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Works (27)

Decoupling Optimization for Complex PDN Structures Using Deep Reinforcement Learning

IEEE Transactions on Microwave Theory and Techniques
2023 | Journal article
DOI: 10.1109/TMTT.2023.3248237
WOSUID: WOS:000947791200001
Contributors: Zhang, Ling; Jiang, Li; Juang, Jack; Yang, Zhiping; Li, Er-Ping; Hwang, Chulsoon
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Dynamic connection pruning for densely connected convolutional neural networks

Applied Intelligence
2023 | Journal article
DOI: 10.1007/S10489-023-04513-8
WOSUID: WOS:000945711200001
Contributors: Hu, Xinyi; Fang, Hangxiang; Zhang, Ling; Zhang, Xue; Yang, Howard H.; Yang, Dongxiao; Peng, Bo; Li, Zheyang; Hu, Haoji
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Parasitic Parameter Extraction for Calibration Standards Using an Optimization Strategy

IEEE Transactions on Microwave Theory and Techniques
2023 | Journal article
DOI: 10.1109/TMTT.2022.3221951
WOSUID: WOS:000890863400001
Contributors: Zhou, Jiefeng; Zhang, Ling; Chen, Junhui; Jiang, Li; Li, Da; Li, Yan; Chen, Hongsheng; Li, Er-Ping
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Ultra-Thin SSPP-Based Sheet for Suppressing Microwave Radiated Emission in SiP Modules

IEEE Transactions on Electromagnetic Compatibility
2023 | Journal article
DOI: 10.1109/TEMC.2022.3230057
WOSUID: WOS:000910578900001
Contributors: Xing, Jiaqi; Li, Da; Fan, Yudi; Liu, Gangzha; Lin, Xiaobin; Li, Ruifeng; Zhang, Ling; Chen, Hongsheng; Li, Er-Ping
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A Novel Physics-Assisted Genetic Algorithm(PAGA) for Decoupling Capacitor Optimization

2023-12-04 | Preprint | Author
DOI: 10.36227/techrxiv.24657798
SOURCE-WORK-ID:

24657798
Contributors: Li Jiang; Ling Zhang; Shurun Tan; Da Li; Chulsoon Hwang; jun fan; Erping Li
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A Neuro-Space Mapping Method for Harmonic Interference Prediction of SOIFET Radio Frequency Switches

IEEE Transactions on Electromagnetic Compatibility
2022 | Journal article
DOI: 10.1109/TEMC.2022.3170624
WOSUID: WOS:000802338700001
Contributors: Yang, Sichen; Zhou, Jiefeng; Wu, Chenghan; Chen, Xuan; Zhang, Ling; Li, Er-Ping
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A Novel Machine-Learning-Based Batch Selection Method in Sparse Near-Field Scanning

IEEE Transactions on Microwave Theory and Techniques
2022 | Journal article
DOI: 10.1109/TMTT.2022.3205909
WOSUID: WOS:000862350300001
Contributors: Zhang, Ling; Feng, Yu-Ru; Pu, Bo; Cai, Xiao-Ding; Li, Da; Wei, Xing-Chang; Mutnury, Bhyrav; Fan, Jun; Chen, Hongsheng; Drewniak, James L. et al.
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Analysis of Higher-Order Mode Effects in the Resistively Loaded Monocone TEM Cell

IEEE Transactions on Electromagnetic Compatibility
2022 | Journal article
DOI: 10.1109/TEMC.2022.3187834
WOSUID: WOS:000833064100001
Contributors: Gu, Yijie; Li, Da; Ma, Hanzhi; Li, Yan; Zhang, Ling; Li, Ruifeng; Jin, Ning; Hao, Ran; Li, Er-Ping
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Deep Learning Inverse Analysis of Higher Order Modes in Monocone TEM Cell

IEEE Transactions on Microwave Theory and Techniques
2022 | Journal article
DOI: 10.1109/TMTT.2022.3208009
WOSUID: WOS:000865080700001
Contributors: Li, Da; Gu, Yijie; Ma, Hanzhi; Li, Yan; Zhang, Ling; Li, Ruifeng; Hao, Ran; Li, Er-Ping
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Efficient Discharge Waveform Distribution Measurement Using Active Machine Learning

IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
2022 | Conference paper
DOI: 10.1109/EDAPS56906.2022.9995150
WOSUID: WOS:000927225900027
Contributors: Xie, Yuting; Zhang, Ling; Chen, Junhui; Li, Da; Yang, Zhenzhong; Ren, Dan; Li, Er-Ping
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Fast impedance prediction for power distribution network using deep learning

International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
2022 | Journal article
DOI: 10.1002/JNM.2956
WOSUID: WOS:000703319300001
Contributors: Zhang, Ling; Juang, Jack; Kiguradze, Zurab; Pu, Bo; Jin, Shuai; Wu, Songping; Yang, Zhiping; Fan, Jun; Hwang, Chulsoon
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Radio-Frequency Interference Estimation for Multiple Random Noise Sources

IEEE Transactions on Electromagnetic Compatibility
2022 | Journal article
DOI: 10.1109/TEMC.2021.3117845
WOSUID: WOS:000732705800001
Contributors: Zhang, Ling; Yang, Haochen; Su, Xiangrui; Huang, Qiaolei; Rajagopalan, Jagan; Pai, Deepak; Hwang, Chulsoon; Fan, Jun
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A Modified Genetic Algorithm for the Selection of Decoupling Capacitors in PDN Design

International Symposium on Electromagnetic Compatibility, Tokyo (emc/tokyo)
2021 | Journal article
DOI: 10.1109/EMC/SI/PI/EMCEUROPE52599.2021.9559292
WOSUID: WOS:000861536800160
Contributors: Juang, Jack; Zhang, Ling; Kiguradze, Zurab; Pu, Bo; Jin, Shuai; Hwang, Chulsoon
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A Novel RFI Mitigation Method Using Source Rotation

IEEE Transactions on Electromagnetic Compatibility
2021 | Journal article
DOI: 10.1109/TEMC.2020.2995828
WOSUID: WOS:000619507100002
Contributors: Huang, Qiaolei; Zhang, Ling; Rajagopalan, Jagan; Pai, Deepak; Chen, Chen; Gaikwad, Amit; Hwang, Chulsoon; Fan, Jun
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Auto Focus for Far Field Source Localization Using Emission Source Microscopy

International Symposium on Electromagnetic Compatibility, Tokyo (emc/tokyo)
2021 | Journal article
DOI: 10.1109/EMC/SI/PI/EMCEUROPE52599.2021.9559171
WOSUID: WOS:000861536800023
Contributors: Zhang, Ling; Yong, Shaohui; Liu, Yuanzhuo; Khilkevich, Victor
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An Enhanced Deep Reinforcement Learning Algorithm for Decoupling Capacitor Selection in Power Distribution Network Design

International Symposium on Electromagnetic Compatibility, Tokyo (emc/tokyo)
2020 | Journal article
WOSUID: WOS:000778941200051
Contributors: Zhang, Ling; Huang, Wenchang; Juang, Jack; Lin, Hank; Tseng, Bin-Chyi; Hwang, Chulsoon
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Deep Learning Based Poisson Solver in Particle Simulation of PN Junction with Transient ESD Excitation

International Symposium on Electromagnetic Compatibility, Tokyo (emc/tokyo)
2020 | Journal article
DOI: 10.1109/EMCSI38923.2020.9191640
WOSUID: WOS:000778941200050
Contributors: Zhang, Ling; Huang, Wenchang; Sun, Ze; Erickson, Nicholas; From, Ryan; Fan, Jun
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Passive Intermodulation Source Localization Based on Emission Source Microscopy

IEEE Transactions on Electromagnetic Compatibility
2020 | Journal article
DOI: 10.1109/TEMC.2019.2938634
WOSUID: WOS:000521967400029
Contributors: Yong, Shaohui; Yang, Sen; Zhang, Ling; Chen, Xiong; Pommerenke, David J.; Khilkevich, Victor
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Analysis of the Effect on Image Quality of Different Scanning Point Selection Methods in Sparse ESM

