Personal information
Activities
Employment (1)
2020-01-17
to
present
|
assistant professor
(Industrial engineering )
Employment
Source:
Raed Alathamneh
Education and qualifications (4)
2016-01-01
to
2020-01-01
|
PhD
(Industrial and systems engineering )
Education
Source:
Raed Alathamneh
2016-01-01
to
2018-01-01
|
Master
(Industrial and systems engineering )
Education
Source:
Raed Alathamneh
2013-08-01
to
2015-08-01
|
Master
(Industrial engineering )
Education
Source:
Raed Alathamneh
2004-08-01
to
2009-06-01
|
Bachelor
(Industrial engineering )
Education
Source:
Raed Alathamneh
Works (12)
Journal of Microelectronics and Electronic Packaging
2022
|
Journal article
EID:
2-s2.0-85129040288
Contributors:
Al Athamneh, R.;
Akkara, F.;
Hamasha, S.
Source:
Raed Alathamneh
via
Scopus - Elsevier
IEEE Transactions on Device and Materials Reliability
2022
|
Journal article
EID:
2-s2.0-85127526007
Contributors:
Hani, D.B.;
Al Athamneh, R.;
Hamasha, S.
Source:
Raed Alathamneh
via
Scopus - Elsevier
Crystals
2022
|
Journal article
EID:
2-s2.0-85131506857
Contributors:
Athamneh, R.A.;
Abueed, M.;
Hani, D.B.;
Hamasha, S.
Source:
Raed Alathamneh
via
Scopus - Elsevier
Crystals
2022
|
Journal article
EID:
2-s2.0-85128330751
Contributors:
Hani, D.B.;
Athamneh, R.A.;
Albataineh, Z.;
Rawashdeh, M.;
Makableh, I.
Source:
Raed Alathamneh
via
Scopus - Elsevier
Processes
2022-09
|
Journal article
|
Author
Contributors:
Moayad Tanash;
Raed Alathamneh;
dania bani hani;
Mumen Rababah;
Zaid Albataineh
Source:
check_circle
Multidisciplinary Digital Publishing Institute
Crystals
2022-09
|
Journal article
|
Author
Contributors:
Mohammed Abueed;
Raed Alathamneh;
Moayad Tanash;
Sa'd Hamasha
Source:
check_circle
Multidisciplinary Digital Publishing Institute
Journal of Microelectronics and Electronic Packaging
2021
|
Journal article
EID:
2-s2.0-85115229196
Contributors:
Hani, D.B.;
Al Athamneh, R.;
Aljarrah, M.;
Hamasha, S.
Source:
Raed Alathamneh
via
Scopus - Elsevier
IEEE Transactions on Components, Packaging and Manufacturing Technology
2020
|
Journal article
EID:
2-s2.0-85082992296
Contributors:
Al Athamneh, R.;
Hamasha, S.
Source:
Raed Alathamneh
via
Scopus - Elsevier
IEEE Transactions on Components, Packaging and Manufacturing Technology
2020
|
Journal article
EID:
2-s2.0-85088520237
Contributors:
Athamneh, R.A.;
Hani, D.B.;
Ali, H.;
Hamasha, S.
Source:
Raed Alathamneh
via
Scopus - Elsevier
Microelectronics Reliability
2020
|
Journal article
EID:
2-s2.0-85074701715
Contributors:
Al Athamneh, R.;
Hani, D.B.;
Ali, H.;
Hamasha, S.
Source:
Raed Alathamneh
via
Scopus - Elsevier
InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
2019
|
Conference paper
EID:
2-s2.0-85073911934
Contributors:
Athamneh, R.A.;
Abueed, M.;
Hani, D.B.;
Su, S.;
Hamasha, S.;
Suhling, J.;
Lall, P.
Source:
Raed Alathamneh
via
Scopus - Elsevier
Journal of Ambient Intelligence and Humanized Computing
2016
|
Journal article
EID:
2-s2.0-84991384390
Contributors:
Al-Refaie, A.;
Chen, T.;
Al-Athamneh, R.;
Wu, H.-C.
Source:
Raed Alathamneh
via
Scopus - Elsevier