Personal information
2D materials, charge and thermoelectric transport
Singapore, United States
Activities
Employment (3)
2025-01-06
to
present
|
Postdoctoral Fellow
(Department of Physics)
Employment
Source:
Hong Kuan Ng
2022-02-03
to
2024-12-30
|
Scientist
Employment
Source:
Hong Kuan Ng
2017-08-14
to
2022-01-17
(NGS / Physics)
Employment
Source:
Hong Kuan Ng
Education and qualifications (2)
2017-08
to
2022-01
|
Doctor of Philosophy
(Physics)
Education
Source:
Hong Kuan Ng
2013-08-14
to
2016-08-11
|
Bachelors in Physics (Applied)
(Physics)
Education
Source:
Hong Kuan Ng
Works (20)
Advanced Functional Materials
2024-05
|
Journal article
Contributors:
Fang Yang;
Hong Kuan Ng;
Xin Ju;
Weifan Cai;
Jing Cao;
Dongzhi Chi;
Ady Suwardi;
Guangwei Hu;
Zhenhua Ni;
Xiao Renshaw Wang
et al.
Source:
Hong Kuan Ng
Nanoscale
2023
|
Journal article
Contributors:
Dewu Yue;
Xin Ju;
Tao Hu;
Ximing Rong;
Xinke Liu;
Xiao Liu;
Hong Kuan Ng;
Dongzhi Chi;
Xinzhong Wang;
Jing Wu
Source:
Hong Kuan Ng
Nature Electronics
2023-11-22
|
Journal article
Contributors:
Hong Kuan Ng;
Dr. Du Xiang;
Ady Suwardi;
Guangwei Hu;
Ke Yang;
Yunshan Zhao;
Tao Liu;
Zhonghan Cao;
Huajun liu;
Shisheng Li
et al.
Source:
Hong Kuan Ng
Two‐Dimensional Transition‐Metal Dichalcogenides: Phase Engineering and Applications in Electronics and Optoelectronics
2023-11-10
|
Book chapter
Contributors:
H. K. Ng;
Yunshan Zhao;
Dongzhi Chi;
Jing Wu
Source:
Hong Kuan Ng
Science China Information Sciences
2023-06
|
Journal article
Contributors:
Fang Yang;
Hong Kuan Ng;
Jing Wu;
Yunshan Zhao;
Junpeng Lu
Source:
Hong Kuan Ng
Nano Energy
2022-06
|
Journal article
Contributors:
Jing Cao;
Xian Yi Tan;
Ning Jia;
Jie Zheng;
Sheau Wei Chien;
Hong Kuan Ng;
Chee Kiang Ivan Tan;
Hongfei Liu;
Qiang Zhu;
Suxi Wang
et al.
Source:
Hong Kuan Ng
Nature Electronics
2022-06-09
|
Journal article
Contributors:
Hong Kuan Ng;
Du Xiang;
Ady Suwardi;
Guangwei Hu;
Ke Yang;
Yunshan Zhao;
Tao Liu;
Zhonghan Cao;
Huajun Liu;
Shisheng Li
et al.
Source:
check_circle
Crossref
Advanced Materials
2022-05
|
Journal article
Contributors:
Jing Cao;
Ying Sim;
Xian Yi Tan;
Jie Zheng;
Sheau Wei Chien;
Ning Jia;
Kewei Chen;
Yeow Boon Tay;
Jin‐Feng Dong;
Le Yang
et al.
Source:
Hong Kuan Ng
ACS Nano
2022-05-24
|
Journal article
Contributors:
Xinyun Wang;
Yuzhou Zhao;
Xiao Kong;
Qi Zhang;
Hong Kuan Ng;
Dr. Sharon Xiaodai Lim;
Yue Zheng;
Xiao Wu;
Kenji Watanabe;
Qing-Hua Xu
et al.
Source:
Hong Kuan Ng
Journal of Materials Chemistry A
2021
|
Journal article
EID:
2-s2.0-85118100733
Contributors:
Jia, N.;
Cao, J.;
Tan, X.Y.;
Zheng, J.;
Chien, S.W.;
Yang, L.;
Chen, K.;
Ng, H.K.;
Faye Duran, S.S.;
Liu, H.
et al.
