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Scopus Author ID: 57205657053
ResearcherID: AAZ-2111-2020

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Funding (6)

High temperature devices and converters based on third-generation semiconductors

Grant
Key Research and Development Projects of Shaanxi Province (Xi'an, CN)
GRANT_NUMBER:

2021GXLH-Z-031
Source: Self-asserted source
Fengtao Yang

Intelligent Power Module Based on Gallium Nitride HEMT

Contract
Guangdong Midea Refrigeration Equipment Co., Ltd (Foshan, CN)
Source: Self-asserted source
Fengtao Yang

Mechanism and Control Methods of High Thermal Stress Formation in Wide Bandgap Power Electronic Devices

Grant
State Key Laboratory of Electrical Insulation and Power Equipment (Xi'an, CN)
Source: Self-asserted source
Fengtao Yang

New High Voltage Silicon Carbide Power Module Packaging Technology and Failure Mechanism Based on Sintered Plane Interconnection

Grant
National Natural Science Foundation of China (Beijing, CN)
GRANT_NUMBER:

U1966212
Source: Self-asserted source
Fengtao Yang

New Packaging and Reliability Optimization of Silicon Carbide Power Module

Grant
National Key Research and Development Program of China (Beijing, CN)
GRANT_NUMBER:

2019YFE0122800
Source: Self-asserted source
Fengtao Yang

Optimization Design Technology for Low Stray Inductance Busbars Suitable for Silicon Carbide Devices

Contract
State Key Laboratory of Advanced Power Transmission Technology (Beijing, CN)
GRANT_NUMBER:

SGGR0000WLQT1800789
Source: Self-asserted source
Fengtao Yang

Works (43)

A High-Sensitive Online Tj Extracting Method Based on Electrothermal Interaction and Linear-Mode Current Response for Power MOSFET Devices

IEEE Transactions on Power Electronics
2025 | Journal article
DOI: 10.1109/TPEL.2025.3540865
Contributors: Fengtao Yang; Laili Wang; Xiaoliang She; Zizhen Cheng; Mengyu Zhu; Hong Zhang; Lixin Jia
Source: check_circle
Crossref

A Flexible-PCB on DPC GaN Power Module With Ultralow Parasitic Inductance

IEEE Transactions on Power Electronics
2025-04 | Journal article
DOI: 10.1109/TPEL.2024.3521083
Contributors: Hang Kong; Lixin Jia; Laili Wang; Yilong Yao; Fengtao Yang; Hongchang Cui
Source: check_circle
Crossref

Characterization of Electro-Thermal Coupling Behaviors and Safe Operating Area of SiC MOSFET Modules in Pulsed Power Applications

IEEE Transactions on Power Electronics
2024-09 | Journal article
DOI: 10.1109/TPEL.2024.3409540
Contributors: Zaojun Ma; Yunqing Pei; Laili Wang; Tongyu Zhang; Haihua Wang; Qingshou Yang; Fengtao Yang; Mengyu Zhu
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Crossref

An Analytical Switching Loss Model for SiC MOSFET Considering Temperature-Dependent Reverse Recovery Over an Extremely Wide High-Temperature Range

IEEE Transactions on Power Electronics
2024-06 | Journal article
DOI: 10.1109/TPEL.2024.3365467
Contributors: Mengyu Zhu; Yunqing Pei; Fengtao Yang; Zizhen Cheng; Dingkun Ma; Laili Wang
Source: check_circle
Crossref

Investigation of Two High-Temperature Bipolar Phenomena and Characteristics of 1.2-kV SiC Power Diodes for High-Temperature Applications

IEEE Journal of Emerging and Selected Topics in Power Electronics
2024-02 | Journal article
DOI: 10.1109/JESTPE.2023.3324913
Contributors: Mengyu Zhu; Yunqing Pei; Fengtao Yang; Zhe Xue; Dingkun Ma; Laili Wang
Source: check_circle
Crossref

A Gallium Nitride Intelligent Power Module Based on Bonding Wire Interconnection

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
2023 | Conference paper
DOI: 10.1109/APEC43580.2023.10131222
EID:

2-s2.0-85162196279
Contributors: Yao, Y.; Zhang, H.; Yang, F.; Kong, H.; Wang, Y.; Dong, X.; Wang, L.; Wang, K.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier
grade
Preferred source (of 2)‎

