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Education and qualifications (1)

Beijing Institute of Technology: Beijing, Beijing, CN

Education
Source: Self-asserted source
Zhiqiang Cheng

Works (6)

Modeling and Characterization of Annealing-Induced Cu Protrusion of TSVs With Polyimide Liner Considering Diffusion Creep Behavior

IEEE Transactions on Electron Devices
2023-02 | Journal article
DOI: 10.1109/TED.2022.3228975
Contributors: Baoyan Yang; Yingtao Ding; Zhiqiang Cheng; Anrun Ren; Lei Xiao; Yangyang Yan; Ziyue Zhang; Zhiming Chen
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Crossref

Study on atomic migration of copper through-silicon-vias with Bosch scallops

Microelectronics Reliability
2021 | Journal article
DOI: 10.1016/J.MICROREL.2021.114178
WOSUID: WOS:000687772200004
Contributors: Cheng, Zhiqiang; Ding, Yingtao; Xiao, Lei; Yang, Baoyan; Chen, Zhiming
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Comparative evaluations on scallop-induced electric-thermo-mechanical reliability of through-silicon-vias

Microelectronics Reliability
2019 | Journal article
DOI: 10.1016/J.MICROREL.2019.113512
WOSUID: WOS:000500386300010
Contributors: Cheng, Zhiqiang; Ding, Yingtao; Xiao, Lei; Wang, Xinghua; Chen, Zhiming
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Elimination of Scallop-Induced Stress Fluctuation on Through-Silicon-Vias (TSVs) by Employing Polyimide Liner

IEEE Transactions on Device and Materials Reliability
2018-06 | Journal article
DOI: 10.1109/tdmr.2018.2826557
Part of ISSN: 1530-4388
Part of ISSN: 1558-2574
Source: Self-asserted source
Zhiqiang Cheng

Impact of polyimide liner on high-aspect-ratio through-silicon-vias (TSVs): electrical characteristics and copper protrusion

Microsystem Technologies
2017 | Journal article
DOI: 10.1007/S00542-016-3243-2
WOSUID: WOS:000405924800066
Contributors: Wang, Shiwei; Yan, Yangyang; Cheng, Zhiqiang; Chen, Zhiming; Ding, Yingtao
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Low Cost Polyimide Liner Formation with Vacuum-assisted Spin Coating for Through-Silicon-Vias

IEEE International 3D Systems Integration Conference (3DIC)
2016 | Conference paper
DOI: 10.1109/3DIC.2016.7970040
WOSUID: WOS:000428196500048
Contributors: Yan, Yangyang; Zhang, Ziyue; Cheng, Zhiqiang; Zhou, Lingfeng; Chen, Zhiming; Ding, Yingtao
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