097765489
Contributors:
Werbrouck, A.;
Shirazi, M.;
Mattelaer, F.;
Elliott, S.D.;
Dendooven, J.;
Detavernier, C.
Source:
Andreas Werbrouck
via
Scopus - Elsevier
grade
Preferred source
(of
2)
Journal of Physical Chemistry C
2020
|
Journal article
EID:
2-s2.0-85097744206
Contributors:
Werbrouck, A.;
Mattelaer, F.;
Minjauw, M.;
Nisula, M.;
Julin, J.;
Munnik, F.;
Dendooven, J.;
Detavernier, C.
Source:
Andreas Werbrouck
via
Scopus - Elsevier
grade
Preferred source
(of
2)
Electrochimica Acta
2019
|
Journal article
EID:
2-s2.0-85070016332
Contributors:
Zhao, B.;
Mattelaer, F.;
Kint, J.;
Werbrouck, A.;
Henderick, L.;
Minjauw, M.;
Dendooven, J.;
Detavernier, C.
Source:
Andreas Werbrouck
via
Scopus - Elsevier
ACS Applied Materials and Interfaces
2019
|
Journal article
EID:
2-s2.0-85070485304
Contributors:
Kuhs, J.;
Werbrouck, A.;
Zawacka, N.;
Drijvers, E.;
Smet, P.F.;
Hens, Z.;
Detavernier, C.
Source:
Andreas Werbrouck
via
Scopus - Elsevier