Personal information

Countries

Hong Kong SAR China

Activities

Collapse all

Education and qualifications (2)

City University of Hong Kong: Hong Kong, CN

2022-09-02 to 2023-10-03 | Master of science (Department of systems engineering)
Education
Source: Self-asserted source
YUXUAN AN

Beihang University: Beijing, CN

2018-08-29 to 2022-06-17 | Bachelor of engineering (School of energy and power engineering)
Education
Source: Self-asserted source
YUXUAN AN

Works (9)

Counteracting Effect of Sn Grain Orientation on Current Crowding in Electromigration Failures of Solder Joints

Electronic Materials Letters
2024-11-30 | Journal article
DOI: 10.1007/s13391-024-00535-7
Part of ISSN: 1738-8090
Part of ISSN: 2093-6788
Contributors: Yifan Yao; Zhunan Lu; Yuxuan An; K. N. Tu; yingxia liu
Source: Self-asserted source
YUXUAN AN

Low-temperature attaching of LED chips using SnBiIn solder nanoparticles

Journal of Materials Science: Materials in Electronics
2024-10 | Journal article
DOI: 10.1007/s10854-024-13649-3
Part of ISSN: 0957-4522
Part of ISSN: 1573-482X
Contributors: Xingchao Mao; Yuxuan An; Yifan Yao; Jingyu Qiao; Lulin Xie; King-Ning Tu; yingxia liu
Source: Self-asserted source
YUXUAN AN

Influence Factors of Joule Heating in Microbump in Advanced Packaging Technology

2024 25th International Conference on Electronic Packaging Technology (ICEPT)
2024-08-07 | Conference paper
DOI: 10.1109/icept63120.2024.10668533
Contributors: Yifan Yao; Yuxuan An; K.N. Tu; Yingxia Liu
Source: Self-asserted source
YUXUAN AN

Effect of Joule heating on the reliability of microbumps in 3D IC

Journal of Materials Research and Technology
2024-07 | Journal article
DOI: 10.1016/j.jmrt.2024.07.043
Contributors: Yifan Yao; Yuxuan An; Jiatong Dong; Yang Wang; K.N. Tu; Yingxia Liu
Source: check_circle
Crossref

Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps

Journal of Materials Research and Technology
2024-05 | Journal article
DOI: 10.1016/j.jmrt.2024.03.146
Contributors: Xingchao Mao; Yuxuan An; Yang Chen; Gong Zheng; Rui Hou; Xinyu Zhang; Yuzheng Guo; Sheng Liu; King-Ning Tu; Yingxia Liu
Source: check_circle
Crossref

Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology

Journal of Materials Research and Technology
2024-01 | Journal article
DOI: 10.1016/j.jmrt.2023.12.187
Contributors: Yifan Yao; Yuxuan An; K.N. Tu; Yingxia Liu
Source: check_circle
Crossref

Failure of Ball Grid Array during Electromigration and the Simulation of Dynamic Void Formation

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
2023-12-05 | Conference paper
DOI: 10.1109/eptc59621.2023.10457791
Contributors: Yifan Yao; Yuxuan An; King-Ning Tu; Yingxia Liu
Source: Self-asserted source
YUXUAN AN

Coupling Effect of Electromigration and Joule Heating Induced Failure in Advanced Packaging

2023 24th International Conference on Electronic Packaging Technology (ICEPT)
2023-08-08 | Conference paper
DOI: 10.1109/icept59018.2023.10492376
Contributors: Yifan Yao; Yuxuan An; King-Ning Tu; Yingxia Liu
Source: Self-asserted source
YUXUAN AN

Synergistic Effect of Current Stressing and Temperature Cycling on Reliability of Low Melting Point SnBi Solder

2023 24th International Conference on Electronic Packaging Technology (ICEPT)
2023-08-08 | Conference paper
DOI: 10.1109/icept59018.2023.10492344
Contributors: Zesheng Shen; Yuxuan An; Zishan Xiong; King-Ning Tu; Yingxia Liu
Source: Self-asserted source
YUXUAN AN
How many people are using ORCID?