Analysis and Optimization of High-Frequency Switching Oscillation Conducted CM Current Considering Parasitic Parameters Based on a Half-Bridge Power Module

IEEE Transactions on Power Electronics
2023 | Journal article
DOI: 10.1109/TPEL.2023.3291893
Contributors: Qingshou Yang; Laili Wang; Zhiyuan Qi; Xiaohui Lu; Zaojun Ma; Fengtao Yang; Haihua Wang
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Objective-Based Low-Frequency Parasitic Inductance Characterization Method for Power Semiconductor Package With High Power and Switching Speed

IEEE Transactions on Power Electronics
2023 | Journal article
DOI: 10.1109/TPEL.2023.3247890
Contributors: Fengtao Yang; Laili Wang; Zizhen Cheng; Hongchang Cui; Tongyu Zhang; Hang Kong; Yongmei Gan; Lixin Jia
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Adaptive Optimization Charging Strategy for LCC Resonant Capacitor Charging Power Supply

IEEE Journal of Emerging and Selected Topics in Power Electronics
2023-12 | Journal article
DOI: 10.1109/JESTPE.2023.3301738
Contributors: Mengjie Qin; Wenjie Chen; Aizhen Ye; Fan Zhang; Stephan M. Goetz; Fengtao Yang; Zheyuan Yu; Xu Yang
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Investigation and Comparison of Temperature-Sensitive Electrical Parameters of SiC mosfet at Extremely High Temperatures

IEEE Transactions on Power Electronics
2023-08 | Journal article
DOI: 10.1109/TPEL.2023.3267472
Contributors: Xiaohui Lu; Laili Wang; Qingshou Yang; Fengtao Yang; Yongmei Gan; Hong Zhang
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

A Highly Integrated Multichip SiC MOSFET Power Module With Optimized Electrical and Thermal Performances

IEEE Journal of Emerging and Selected Topics in Power Electronics
2023-04 | Journal article
DOI: 10.1109/JESTPE.2022.3210440
Contributors: Dingkun Ma; Guochun Xiao; Tongyu Zhang; Fengtao Yang; Mengyu Zhu; Tianshu Yuan; Liangjun Ma; Yongmei Gan; Laili Wang
Source: check_circle
Crossref
grade
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Compact-Interleaved Packaging Method of Power Module With Dynamic Characterization of 4H-SiC MOSFET and Development of Power Electronic Converter at Extremely High Junction Temperature

IEEE Transactions on Power Electronics
2023-01 | Journal article
DOI: 10.1109/TPEL.2022.3198835
Contributors: Fengtao Yang; Laili Wang; Hang Kong; Mengyu Zhu; Xingshuo Liu; Xiaohui Lu; Mengjie Qin; Tongyu Zhang; Yongmei Gan; Lixin Jia
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Crossref
grade
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A Highly Integrated GaN Power Module with Low Parasitic Inductance and High Thermal Performance

2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022
2022 | Conference paper
DOI: 10.1109/ECCE50734.2022.9948007
EID:

2-s2.0-85144082574
Contributors: Kong, H.; Yang, F.; Yang, C.; Zhang, Y.; Wang, Z.; Yao, Y.; Wang, Y.; Wang, L.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

A Parallel Vertical Structure (PVS) used in Highly Integrated GaN-Based Power Modules

2022 International Conference on Power Energy Systems and Applications, ICoPESA 2022
2022 | Conference paper
DOI: 10.1109/ICoPESA54515.2022.9754454
EID:

2-s2.0-85129292634
Contributors: Wang, Z.; Gan, Y.; Yang, F.; Kong, H.; Wen, J.; Zhang, Y.; Wang, L.; Su, Y.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

Comparative Evaluation and Analysis of Packaging Material System and Parallel Package Method Based on Interleaved Planar SiC Power Module

2022 International Conference on Power Energy Systems and Applications, ICoPESA 2022
2022 | Conference paper
DOI: 10.1109/ICoPESA54515.2022.9754408
EID:

2-s2.0-85129238951
Contributors: Xu, W.; Gan, Y.; Cheng, Z.; Yang, F.; Wang, L.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