Source:
Hong Kuan Ng
via
Scopus - Elsevier
Proceedings of the National Academy of Sciences of the United States of America
2020
|
Journal article
EID:
2-s2.0-85088881564
Contributors:
Wu, J.;
Liu, Y.;
Liu, Y.;
Cai, Y.;
Zhao, Y.;
Ng, H.K.;
Watanabe, K.;
Taniguchi, T.;
Zhang, G.;
Qiu, C.-W.
et al.
Source:
Hong Kuan Ng
via
Scopus - Elsevier
Proceedings of the National Academy of Sciences of the United States of America
2020
|
Journal article
EID:
2-s2.0-85087093785
Contributors:
Wu, J.;
Liu, Y.;
Liu, Y.;
Liu, Y.;
Cai, Y.;
Zhao, Y.;
Ng, H.K.;
Watanabe, K.;
Taniguchi, T.;
Zhang, G.
et al.
Source:
Hong Kuan Ng
via
Scopus - Elsevier
ACS Applied Materials & Interfaces
2020-07-29
|
Journal article
Contributors:
Jose Recatala-Gomez;
Hong Kuan Ng;
Pawan Kumar;
Ady Suwardi;
Minrui Zheng;
Mohamed Asbahi;
Sudhiranjan Tripathy;
Iris Nandhakumar;
Mohammad S. M. Saifullah;
Kedar Hippalgaonkar
Source:
check_circle
Crossref
grade
Preferred source
(of
3)
ACS Applied Materials and Interfaces
2019
|
Journal article
EID:
2-s2.0-85063771487
Contributors:
Ng, H.K.;
Abutaha, A.;
Voiry, D.;
Verzhbitskiy, I.;
Cai, Y.;
Zhang, G.;
Liu, Y.;
Wu, J.;
Chhowalla, M.;
Eda, G.
et al.
Source:
Hong Kuan Ng
via
Scopus - Elsevier
Journal of Materials Chemistry A
2019
|
Journal article
EID:
2-s2.0-85074206992
Contributors:
Suwardi, A.;
Bash, D.;
Ng, H.K.;
Gomez, J.R.;
Repaka, D.V.M.;
Kumar, P.;
Hippalgaonkar, K.
Source:
Hong Kuan Ng
via
Scopus - Elsevier
arXiv
2019
|
Other
EID:
2-s2.0-85093560917
Contributors:
Wu, J.;
Liu, Y.;
Liu, Y.;
Cai, Y.;
Zhao, Y.;
Ng, H.K.;
Watanabe, K.;
Taniguchi, T.;
Zhang, G.;
Qiu, C.
et al.
Source:
Hong Kuan Ng
via
Scopus - Elsevier
Science China Materials
2019
|
Journal article
EID:
2-s2.0-85050629424
Contributors:
Zhang, C.;
Zhang, C.;
Ng, H.;
Xiong, Q.
Source:
Hong Kuan Ng
via
Scopus - Elsevier
arXiv
2018
|
Other
EID:
2-s2.0-85094248347
Contributors:
Laugier, L.;
Recatala, J.;
Ramasamy, S.;
Chandrasekhar, V.R.;
Bash, D.;
Ng, H.K.;
Foo, C.-S.;
Hippalgaonkar, K.
Source:
Hong Kuan Ng
via
Scopus - Elsevier
Journal of Applied Physics
2017
|
Journal article
EID:
2-s2.0-85020000597
Contributors:
Ng, H.K.;
Chi, D.;
Hippalgaonkar, K.
Source:
Hong Kuan Ng
via
Scopus - Elsevier
ACS Applied Materials and Interfaces
2017
|
Journal article
EID:
2-s2.0-85017461968
Contributors:
Zhang, C.;
Ng, H.;
Li, Z.;
Khor, K.A.;
Xiong, Q.
Source:
Hong Kuan Ng
via
Scopus - Elsevier