Personal information

Other IDs

Scopus Author ID: 55001771800

Keywords

Micro-electro-mechanical-systems (MEMS), Bulk acoustic wave (BAW), Micro/nanofabrication, RF MEMS, Non-reciprocal devices, Spintronics

Countries

United States

Activities

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Employment (5)

Google (United States): Santa Barbara, California, US

2023-06-26 to present | Hardware Engineer (Quantum AI)
Employment
Source: Self-asserted source
Mustafa Mert Torunbalci

Broadcom (United States): San Jose, California, US

2020-08-24 to 2023-06-26 | RnD hardware engineer (Wireless Semiconductor Division)
Employment
Source: Self-asserted source
Mustafa Mert Torunbalci

Microsoft Quantum Purdue: West Lafayette, IN, US

2020-01-01 to 2021-08-23 | Quantum device researcher
Employment
Source: Self-asserted source
Mustafa Mert Torunbalci

Purdue University: West Lafayette, IN, US

2015-09-20 to 2020-01-01 | Senior Research Associate (School of Electrical and Computer Engineering)
Employment
Source: Self-asserted source
Mustafa Mert Torunbalci

Middle East Technical University-MEMS Center: Ankara, Ankara, TR

2008-07-15 to 2015-09-19 | Researcher
Employment
Source: Self-asserted source
Mustafa Mert Torunbalci

Education and qualifications (1)

Middle East Technical University: Ankara, Ankara, TR

2011-02-14 to 2015-02-14 | Ph.D. (Micro and Nanotechnology)
Education
Source: Self-asserted source
Mustafa Mert Torunbalci

Professional activities (1)

IEEE Sensors Journal: New York, NY, US

2021-08-15 to present | Associate Editor
Service
Source: Self-asserted source
Mustafa Mert Torunbalci

Works (31)

On Extending Signal-to-Noise Ratio of Resonators for a MEMS Resonant Accelerometers Using Nonlinearity Compensation

Journal of Microelectromechanical Systems
2024 | Journal article
DOI: 10.1109/JMEMS.2024.3443641
Contributors: Chengxin Li; Aojie Quan; Hemin Zhang; Chen Wang; Linlin Wang; Mustafa Mert Torunbalci; Yuan Wang; Michael Kraft
Source: check_circle
Crossref

An All-Silicon Process Platform for Wafer-Level Vacuum Packaged MEMS Devices

IEEE Sensors Journal
2021 | Journal article
DOI: 10.1109/JSEN.2021.3073928
EID:

2-s2.0-85104583056

Part of ISSN: 15581748 1530437X
Contributors: Torunbalci, M.M.; Gavcar, H.D.; Yesil, F.; Alper, S.E.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier
grade
Preferred source (of 2)‎

Deep isotropic chemical etching (DICE) process for fabricating highly symmetric hemispherical silicon molds

Journal of Micromechanics and Microengineering
2021-07-01 | Journal article
DOI: 10.1088/1361-6439/ac0323
Contributors: Calvin Mitchell Jones; Mustafa Mert Torunbalci; Sunil Ashok Bhave
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Engineering new limits to magnetostriction through metastability in iron-gallium alloys

Nature Communications
2021-05-12 | Journal article
DOI: 10.1038/s41467-021-22793-x
Contributors: P. B. Meisenheimer; R. A. Steinhardt; S. H. Sung; L. D. Williams; S. Zhuang; M. E. Nowakowski; S. Novakov; M. M. Torunbalci; B. Prasad; C. J. Zollner et al.
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Double-Free-Layer Magnetic Tunnel Junctions for Probabilistic Bits

Physical Review Applied
2021-04-29 | Journal article
DOI: 10.1103/PhysRevApplied.15.044049
Contributors: Kerem Y. Camsari; Mustafa Mert Torunbalci; William A. Borders; Hideo Ohno; Shunsuke Fukami
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

Double free-layer magnetic tunnel junctions for probabilistic bits

arXiv
2020 | Other
EID:

2-s2.0-85100282391

Part of ISSN: 23318422
Contributors: Camsari, K.Y.; Torunbalci, M.M.; Borders, W.A.; Ohno, H.; Fukami, S.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Mechanical Tuning of Magnetic Anisotropy