Comparative Evaluation and Analysis of Parallel Package Method Based on 1.2-kV Interleaved Planar SiC Power Modules

2022 International Conference on Power Energy Systems and Applications, ICoPESA 2022
2022 | Conference paper
DOI: 10.1109/ICoPESA54515.2022.9754461
EID:

2-s2.0-85129260873
Contributors: Cheng, Z.; Zhang, H.; Xu, W.; Yang, F.; Wang, L.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

Immersion Oil Cooling Method of Discrete SiC Power Device in Electric Vehicle

2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022
2022 | Conference paper
DOI: 10.1109/ECCE50734.2022.9948112
EID:

2-s2.0-85144011511
Contributors: Yang, F.; Liu, C.; Shen, J.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

Study on the Immersion Oil Cooling Method of Power Module

Proceedings of 2022 IEEE 5th International Electrical and Energy Conference, CIEEC 2022
2022 | Conference paper
DOI: 10.1109/CIEEC54735.2022.9845896
EID:

2-s2.0-85137362464
Contributors: Yang, F.; Liu, C.; Wu, T.; Xiu, G.; Shen, J.; Xiong, L.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

An Evaluation on Thermal Performance Improvements for SiC Power Module Integrated With Vapor Chamber in MMC

IEEE Journal of Emerging and Selected Topics in Power Electronics
2022-10 | Journal article
DOI: 10.1109/JESTPE.2021.3138744
Contributors: Binyu Wang; Laili Wang; Shijie Wu; Zhenpeng Hou; Wei Mu; Fengtao Yang; Jinjun Liu; Yongmei Gan
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Crossref
grade
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Cu Clip-Bonding Method With Optimized Source Inductance for Current Balancing in Multichip SiC MOSFET Power Module

IEEE Transactions on Power Electronics
2022-07 | Journal article
DOI: 10.1109/TPEL.2022.3141373
Contributors: Laili Wang; Tongyu Zhang; Fengtao Yang; Dingkun Ma; Cheng Zhao; Yunqing Pei; Yongmei Gan
Source: check_circle
Crossref
grade
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Direct Integration of Optimized Phase-Change Heat Spreaders Into SiC Power Module for Thermal Performance Improvements Under High Heat Flux

IEEE Transactions on Power Electronics
2022-05 | Journal article
DOI: 10.1109/TPEL.2021.3125329
Contributors: Wei Mu; Laili Wang; Binyu Wang; Tongyu Zhang; Fengtao Yang; Yongmei Gan; Hong Zhang
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Crossref
grade
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Interleaved Planar Packaging Method of Multichip SiC Power Module for Thermal and Electrical Performance Improvement

IEEE Transactions on Power Electronics
2022-02 | Journal article
DOI: 10.1109/TPEL.2021.3106316
Contributors: Fengtao Yang; Jia Lixin; Laili Wang; Fan Zhang; Binyu Wang; Cheng Zhao; Jianpeng Wang; Christoph Bayer; Jan Ferreira
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Crossref
grade
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A Method to Balance Dynamic Current of Paralleled SiC MOSFETs with Kelvin Connection Based on Response Surface Model and Nonlinear Optimization

IEEE Transactions on Power Electronics
2021 | Journal article
DOI: 10.1109/TPEL.2020.3009008
EID:

2-s2.0-85092588519

Part of ISSN: 19410107 08858993
Contributors: Zhao, C.; Wang, L.; Zhang, F.; Yang, F.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

A Simple Transfer Capacitance Measurement Method of SiC MOSFET in High-voltage Applications

Proceedings of the Energy Conversion Congress and Exposition - Asia, ECCE Asia 2021
2021 | Conference paper
DOI: 10.1109/ECCE-Asia49820.2021.9479136
EID:

2-s2.0-85114214190
Contributors: Li, H.; Yang, C.; Jin, H.; Zhu, M.; Yu, L.; Yang, F.; Wen, J.; Wang, L.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

An Ultrahigh Step-Down DC-DC Converter Based on Switched-Capacitor and Coupled Inductor Techniques

