Personal information

Activities

Employment (1)

The Hashemite university: zarqa, Zarqa, JO

2020-01-17 to present | assistant professor (Industrial engineering )
Employment
Source: Self-asserted source
Raed Alathamneh

Education and qualifications (4)

Auburn University: Auburn, Alabama, US

2016-01-01 to 2020-01-01 | PhD (Industrial and systems engineering )
Education
Source: Self-asserted source
Raed Alathamneh

Auburn University: Auburn, Alabama, US

2016-01-01 to 2018-01-01 | Master (Industrial and systems engineering )
Education
Source: Self-asserted source
Raed Alathamneh

University of Jordan: Amman, amman, JO

2013-08-01 to 2015-08-01 | Master (Industrial engineering )
Education
Source: Self-asserted source
Raed Alathamneh

Jordan University of Science and Technology: Irbid, Irbid, JO

2004-08-01 to 2009-06-01 | Bachelor (Industrial engineering )
Education
Source: Self-asserted source
Raed Alathamneh

Works (12)

A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria Optimization

Journal of Microelectronics and Electronic Packaging
2022 | Journal article
EID:

2-s2.0-85129040288

Part of ISSN: 15514897
Contributors: Al Athamneh, R.; Akkara, F.; Hamasha, S.
Source: Self-asserted source
Raed Alathamneh via Scopus - Elsevier

Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints

IEEE Transactions on Device and Materials Reliability
2022 | Journal article
EID:

2-s2.0-85127526007

Part of ISSN: 15582574 15304388
Contributors: Hani, D.B.; Al Athamneh, R.; Hamasha, S.
Source: Self-asserted source
Raed Alathamneh via Scopus - Elsevier

Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions

Crystals
2022 | Journal article
EID:

2-s2.0-85131506857

Part of ISSN: 20734352
Contributors: Athamneh, R.A.; Abueed, M.; Hani, D.B.; Hamasha, S.
Source: Self-asserted source
Raed Alathamneh via Scopus - Elsevier

Modeling the Effect of Magnesium Content on the Electrical Conductivity and Hardness of Technical Aluminum (1050) Alloy

Crystals
2022 | Journal article
EID:

2-s2.0-85128330751

Part of ISSN: 20734352
Contributors: Hani, D.B.; Athamneh, R.A.; Albataineh, Z.; Rawashdeh, M.; Makableh, I.
Source: Self-asserted source
Raed Alathamneh via Scopus - Elsevier

A PDCA Framework towards a Multi-Response Optimization of Process Parameters Based on Taguchi-Fuzzy Model

Processes
2022-09 | Journal article | Author
Contributors: Moayad Tanash; Raed Alathamneh; dania bani hani; Mumen Rababah; Zaid Albataineh
Source: check_circle
Multidisciplinary Digital Publishing Institute

The Reliability of SAC305 Individual Solder Joints during Creep–Fatigue Conditions at Room Temperature

Crystals
2022-09 | Journal article | Author
Contributors: Mohammed Abueed; Raed Alathamneh; Moayad Tanash; Sa'd Hamasha
Source: check_circle
Multidisciplinary Digital Publishing Institute

Shear strength degradation modeling of lead-free solder joints at different isothermal aging conditions

Journal of Microelectronics and Electronic Packaging
2021 | Journal article
EID:

2-s2.0-85115229196

Part of ISSN: 15514897
Contributors: Hani, D.B.; Al Athamneh, R.; Aljarrah, M.; Hamasha, S.
Source: Self-asserted source
Raed Alathamneh via Scopus - Elsevier

Fatigue Behavior of SAC-Bi and SAC305 Solder Joints with Aging

IEEE Transactions on Components, Packaging and Manufacturing Technology
2020 | Journal article
EID:

2-s2.0-85082992296

Part of ISSN: 21563985 21563950
Contributors: Al Athamneh, R.; Hamasha, S.
Source: Self-asserted source
Raed Alathamneh via Scopus - Elsevier

Fatigue Life Degradation Modeling of SnAgCu Solder Joints after Aging

IEEE Transactions on Components, Packaging and Manufacturing Technology
2020 | Journal article
EID:

2-s2.0-85088520237

Part of ISSN: 21563985 21563950
Contributors: Athamneh, R.A.; Hani, D.B.; Ali, H.; Hamasha, S.
Source: Self-asserted source
Raed Alathamneh via Scopus - Elsevier

Reliability modeling for aged SAC305 solder joints cycled in accelerated shear fatigue test

Microelectronics Reliability
2020 | Journal article
EID:

2-s2.0-85074701715

Part of ISSN: 00262714
Contributors: Al Athamneh, R.; Hani, D.B.; Ali, H.; Hamasha, S.
Source: Self-asserted source
Raed Alathamneh via Scopus - Elsevier

Effect of aging on the fatigue life and shear strength of SAC305 solder joints in actual setting conditions

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
2019 | Conference paper
EID:

2-s2.0-85073911934

Part of ISSN: 19363958
Contributors: Athamneh, R.A.; Abueed, M.; Hani, D.B.; Su, S.; Hamasha, S.; Suhling, J.; Lall, P.
Source: Self-asserted source
Raed Alathamneh via Scopus - Elsevier

Fuzzy neural network approach to optimizing process performance by using multiple responses

Journal of Ambient Intelligence and Humanized Computing
2016 | Journal article
EID:

2-s2.0-84991384390

Part of ISSN: 18685145 18685137
Contributors: Al-Refaie, A.; Chen, T.; Al-Athamneh, R.; Wu, H.-C.
Source: Self-asserted source
Raed Alathamneh via Scopus - Elsevier