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2020 | Conference paper
DOI: 10.1109/MEMS46641.2020.9056417
EID:

2-s2.0-85083214196

Part of ISSN: 10846999
Contributors: Torunbalci, M.M.; Bhave, S.A.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Mechanically modulated microwave circulator

arXiv
2019 | Other
EID:

2-s2.0-85094759904

Part of ISSN: 23318422
Contributors: Torunbalci, M.M.; Sridaran, S.; Ruby, R.C.; Bhave, S.A.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Mechanically Modulated Microwave Circulator

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
2019 | Conference paper
DOI: 10.1109/TRANSDUCERS.2019.8808670
EID:

2-s2.0-85071917198
Contributors: Torunbalci, M.M.; Sridaran, S.; Ruby, R.C.; Bhave, S.A.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Acceleration insensitive hemispherical shell resonators using pop-up rings

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2018 | Conference paper
DOI: 10.1109/MEMSYS.2018.8346716
EID:

2-s2.0-85047000671

Part of ISSN: 10846999
Contributors: Torunbalci, M.M.; Dai, S.; Bhat, A.; Bhave, S.A.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Magneto Acoustic Spin Hall Oscillators

Scientific Reports
2018 | Journal article
DOI: 10.1038/s41598-018-19443-6
EID:

2-s2.0-85040763620

Part of ISSN: 20452322
Contributors: Torunbalci, M.M.; Gosavi, T.A.; Camsari, K.Y.; Bhave, S.A.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Modular compact modeling of magnetic tunnel junction devices

arXiv
2018 | Other
EID:

2-s2.0-85093234640

Part of ISSN: 23318422
Contributors: Torunbalci, M.M.; Upadhyaya, P.; Bhave, S.A.; Camsari, K.Y.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Modular Compact Modeling of MTJ Devices

IEEE Transactions on Electron Devices
2018-10 | Journal article
DOI: 10.1109/TED.2018.2863538
Contributors: Mustafa Mert Torunbalci; Pramey Upadhyaya; Sunil A. Bhave; Kerem Y. Camsari
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

An FBAR Circulator

IEEE Microwave and Wireless Components Letters
2018-05 | Journal article
DOI: 10.1109/LMWC.2018.2815271
Contributors: Mustafa Mert Torunbalci; Trevor J. Odelberg; Suresh Sridaran; Richard C. Ruby; Sunil A. Bhave
Source: check_circle
Crossref
grade
Preferred source (of 2)‎

A novel method for fabricating MEMS three-axis accelerometers using low temperature Au-Sn eutectic bonding

Proceedings of IEEE Sensors
2017 | Conference paper
DOI: 10.1109/ICSENS.2016.7808705
EID:

2-s2.0-85010952794

Part of ISSN: 21689229 19300395
Contributors: Tez, S.; Torunbalci, M.M.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

An FBAR circulator

arXiv
2017 | Other
EID:

2-s2.0-85092982261

Part of ISSN: 23318422
Contributors: Torunbalci, M.M.; Odelberg, T.J.; Sridaran, S.; Ruby, R.C.; Bhave, S.A.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Magneto acoustic spin hall oscillators

arXiv
2017 | Other
EID:

2-s2.0-85093289619

Part of ISSN: 23318422
Contributors: Torunbalci, M.M.; Gosavi, T.A.; Camsari, K.Y.; Bhave, S.A.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

MESH Nano-Oscillator: All electrical doubly tunable spintronic oscillator

Device Research Conference - Conference Digest, DRC
2016 | Conference paper
DOI: 10.1109/DRC.2016.7548441
EID:

2-s2.0-84987752559

Part of ISSN: 15483770
Contributors: Ganguly, S.; Torunbalci, M.M.; Bhave, S.A.; Camsari, K.Y.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

A Bulk-Micromachined Three-Axis Capacitive MEMS Accelerometer on a Single Die

Journal of Microelectromechanical Systems
2015 | Journal article
DOI: 10.1109/JMEMS.2015.2451079
EID:

2-s2.0-84959522520

Part of ISSN: 10577157
Contributors: Tez, S.; Aykutlu, U.; Torunbalci, M.M.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process

Journal of Micromechanics and Microengineering
2015 | Journal article
DOI: 10.1088/0960-1317/25/12/125030
EID:

2-s2.0-84948845281

Part of ISSN: 13616439 09601317
Contributors: Torunbalci, M.M.; Alper, S.E.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

A novel fabrication and wafer level hermetic sealing method for SOI-MEMS devices using SOI cap wafers

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2015 | Conference paper
DOI: 10.1109/MEMSYS.2015.7050976
EID:

2-s2.0-84931098017

Part of ISSN: 10846999
Contributors: Torunbalci, M.M.; Alper, S.E.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Advanced MEMS process for wafer level hermetic encapsulation of MEMS devices using SOI cap wafers with vertical feedthroughs

Journal of Microelectromechanical Systems
2015 | Journal article
DOI: 10.1109/JMEMS.2015.2406341
EID:

2-s2.0-85027918284

Part of ISSN: 10577157
Contributors: Torunbalci, M.M.; Alper, S.E.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Die size reduction by optimizing the dimensions of the vertical feedthrough pitch and sealing area in the advanced MEMS (aMEMS) process

2nd IEEE International Symposium on Inertial Sensors and Systems, IEEE ISISS 2015 - Proceedings
2015 | Conference paper
DOI: 10.1109/ISISS.2015.7102380
EID:

2-s2.0-84937135580
Contributors: Torunbalci, M.M.; Alper, S.E.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

The advanced MEMS (aMEMS) process for fabricating wafer level vacuum packaged SOI-MEMS devices with embedded vertical feedthroughs

2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
2015 | Conference paper
DOI: 10.1109/TRANSDUCERS.2015.7180963
EID:

2-s2.0-84955465839
Contributors: Torunbalci, M.M.; Alper, S.E.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding

Sensors and Actuators, A: Physical
2015 | Journal article
DOI: 10.1016/j.sna.2015.01.034
EID:

2-s2.0-84924308888

Part of ISSN: 09244247
Contributors: Torunbalci, M.M.; Alper, S.E.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

A method of fabricating vacuum packages with vertical feedthroughs in a wafer level anodic bonding process

Procedia Engineering
2014 | Conference paper
DOI: 10.1016/j.proeng.2014.11.297
EID:

2-s2.0-84923370491

Part of ISSN: 18777058
Contributors: Torunbalci, M.M.; Alper, S.E.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Fabrication and characterization of gold-tin eutectic bonding for hermetic packaging of MEMS devices

Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
2014 | Conference paper
DOI: 10.1109/EPTC.2014.7028329
EID:

2-s2.0-84946688126
Contributors: Demir, E.C.; Torunbalci, M.M.; Donmez, I.; Kalay, Y.E.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Gold-tin eutectic bonding for hermetic packaging of MEMS devices with vertical feedthroughs

Proceedings of IEEE Sensors
2014 | Conference paper
DOI: 10.1109/ICSENS.2014.6985473
EID:

2-s2.0-84931061958

Part of ISSN: 21689229 19300395
Contributors: Torunbalci, M.M.; Demir, E.C.; Donmez, I.; Alper, S.E.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Wafer level hermetic encapsulation of MEMS inertial sensors using SOI cap wafers with vertical feedthroughs

1st IEEE International Symposium on Inertial Sensors and Systems, ISISS 2014 - Proceedings
2014 | Conference paper
DOI: 10.1109/ISISS.2014.6782539
EID:

2-s2.0-84899080176
Contributors: Mert Torunbalci, M.; Alper, S.E.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

A method and electrical model for the anodic bonding of SOI and glass wafers

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2012 | Conference paper
DOI: 10.1109/MEMSYS.2012.6170095
EID:

2-s2.0-84860442654

Part of ISSN: 10846999
Contributors: Tatar, E.; Torunbalci, M.M.; Alper, S.E.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier

Comparison of two alternative silicon-on-glass microfabrication processes for MEMS inertial sensors

Procedia Engineering
2011 | Conference paper
DOI: 10.1016/j.proeng.2011.12.221
EID:

2-s2.0-84857169676

Part of ISSN: 18777058
Contributors: Torunbalci, M.M.; Tatar, E.; Alper, S.E.; Akin, T.
Source: Self-asserted source
Mustafa Mert Torunbalci via Scopus - Elsevier
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