Personal information

Other IDs

Scopus Author ID: 9737352000

Activities

Collapse all

Employment (9)

Universiti Monash - Malaysia: Bandar Sunway, Selangor, MY

2016 to present | Associate Professor (Civil Engineering)
Employment
Source: Self-asserted source
Ee-Hua Wong

Nanyang Technological University: Singapore, SG

2016 to present | Visiting Principal Scientist (Energy Research Institute)
Employment
Source: Self-asserted source
Ee-Hua Wong

University of Canterbury: Christchurch, NZ

2011 to 2015 | Sr. Lecturer (Mechanical Engineering)
Employment
Source: Self-asserted source
Ee-Hua Wong

Nanyang Technological University: Singapore, SG

2010 to 2011 | Program Manager (Energy Research Institute)
Employment
Source: Self-asserted source
Ee-Hua Wong

Singapore Institute of Manufacturing Technology: Singapore, SG

2008 to 2009 | Sr. Scientist
Employment
Source: Self-asserted source
Ee-Hua Wong

Institute of Microelectronics: Singapore, SG

1996 to 2007 | Sr. Member of Technical Staff
Employment
Source: Self-asserted source
Ee-Hua Wong

Temasek Polytechnic: Singapore, SG

1994 to 1996 | Lecturer (Mechatronic)
Employment
Source: Self-asserted source
Ee-Hua Wong

Singapore Technology: Singapore, SG

1983 to 1994 | Sr. Engineer (Product and Process Design)
Employment
Source: Self-asserted source
Ee-Hua Wong

Singapore Technology: Singapore, SG

1983 to 1994 | Sr. Engineer (Product and Process Design)
Employment
Source: Self-asserted source
Ee-Hua Wong

Education and qualifications (4)

University of Sydney: Sydney, NSW, AU

2004 to 2006 | PhD (Mechanical Engineering)
Education
Source: Self-asserted source
Ee-Hua Wong

University of Manchester: Manchester, Manchester, GB

1988 to 1989 | MSc (Mechanical Engineering)
Education
Source: Self-asserted source
Ee-Hua Wong

Engineering Council: London, London, GB

1983 to 1988 | BSc
Education
Source: Self-asserted source
Ee-Hua Wong

Singapore Polytechnic: Singapore, SG

1977 to 1980 | Diploma (Mechanical Engineering)
Education
Source: Self-asserted source
Ee-Hua Wong

Funding (10)

Drop-Impact Consortia II

2008-06 to 2010-12 | Contract
NXP Semiconductor, Nihon Superior (Eindhoven, Tokyo, NL)
Source: Self-asserted source
Ee-Hua Wong

Drop-Impact Consortium I

2006-06 to 2007-12 | Contract
Philips, NXP, Freescale, ASE (Eindhoven, Phoenix, Kaohsiung, NL)
Source: Self-asserted source
Ee-Hua Wong

Adhesive Interconnection

2005 to 2005 | Contract
Infineon Technology (Singapore, SG)
Source: Self-asserted source
Ee-Hua Wong

Nano Wafer Lever Packaging

2002 to 2006 | Grant
Agency for Science & Technology (Singapore, SG)
Source: Self-asserted source
Ee-Hua Wong

Drop Impact Research

2002 to 2005 | Grant
Agency for Science & Technology (Singapore, SG)
Source: Self-asserted source
Ee-Hua Wong

Non-Conductive Adhesive Interconnection

2002 to 2003 | Contract
Philips Applied Technology (Eindhoven, NL)
Source: Self-asserted source
Ee-Hua Wong

Electronic Packaging Research Consortium V

2000 to 2001 | Contract
Industry (A number of cities, SG)
Source: Self-asserted source
Ee-Hua Wong

Electronic Packaging Research Consortium IV

1999 to 1999 | Contract
Industry (A number of cities, SG)
Source: Self-asserted source
Ee-Hua Wong

Electronic Packaging Research Consortium

1998 to 1998 | Contract
Industry (A number of cities, SG)
Source: Self-asserted source
Ee-Hua Wong

Development of sub-caliber weapon

1993 to 1994 | Contract
Ministry of Defense (Singapore, SG)
Source: Self-asserted source
Ee-Hua Wong

Works (50 of 129)