IEEE Energy Conversion Congress and Exposition (ECCE)
2021 | Conference paper
DOI: 10.1109/ECCE47101.2021.9595577
WOSUID: WOS:000805434402030
Contributors: Yu, Longyang; Yang, Chengzi; Mu, Wei; Yang, Fengtao; Li, Huaqing; Wang, Laili; Su, Yuquan; Zhang, Chi
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Web of Science Researcher Profile Sync
grade
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Analysis of Gate-Source Voltage Spike Generated by Miller Capacitance and Common Source Inductance

Proceedings of the Energy Conversion Congress and Exposition - Asia, ECCE Asia 2021
2021 | Conference paper
DOI: 10.1109/ECCE-Asia49820.2021.9479360
EID:

2-s2.0-85114209717
Contributors: Yang, Q.; Wang, L.; Qi, Z.; Ma, Z.; Yang, F.; Lu, X.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

Characteristics of SiC MOSFET in a Wide Temperature Range

IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)
2021 | Conference paper
DOI: 10.1109/WIPDAASIA51810.2021.9656056
WOSUID: WOS:000812299400016
Contributors: Zhu, Mengyu; Wang, Laili; Li, Huaqing; Yang, Chengzi; Ma, Dingkun; Yang, Fengtao
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Web of Science Researcher Profile Sync
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Directly Integrated Vapor Chamber as an Efficient Heat Spreader for High Heat Flux Density SiC MOSFET Dies in Power Modules

IEEE Energy Conversion Congress and Exposition (ECCE)
2021 | Conference paper
DOI: 10.1109/ECCE47101.2021.9595649
WOSUID: WOS:000805434405130
Contributors: Mu, Wei; Wang, Binyu; Wang, Shenghe; Yang, Fengtao; Ma, Dingkun; Wang, Laili
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Web of Science Researcher Profile Sync
grade
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Research on Switching Characteristics of SiC MOSFET in Pulsed Power Supply with Analytical Model

Proceedings of the Energy Conversion Congress and Exposition - Asia, ECCE Asia 2021
2021 | Conference paper
DOI: 10.1109/ECCE-Asia49820.2021.9479273
EID:

2-s2.0-85114210889
Contributors: Ma, Z.; Pei, Y.; Wang, L.; Yang, Q.; Lu, X.; Yang, F.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

Thermal Performances and Annual Damages Comparison of MMC Using Reverse Conducting IGBT and Conventional IGBT Module

IEEE Transactions on Power Electronics
2021-09 | Journal article
DOI: 10.1109/TPEL.2021.3062620
Contributors: Binyu Wang; Laili Wang; Wei Mu; Mengjie Qin; Fengtao Yang; Jinjun Liu; Yamazaki Tomoyuki; Fujihira Tatsuhiko
Source: check_circle
Crossref
grade
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A Transient 3-D Thermal Modeling Method for IGBT Modules Considering Uneven Power Losses and Cooling Conditions

IEEE Journal of Emerging and Selected Topics in Power Electronics
2021-08 | Journal article
DOI: 10.1109/JESTPE.2020.3021679
Contributors: Jianpeng Wang; Wenjie Chen; Laili Wang; Binyu Wang; Cheng Zhao; Dingkun Ma; Fengtao Yang; Yan Li
Source: check_circle
Crossref
grade
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Air-Cooling System Optimization for IGBT Modules in MMC Using Embedded O-Shaped Heat Pipes

IEEE Journal of Emerging and Selected Topics in Power Electronics
2021-08 | Journal article
DOI: 10.1109/JESTPE.2021.3054918
Contributors: Binyu Wang; Laili Wang; Fengtao Yang; Wei Mu; Mengjie Qin; Fan Zhang; Dingkun Ma; Jianpeng Wang; Jinjun Liu
Source: check_circle
Crossref
grade
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A Compact SiC Power Module for Vienna Rectifiers with Bus-bar like Structure

2020 IEEE 9th International Power Electronics and Motion Control Conference, IPEMC 2020 ECCE Asia
2020 | Conference paper
DOI: 10.1109/IPEMC-ECCEAsia48364.2020.9367891
EID:

2-s2.0-85103184671
Contributors: Zhao, C.; Wang, L.; Yang, F.; Zhang, H.; Gan, Y.; Bayer, C.F.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

Design of Packaging Structure in High Voltage Power Modules to Avoid Surface Breakdown

2020 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2020
2020 | Conference paper
DOI: 10.1109/WiPDAAsia49671.2020.9360276
EID:

2-s2.0-85102269801
Contributors: Yan, F.; Wang, L.; Yang, T.; Wang, B.; Yang, F.; Yu, L.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

The Study on Thermal Coupling Effect for SiC Power Module Design Guidelines

2020 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2020
2020 | Conference paper
DOI: 10.1109/WiPDAAsia49671.2020.9360285
EID:

2-s2.0-85102318585
Contributors: Yang, F.; Jia, L.; Wang, L.; Zhao, C.; Wang, J.; Zhang, T.; Gan, Y.; Zhang, H.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

A Lifetime Estimation Method of MMC Submodules based on the Combination of FEA and Physical Lifetime Model

ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia
2019 | Conference paper
EID:

2-s2.0-85071606685
Contributors: Wang, B.; Wang, J.; Ma, D.; Wang, L.; Yang, F.; Li, X.; Tan, Y.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

A Method to Minimize Junction Temperature Difference of Dies in Multichip Power Modules

IEEE Energy Conversion Congress and Exposition (ECCE)
2019 | Conference paper
DOI: 10.1109/ECCE.2019.8912889
WOSUID: WOS:000520543703109
Contributors: Zhao, Cheng; Wang, Laili; Xu, Yunfei; Yang, Fengtao; Wang, Jianpeng; Qi, Zhiyuan
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Three-Dimensional Integrated GaN-based DC-DC Converter with an Inductor Substrate

IEEE Energy Conversion Congress and Exposition (ECCE)
2019 | Conference paper
DOI: 10.1109/ECCE.2019.8912732
WOSUID: WOS:000520543701033
Contributors: Qi, Zhiyuan; Wang, Laili; Pei, Yunqing; Zhao, Cheng; Yang, Fengtao; Zheng, Zijie
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A Novel Packaging Method Using Flexible Printed Circuit Board for High-Frequency SIC Power Module

Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)
2018 | Conference paper
DOI: 10.1109/WIPDAASIA.2018.8734651
WOSUID: WOS:000491999000021
Contributors: Yang, Fengtao; Wang, Laili; Wang, Jianpeng; Zhao, Cheng; Qi, Zhiyuan; Chen, Yang; Zhang, Yang
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A Phase-Leg Full SiC Power Module Used in Vienna Rectifiers

Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)
2018 | Conference paper
DOI: 10.1109/WIPDAASIA.2018.8734666
WOSUID: WOS:000491999000022
Contributors: Zhao, Cheng; Wang, Laili; Wang, Jianpeng; Qi, Zhiyuan; Yang, Fengtao; Chen, Yang
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A Temperature Prediction Model of T-type Inverter Module Based on Multi-Physics Coupling

IEEE International Power Electronics and Application Conference and Exposition (PEAC)
2018 | Conference paper
DOI: 10.1109/PEAC.2018.8590579
WOSUID: WOS:000468167900360
Contributors: Wang, Jianpeng; Qi, Zhiyuan; Duan, Yuqi; Wang, Laili; Zhao, Cheng; Yang, Fengtao
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Charging Speed Optimization of Bidirectional Flyback Converter for High Speed Dielectric Elastomer Actuator

2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia, WiPDA Asia 2018
2018 | Conference paper
DOI: 10.1109/WiPDAAsia.2018.8734679
EID:

2-s2.0-85068327693
Contributors: Chen, Y.; Tian, M.; Wang, L.; Song, S.; Niu, Z.; Qi, Z.; Yang, F.; Zhao, C.
Source: Self-asserted source
Fengtao Yang via Scopus - Elsevier

Charging Speed Optimization of Bidirectional Flyback Converter for High Speed Dielectric Flastomer Actuator

Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)
2018 | Conference paper
WOSUID: WOS:000491999000038
Contributors: Chen, Yang; Tian, Mofan; Wang, Laili; Song, Shaojie; Niu, Zhiyuan; Qi, Zhiyuan; Yang, Fengtao; Zhao, Cheng
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Peer review (18 reviews for 4 publications/grants)

Review activity for Energy. (2)
Review activity for IEEE journal of emerging and selected topics in power electronics. (1)
Review activity for IEEE transactions on industrial informatics. (1)
Review activity for IEEE transactions on power electronics. (14)
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