IEEE Transactions on Electromagnetic Compatibility
2019 | Journal article
DOI: 10.1109/TEMC.2018.2866361
WOSUID: WOS:000522641000015
Contributors: Sorensen, Morten; Kajbaf, Hamed; Khilkevich, Victor V.; Zhang, Ling; Pommerenke, David
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Decoupling Capacitor Selection Algorithm for PDN Based on Deep Reinforcement Learning

International Symposium on Electromagnetic Compatibility, Tokyo (emc/tokyo)
2019 | Journal article
DOI: 10.1109/ISEMC.2019.8825249
WOSUID: WOS:000589508600114
Contributors: Zhang, Ling; Zhang, Zhongyang; Huan, Chenxi; Deng, Han; Lin, Hank; Tseng, Bin-Chyi; Drewniak, James; Hwang, Chulsoon
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I-V Method Based PDN Impedance Measurement Technique and Associated Probe Design

International Symposium on Electromagnetic Compatibility, Tokyo (emc/tokyo)
2019 | Journal article
DOI: 10.1109/ISEMC.2019.8825297
WOSUID: WOS:000589508600007
Contributors: Zhu, Xiaolu; Zhang, Ling; Guo, Yuandong; Wei, Pengyu; Zai, Richard; Drewniak, James; Pommerenke, David
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Application of Deep Learning for High-speed Differential Via TDR Impedance Fast Prediction

IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)
2018 | Conference paper
WOSUID: WOS:000450192600249
Contributors: Xu, Jun; Zhang, Ling; Sapozhnikov, Mike; Fan, Jun
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EMI Radiation Mitigation for Heatsinks Using Characteristic Mode Analysis

IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)
2018 | Conference paper
DOI: 10.1109/EMCSI.2018.8495291
WOSUID: WOS:000450192600199
Contributors: Yang, Xiong; Cao, Ying S.; Wang, Xu; Zhang, Ling; He, Shiquan; Zhao, Huapeng; Hu, Jun; Jiang, Lijun; Ruehli, Albert; Fan, Jun et al.
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EMI Coupling Paths and Mitigation in Optical Transceiver Modules

IEEE Transactions on Electromagnetic Compatibility
2017 | Journal article
DOI: 10.1109/TEMC.2017.2697761
WOSUID: WOS:000408335300024
Contributors: Zhang, Ling; Li, Xiao; Jiao, Xiangyang; Li, Jing; Toor, Sukhjinder S.; Bhobe, Alpesh U.; Pommerenke, David J.; Drewniak, James L.
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Sparse Emission Source Microscopy for Rapid Emission Source Imaging

IEEE Transactions on Electromagnetic Compatibility
2017 | Journal article
DOI: 10.1109/TEMC.2016.2639526
WOSUID: INSPEC:16637080
Contributors: Ling Zhang; Khilkevich, V.V.; Xiangyang Jiao; Xiao Li; Toor, S.; Bhobe, A.U.; Kyoungchoul Koo; Pommerenke, D.; Drewniak, J.L.
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Worst Case Prediction of Shielding Effectiveness of Board Level Shields

IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)
2017 | Conference paper
WOSUID: WOS:000428753300272
Contributors: He, Ruijie; Khilkevich, Victor; Zhang, Ling; Khorrami, Mohammad Ali; Dixon, Paul; Arien, Yoeri
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EMI Coupling Paths in Silicon Optical Sub-assembly Package

International Symposium on Electromagnetic Compatibility, Tokyo (emc/tokyo)
2016 | Journal article
DOI: 10.1109/ISEMC.2016.7571768
WOSUID: WOS:000387117700182
Contributors: Li, Jing; Li, Xiao; Jiao, Xiangyang; Toor, Sukhjinder; Zhang, Ling; Bhobe, Alpesh; Drewniak, James; Pommerenke, David
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Peer review (50 reviews for 9 publications/grants)

Review activity for Antennas and wireless propagation letters. (4)
Review activity for Electronics. (1)
Review activity for IEEE access : (12)
Review activity for IEEE transactions on electromagnetic compatibility. (16)
Review activity for IEEE transactions on microwave theory and techniques. (6)
Review activity for International journal of numerical modelling (7)
Review activity for Journal of physics. (2)
Review activity for Micromachines. (1)
Review activity for Sensors. (1)
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