Items per page:
Page 1 of 3

Derivation of Novel Creep-Integrated Fatigue Equations

International Journal of Fatigue
2019-07 | Journal article
DOI: 10.1016/j.ijfatigue.2019.06.044
Contributors: E.H. Wong
Source: check_circle
Crossref

Interface and interconnection stresses in electronic assemblies – A critical review of analytical solutions

Microelectronics Reliability
2017-12 | Journal article
DOI: 10.1016/j.microrel.2017.03.010
Contributors: E.H. Wong; Johan Liu
Source: check_circle
Crossref

A new representation for anisotropic viscoelastic functions

Mathematics and Mechanics of Solids
2016 | Journal article
DOI: 10.1177/1081286514536083
EID:

2-s2.0-84979713651
Contributors: Chen, D.-L.; Yang, P.-F.; Lai, Y.-S.; Wong, E.-H.; Chen, T.-C.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Characterising the kinetics of the Free and the Bound Water using Non-Isothermal Sorption Technique

Drying Technologies
2016 | Journal article
DOI: 10.1080/07373937.2016.1158722
Source: Self-asserted source
Ee-Hua Wong

Creep-Integrated Fatigue Equation for Metals

International journal of fatigue
2016 | Journal article
Part of DOI: doi.org/10.1016/j.ijfatigue.2016.11.030
Source: Self-asserted source
Ee-Hua Wong

Design analysis of sandwiched structures experiencing differential thermal expansion and differential free-edge stretching

International Journal of Adhesion and Adhesives
2016 | Journal article
DOI: 10.1016/j.ijadhadh.2015.10.021
EID:

2-s2.0-84947443700
Contributors: Wong, E.H.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

On the oscillatority of viscoelastic functions

International Journal of Solids and Structures
2016 | Journal article
DOI: 10.1016/j.ijsolstr.2016.06.015
EID:

2-s2.0-84991262277
Contributors: Chen, D.-L.; Wong, E.-H.; Chen, T.-C.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

The Unified Creep-Fatigue Equation for Stainless Steel 316

Metals
2016 | Journal article
DOI: doi:10.3390/met6090219
Source: Self-asserted source
Ee-Hua Wong

Constitutive modeling of solder alloys for drop-impact applications

Microelectronics Reliability
2016-12 | Journal article
DOI: 10.1016/j.microrel.2016.10.007
Contributors: E.H. Wong; J. Chrisp; C.S. Selvanayagam; S.K.W. Seah
Source: check_circle
Crossref

Moisture diffusion modeling – A critical review

Microelectronics Reliability
2016-10 | Journal article
DOI: 10.1016/j.microrel.2016.08.009
Contributors: E.H. Wong; S.B. Park
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Creep fatigue models of solder joints: A critical review

Microelectronics Reliability
2016-04 | Journal article
DOI: 10.1016/j.microrel.2016.01.013
Contributors: E.H. Wong; W.D. van Driel; A. Dasgupta; M. Pecht
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Interfacial stresses in sandwich structures subjected to temperature and mechanical loads

Composite Structures
2015 | Journal article
DOI: 10.1016/j.compstruct.2015.07.106
EID:

2-s2.0-84951938968
Contributors: Wong, E.H.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

On non-monotonicity of linear viscoelastic functions

Mathematics and Mechanics of Solids
2015 | Journal article
DOI: 10.1177/1081286513509100
EID:

2-s2.0-84930442657
Contributors: Chen, D.-L.; Yang, P.-F.; Lai, Y.-S.; Wong, E.-H.; Chen, T.-C.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

The fundamentals of thermal-mass diffusion analogy

Microelectronics Reliability
2015 | Journal article
DOI: 10.1016/j.microrel.2014.12.002
EID:

2-s2.0-84923576927
Contributors: Wong, E.H.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Thermal stresses in the discrete joints of sandwiched structures

Composite Structures
2015 | Journal article
DOI: 10.1016/j.compstruct.2015.01.027
EID:

2-s2.0-84922978927
Contributors: Wong, E.H.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption

Microelectronics Reliability
2015-11 | Journal article
DOI: 10.1016/j.microrel.2015.06.053
Contributors: E.H. Wong; J. Cook; M. Dreno; Dao-Long Chen; Yi-Shao Lai
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

A unified equation for creep-fatigue

International Journal of Fatigue
2014 | Journal article
DOI: 10.1016/j.ijfatigue.2014.05.004
EID:

2-s2.0-84907433136
Contributors: Wong, E.H.; Mai, Y.-W.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Frequency-dependent low cycle fatigue of Sn1Ag0.1Cu(In/Ni) solder joints subjected to high-frequency loading

Journal of Electronic Materials
2014 | Journal article
DOI: 10.1007/s11664-013-2889-0
EID:

2-s2.0-84897664821
Contributors: Wong, E.H.; Seah, S.K.W.; Shim, V.P.W.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Frequency-dependent strain-life characteristics of Sn1.0Ag0.1Cu solder on cupper pad at high cyclic frequency

International Journal of Fatigue
2014 | Journal article
DOI: 10.1016/j.ijfatigue.2013.09.016
EID:

2-s2.0-84888300116
Contributors: Wong, E.H.; Seah, S.K.W.; Caers, J.F.J.M.; Lai, Y.-S.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Design features for bobbin friction stir welding tools: Development of a conceptual model linking the underlying physics to the production process

Materials and Design
2013 | Journal article
Part of DOI: dx.doi.org/10.1016/j.matdes.2013.08.057
Source: Self-asserted source
Ee-Hua Wong

A study of crack propagation in Pb-free solder joints

IEEE Transactions on Electronics Packaging Manufacturing
2010 | Journal article
DOI: 10.1109/TEPM.2009.2039710
EID:

2-s2.0-77955067893
Contributors: Caers, J.F.J.M.; Zhao, X.J.; Wong, E.H.; Seah, S.K.W.; Selvanayagam, C.S.; Van Driel, W.D.; Owens, N.; Leoni, M.; Tan, L.C.; Eu, P.L. et al.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Advances in the drop-impact reliability of solder joints for mobile applications

Microelectronics Reliability
2009 | Journal article
DOI: 10.1016/j.microrel.2008.12.001
EID:

2-s2.0-59549101503
Contributors: Wong, E.H.; Seah, S.K.W.; van Driel, W.D.; Caers, J.F.J.M.; Owens, N.; Lai, Y.-S.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Analytical solution for the damped-dynamics of printed circuit board and applied to study the effects of distorted half-sine support excitation

IEEE Transactions on Advanced Packaging
2009 | Journal article
DOI: 10.1109/TADVP.2009.2014737
EID:

2-s2.0-67349147375
Contributors: Wong, E.H.; Mai, Y.-W.; Woo, M.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Analytical solutions for PCB assembly subjected to mismatched thermal expansion

IEEE Transactions on Advanced Packaging
2009 | Journal article
DOI: 10.1109/TADVP.2009.2025222
EID:

2-s2.0-68949181691
Contributors: Wong, E.H.; Lim, K.M.; Mai, Y.-W.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending

International Journal of Mechanical Sciences
2009 | Journal article
DOI: 10.1016/j.ijmecsci.2008.12.003
EID:

2-s2.0-60549113481
Contributors: Wong, E.H.; Wong, C.K.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Frequency dependent S-N curves for predicting drop impact robustness of Pb-free solder interconnects

Proceedings - Electronic Components and Technology Conference
2009 | Conference paper
DOI: 10.1109/ECTC.2009.5074002
EID:

2-s2.0-70349653087
Contributors: Zhao, X.J.; Caers, J.F.J.M.; Wong, E.H.; Seah, S.K.W.; Driel, W.D.V.; Owen, N.; Lai, Y.-S.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

High-speed cyclic bend tests and board-level drop tests for evaluating the robustness of solder joints in printed circuit board assemblies

Journal of Electronic Materials
2009 | Journal article
DOI: 10.1007/s11664-008-0610-5
EID:

2-s2.0-67650462245
Contributors: Wong, E.H.; Seah, S.K.W.; Selvanayagam, C.S.; Rajoo, R.; Van Driel, W.D.; Caers, J.F.J.M.; Zhao, X.J.; Owens, N.; Leoni, M.; Tan, L.C. et al.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation

Microelectronics Reliability
2009 | Journal article
DOI: 10.1016/j.microrel.2009.05.007
EID:

2-s2.0-67650577142
Contributors: Wong, E.H.; Mai, Y.-W.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

A more comprehensive solution for tri-material layers subjected to thermal stress

IEEE Transactions on Components and Packaging Technologies
2008 | Journal article
DOI: 10.1109/TCAPT.2007.906730
EID:

2-s2.0-41349104489
Contributors: Wong, E.H.; Lim, T.B.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

A review of board level solder joints for mobile applications

Microelectronics Reliability
2008 | Journal article
DOI: 10.1016/j.microrel.2008.08.006
EID:

2-s2.0-55849123626
Contributors: Wong, E.H.; Seah, S.K.W.; Shim, V.P.W.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

A study of component-level measure of board-level drop impact reliability by ball impact test

2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
2008 | Conference paper
DOI: 10.1109/IMPACT.2008.4783807
EID:

2-s2.0-64049106512
Contributors: Lail, Y.-S.; Wong, E.H.; Rajoo, R.; Seah, S.K.W.; Selvanayagam, C.S.; Van Driel, W.D.; Caers, J.F.J.M.; Zhao, X.J.; Owens, N.; Tan, L.C. et al.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

A study of crack propagation in Pb-free solder joints under drop impact

Proceedings - Electronic Components and Technology Conference
2008 | Conference paper
DOI: 10.1109/ECTC.2008.4550123
EID:

2-s2.0-51349132835
Contributors: Caers, J.F.J.M.; Wong, E.H.; Seah, S.K.W.; Zhao, X.J.; Selvanayagam, C.S.; Van Driel, W.D.; Owens, N.; Leoni, M.; Tan, L.C.; Eu, P.L. et al.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Correlation studies for component level ball impact shear test and board level drop test

Microelectronics Reliability
2008 | Journal article
DOI: 10.1016/j.microrel.2008.04.008
EID:

2-s2.0-48349084051
Contributors: Wong, E.H.; Rajoo, R.; Seah, S.K.W.; Selvanayagam, C.S.; van Driel, W.D.; Caers, J.F.J.M.; Zhao, X.J.; Owens, N.; Tan, L.C.; Leoni, M. et al.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Development of stretch solder interconnections for wafer level packaging

IEEE Transactions on Advanced Packaging
2008 | Journal article
DOI: 10.1109/TADVP.2008.923390
EID:

2-s2.0-44449166663
Contributors: Rajoo, R.; Lim, S.S.; Wong, E.H.; Hnin, W.Y.; Seah, S.K.W.; Tay, A.A.O.; Iyer, M.; Tummala, R.R.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

DNA sensing by silicon nanowire: Charge layer distance dependence

Nano Letters
2008 | Journal article
DOI: 10.1021/nl072991l
EID:

2-s2.0-56249094058
Contributors: Zhang, G.-J.; Zhang, G.; Chua, J.H.; Chee, R.-E.; Wong, E.H.; Agarwal, A.; Buddharaju, K.D.; Singh, N.; Gao, Z.; Balasubramanian, N.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading

Scripta Materialia
2008 | Journal article
DOI: 10.1016/j.scriptamat.2008.08.020
EID:

2-s2.0-53249093685
Contributors: Seah, S.K.W.; Wong, E.H.; Shim, V.P.W.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Fracture mechanics study of fatigue crack growth in solder joints under drop impact

Proceedings - Electronic Components and Technology Conference
2008 | Conference paper
DOI: 10.1109/ECTC.2008.4550190
EID:

2-s2.0-51349151799
Contributors: Wang, J.; Seah, S.K.W.; Wong, E.H.; Cadge, D.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

HART: A new Highly Accelerated Robustness Test for conductive adhesive interconnects

Proceedings - Electronic Components and Technology Conference
2008 | Conference paper
DOI: 10.1109/ECTC.2008.4550207
EID:

2-s2.0-51349157763
Contributors: Caers, J.F.J.M.; Zhao, X.J.; De Vries, J.W.C.; Wong, E.H.; Kums, G.; Engelfriet, A.R.C.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Integrated process-aging modeling methodology for flip chip on flex interconnections with nonconductive adhesives

IEEE Transactions on Advanced Packaging
2008 | Journal article
DOI: 10.1109/TADVP.2008.2005022
EID:

2-s2.0-57749106358
Contributors: Zhang, X.; Wong, E.H.; Rajoo, R.; Iyer, M.K.; Caers, J.F.J.M.; Zhao, X.J.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Recent advances in drop-impact reliability

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
2008 | Conference paper
DOI: 10.1109/ESIME.2008.4525107
EID:

2-s2.0-49249124015
Contributors: Wong, E.H.; Seah, S.K.W.; Van Driel, W.D.; Caers, J.F.J.M.; Owens, N.; Lai, Y.-S.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Second level interconnect mechanical robustness

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference
2008 | Conference paper
EID:

2-s2.0-84877251769
Contributors: Owens, N.; Wong, E.H.; Rajoo, R.; Seah, S.K.W.; Selvanayagam, C.S.; Van Driel, W.D.; Caers, J.F.J.M.; Zhao, X.J.; Tan, L.C.; Leoni, M. et al.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Stress-strain characteristics of tin-based solder alloys at medium strain rate

Materials Letters
2008 | Journal article
DOI: 10.1016/j.matlet.2008.01.101
EID:

2-s2.0-43149092896
Contributors: Wong, E.H.; Selvanayagam, C.S.; Seah, S.K.W.; van Driel, W.D.; Caers, J.F.J.M.; Zhao, X.J.; Owens, N.; Tan, L.C.; Frear, D.R.; Leoni, M. et al.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Stress-strain characteristics of tin-based solder alloys for drop-impact modeling

Journal of Electronic Materials
2008 | Journal article
DOI: 10.1007/s11664-008-0403-x
EID:

2-s2.0-42449137840
Contributors: Wong, E.H.; Selvanayagam, C.S.; Seah, S.K.W.; Van Driel, W.D.; Caers, J.F.J.M.; Zhao, X.J.; Owens, N.; Tan, L.C.; Frear, D.R.; Leoni, M. et al.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Tri-layer structures subjected to combined temperature and mechanical loadings

IEEE Transactions on Components and Packaging Technologies
2008 | Journal article
DOI: 10.1109/TCAPT.2008.2001196
EID:

2-s2.0-57349128932
Contributors: Wong, E.H.; Wong, C.K.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

A component level test method for evaluating the resistance of Pb-free BGA solder joints to brittle fracture under shock impact

Proceedings - Electronic Components and Technology Conference
2007 | Conference paper
DOI: 10.1109/ECTC.2007.373996
EID:

2-s2.0-35348848368
Contributors: Zhao, X.J.; Caers, J.F.J.M.; De Vries, J.W.C.; Wong, E.H.; Rajoo, R.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Analytical solution of the dynamic response of printed circuit board to support excitation

Proceedings of the Electronic Packaging Technology Conference, EPTC
2007 | Conference paper
DOI: 10.1109/EPTC.2007.4469786
EID:

2-s2.0-50049103935
Contributors: Woo, M.S.S.; Wong, E.H.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Analytical solutions for interconnect stress in board level drop impact

IEEE Transactions on Advanced Packaging
2007 | Journal article
DOI: 10.1109/TADVP.2007.898599
EID:

2-s2.0-36348989735
Contributors: Wong, E.H.; Mai, Y.-W.; Seah, S.K.W.; Lim, K.-M.; Lim, T.B.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Constitutive properties of bulk solder at 'drop-impact' strain rates

Proceedings of the Electronic Packaging Technology Conference, EPTC
2007 | Conference paper
DOI: 10.1109/EPTC.2007.4469817
EID:

2-s2.0-50049134023
Contributors: Selvanayagam, C.S.; Wong, E.H.; Seah, S.K.W.; Van Driel, W.D.; Caers, J.F.J.M.; Zhao, X.J.; Owens, N.; Tan, L.C.; Frear, D.R.; Leoni, M. et al.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Evolution of contact resistance during the bonding process of NCA flip-chip interconnections

Journal of Electronic Materials
2007 | Journal article
DOI: 10.1007/s11664-007-0257-7
EID:

2-s2.0-36148971611
Contributors: Yu, H.; Mhaisalkar, S.G.; Wong, E.H.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier

Advances in vapor pressure modeling for electronic packaging

IEEE Transactions on Advanced Packaging
2006 | Journal article
DOI: 10.1109/TADVP.2006.879423
EID:

2-s2.0-37849186235
Contributors: Wong, E.H.; Koh, S.W.; Lee, K.H.; Lim, K.-M.; Lim, T.B.; Mai, Y.-W.
Source: Self-asserted source
Ee-Hua Wong via Scopus - Elsevier
Items per page:
Page 1 of 3
How many people are using ORCID?